JPH0378184A - Memory card - Google Patents
Memory cardInfo
- Publication number
- JPH0378184A JPH0378184A JP1213368A JP21336889A JPH0378184A JP H0378184 A JPH0378184 A JP H0378184A JP 1213368 A JP1213368 A JP 1213368A JP 21336889 A JP21336889 A JP 21336889A JP H0378184 A JPH0378184 A JP H0378184A
- Authority
- JP
- Japan
- Prior art keywords
- card connector
- case
- card
- resin case
- memory card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006355 external stress Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、例えば、ワードプロセッサ等の０人機器の外
部メモリとして使用されるメモリカードに関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a memory card used as an external memory for zero-person equipment, such as a word processor.
従来の技術
近年、数有る記憶媒体の中で、高速アクセスが可能であ
り、低消費電力設計を容易にし、機器本体の小形軽量化
・パーソナル化に適合し、さらにはそれ自体の耐環境性
が他の記憶媒体に比べ優れている等の理由から、マイク
ロコンピュータを内蔵した電子機器への利用が急激に増
加しているのがメモリカードである。その利用分野もワ
ードプロセッサ、プリンタ等の０人機器を初めとし、２
人（ファクトリオートメーション）、ＳＡ（セールスオ
ートメーション）９通信、家電、自動車に至る寸で非常
に多岐て亘り、機器の外部メモリ。Conventional technology In recent years, among the many types of storage media, there has been a rise in the number of storage media that enable high-speed access, facilitate low power consumption designs, are compatible with the miniaturization, weight reduction, and personalization of equipment bodies, and are more environmentally resistant. Memory cards are rapidly being used in electronic devices with built-in microcomputers because of their superiority over other storage media. Its application fields include zero-person equipment such as word processors and printers, and
External memory for devices is extremely diverse, ranging from people (factory automation) to SA (sales automation)9 communications, home appliances, and automobiles.
フロッピーディスクとの代替等として使用されている。It is used as an alternative to floppy disks.
同時に、利用分野・使用方法の多種多様性が増すにつれ
前述したメモリカード自体の耐湿度・耐荷重・耐屈曲・
耐静電気等の環境要因て対する信頼性についても、より
厳しい条件が要求され、特にカード構造の点で改善が余
儀なくされる、というのが実情である。At the same time, as the variety of application fields and usage methods increases, the moisture resistance, load resistance, bending resistance, and
The reality is that even stricter conditions are required with respect to reliability against environmental factors such as resistance to static electricity, and improvements are inevitable, especially in terms of card structure.
従来、この種のメモリカードはツーピース形のメモリカ
ードが主流であり、その構成も第４図に示すものが一般
的であった。以下、第４図を参照しながらその構造につ
いて説明する。Conventionally, the mainstream of this type of memory card has been a two-piece memory card, and its configuration has generally been as shown in FIG. 4. The structure will be explained below with reference to FIG.
第４図において、１１は半導体メモリＩＣ及び周辺部品
を搭載したプリント配線板、１・５はカードコネクタ、
１６は樹脂ケース、１３２Ｌ、１３ｂは金属銘板、１４
は前記２枚の金属銘板を導通状態にするための導体バネ
である。前記プリント配線板１１は、カードコネクタ１
５がら露出している複数の端子を半田付は接続し、モジ
エールにした後、樹脂ケース１６に導体バネ１４ととも
に納め、表裏両側から金属銘板１３２Ｌ、１３ｂでサン
ドウィッチ状にはさみ、加圧・加熱接着等によりカード
構造にする。In Fig. 4, 11 is a printed wiring board on which a semiconductor memory IC and peripheral components are mounted, 1 and 5 are card connectors,
16 is a resin case, 132L, 13b is a metal nameplate, 14
is a conductor spring for bringing the two metal nameplates into a conductive state. The printed wiring board 11 includes a card connector 1
After soldering and connecting the multiple terminals exposed through 5 to make a mosier, it is placed in a resin case 16 together with a conductor spring 14, sandwiched between metal name plates 132L and 13b from both front and back sides, and bonded under pressure and heat. etc. to create a card structure.
以上の構造からもわかる様に、従来のカードコネクタ１
５と樹脂ケース１６とが分離しているツーピース形のメ
モリカードでは、メモリカードを構成する樹脂ケース１
６とプリント配線板１１が半田付は接続されているカー
ドコネクタは全く孤立しており、それらを接着等の２次
的な手段により固定していた。As you can see from the above structure, the conventional card connector 1
In a two-piece memory card in which the resin case 1 and the resin case 16 are separate, the resin case 1 that constitutes the memory card
The card connector to which the card connector 6 and the printed wiring board 11 are connected by soldering is completely isolated, and they are fixed by secondary means such as adhesive.
本発明が解決しようとする課題
しかしながら前述のような方法では、樹脂ケー７１６と
カードコネクタ１５とが固定されている部分に荷重・屈
曲あるいは高温放置・低温放置等により外的なストレス
が加わると、使用している接着剤等の固定方法に依存す
るため、メモリカード内の他の機構部だ比べその機械的
な強度には限界があった。Problems to be Solved by the Present Invention However, in the method described above, if external stress is applied to the part where the resin case 716 and the card connector 15 are fixed due to load, bending, or being left at high temperatures or low temperatures, Because it depends on the fixing method, such as the adhesive used, its mechanical strength is limited compared to other mechanical parts within the memory card.
本発明は前述の欠点に鑑み、環境上の要因によりメモリ
カードの信頼性を著しく損ねる構造を改善することを目
的とする。SUMMARY OF THE INVENTION In view of the above-mentioned drawbacks, the present invention aims to improve a structure that significantly impairs the reliability of memory cards due to environmental factors.
課題を解決するための手段
この課題を解決するだめに、本発明のメモリカードは樹
脂ケースとツーピース形のカードコネクタとを一体化し
て成型したケース一体型カードコネクタと、ケース一体
型カードコネクタの複数の端子を半田付けする半導体メ
モリＩＣ及び周辺部品を搭載したプリント配線板と、そ
れらを表裏両側からサンドウィッチ状にはさむ金属銘板
と、表裏金属銘板を導通状態にするための導体バネから
構成されている。Means for Solving the Problem In order to solve this problem, the memory card of the present invention includes a case-integrated card connector formed by integrally molding a resin case and a two-piece card connector, and a plurality of case-integrated card connectors. It consists of a printed wiring board mounted with a semiconductor memory IC and peripheral components to which the terminals are soldered, a metal nameplate sandwiching them from both the front and back sides, and a conductive spring to bring the front and back metal nameplates into a conductive state. .
作用
この構成により、本発明のメモリカードは樹脂ケースと
カードコネクタとの固定方法に対する考慮を必要とせず
、機械的或いは熱的ストレスに対してより信頼度の高い
外部記憶媒体を実現することとなる。Effect: With this configuration, the memory card of the present invention does not require consideration of the method of fixing the resin case and the card connector, and realizes an external storage medium that is more reliable against mechanical or thermal stress. .
実施例
以下本発明の一実施例について図面を参照しながら説明
して行く。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示すメモリカードの構造図
である。FIG. 1 is a structural diagram of a memory card showing one embodiment of the present invention.
第１図において、１は半導体メモリＩＣ及び周辺部品を
搭載したプリント配線板、２はケース−体型カードコネ
クタ、３２Ｌ、３ｂは金属銘板、４は導体バネである。In FIG. 1, 1 is a printed wiring board on which a semiconductor memory IC and peripheral components are mounted, 2 is a case-type card connector, 32L and 3b are metal name plates, and 4 is a conductive spring.
前記プリント配線板１は、そこてあらかじめ設けられた
複数の接続端子部と、樹脂ケース及びカードコネクタを
一体構造にして成形されたケース一体型カードコネクタ
２から露出している複数の端子とを半田付は等の方法に
よりケース一体型カードコネクタ２に接続・設置される
。その後、導体バネ４を納め、表裏両側から金属銘板３
でサンドウィッチ状にはさみ、加圧・加熱接着１等によ
りカード構造となる。The printed wiring board 1 is constructed by soldering a plurality of connection terminal portions provided therein in advance and a plurality of terminals exposed from a case-integrated card connector 2 formed by integrally forming a resin case and a card connector. The connector is connected and installed to the case-integrated card connector 2 by the following methods. After that, put the conductor spring 4 in place, and attach the metal name plate 3 from both the front and back sides.
Then, it is sandwiched with scissors, and a card structure is created by applying pressure and heat bonding.
第２図は、第１図に示しだ構造により作製された本発明
の一実施例を示すメモリカードの外観図であり、第３図
は第２図のＡ−Ａ断面図である。FIG. 2 is an external view of a memory card showing an embodiment of the present invention manufactured with the structure shown in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line AA in FIG.
第２図及び第３図において、Ａ−入断面図かられかる様
に、樹脂ケースとカードコネクタが一体構造となってい
るため両者の間で分離する箇所がなく、又金属銘板３と
ケース一体型カードコネクタ２との加圧・加熱接着等が
安定して行われることを可能にしている。In Figures 2 and 3, as can be seen from the A-cross sectional view, the resin case and card connector have an integral structure, so there is no separation between them, and the metal nameplate 3 and the case are integrated. This makes it possible to stably perform pressurization, heat bonding, etc. with the body type card connector 2.
一方、第５図は第４図に示した構造により作製された従
来のメモリカードの外観図であり、第６図は第５図のＢ
−Ｂ断面図である。On the other hand, FIG. 5 is an external view of a conventional memory card manufactured with the structure shown in FIG. 4, and FIG.
-B sectional view.
第５図及び第６図において、例えばメモリカード外部か
らの屈曲等による方向ａなる力が加わったり、熱的スト
レス等だよる方向すなる力が加わると、樹脂ケース１６
とカードコネクタ１６が各々単独に存在するため、たと
え接着等により固定しても、その機械的な強度には限界
がある。又、４ｆｔ！ケース１６やカードコネクタ１６
自体の寸法的なばらつきにより、これら接続部に間隙が
発生し、メモリカードの構造上欠陥につながることは回
避できない問題点である。In FIGS. 5 and 6, when a force in the direction a is applied due to bending from the outside of the memory card, or a force in the direction a due to thermal stress or the like is applied, the resin case 16
Since the card connector 16 and the card connector 16 each exist independently, there is a limit to their mechanical strength even if they are fixed by adhesive or the like. Also, 4ft! Case 16 and card connector 16
It is an unavoidable problem that gaps occur in these connection parts due to dimensional variations in the memory card itself, leading to structural defects in the memory card.
しかしながら本発明のメモリカードは前述のとおり、ケ
ース一体型カードコネクタを有しており、分離箇所が存
在しないため、外的なストレスに対して堅牢な構造とな
り、ばらつき等の不安定な要因に影響されない。However, as mentioned above, the memory card of the present invention has a case-integrated card connector and there is no separation point, so it has a structure that is robust against external stress and is susceptible to unstable factors such as variations. Not done.
発明の効果
以上の様に本発明は、従来樹脂ケースとカードコネクタ
を分離していたのを一体化することで、より厳しい環境
下での使用に耐え得る構造となり、さらに、特別な設計
基準や加工方法を必要としないため簡略化された生産工
程が可能となり、その効果は大なるものがある。In addition to the effects of the invention, the present invention integrates the resin case and card connector, which were previously separated, to create a structure that can withstand use in harsher environments. Since no processing method is required, a simplified production process is possible, which has great effects.
第１図は本発明のメモリカードの分解斜視図、第２図は
同カードの組立斜視図、第３図は第２図のムーム断面図
、第４図は従来例のメモリカードの分解斜視図、第６図
は同カードの組立斜視図、第６図は第５図のＢ−Ｂ断面
図である。
１・・・・・・プリント配線板、２・・・・・ケース一
体型カードコネクタ、３１Ｌ、３ｂ・・・・・・金属銘
板、４・・・・・・導体バネ。Fig. 1 is an exploded perspective view of a memory card of the present invention, Fig. 2 is an assembled perspective view of the same card, Fig. 3 is a sectional view of the Moom of Fig. 2, and Fig. 4 is an exploded perspective view of a conventional memory card. , FIG. 6 is an assembled perspective view of the same card, and FIG. 6 is a sectional view taken along the line BB in FIG. 5. 1...Printed wiring board, 2...Case integrated card connector, 31L, 3b...Metal name plate, 4...Conductor spring.
Claims (1)
を一体構造としたケース一体型カードコネクタに半導体
メモリＩＣ及び周辺部品を搭載したプリント配線板を取
り付けたことを特徴とするメモリカード。A memory card characterized in that a printed wiring board mounted with a semiconductor memory IC and peripheral components is attached to a case-integrated card connector that has an integrated structure of a card connector for insertion into a device and a resin case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1213368A JPH0378184A (en) | 1989-08-18 | 1989-08-18 | Memory card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1213368A JPH0378184A (en) | 1989-08-18 | 1989-08-18 | Memory card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0378184A true JPH0378184A (en) | 1991-04-03 |
Family
ID=16638028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1213368A Pending JPH0378184A (en) | 1989-08-18 | 1989-08-18 | Memory card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0378184A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0770972A2 (en) | 1995-10-25 | 1997-05-02 | Japan Aviation Electronics Industry, Limited | PC card comprising a frame into which one of back connectors is selectively integrated at a rear end thereof |
-
1989
- 1989-08-18 JP JP1213368A patent/JPH0378184A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0770972A2 (en) | 1995-10-25 | 1997-05-02 | Japan Aviation Electronics Industry, Limited | PC card comprising a frame into which one of back connectors is selectively integrated at a rear end thereof |
| EP0770972A3 (en) * | 1995-10-25 | 1997-06-11 | Japan Aviation Electronics Industry, Limited | PC card comprising a frame into which one of back connectors is selectively integrated at a rear end thereof |
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