JPH0341937U - - Google Patents
Info
- Publication number
- JPH0341937U JPH0341937U JP10231689U JP10231689U JPH0341937U JP H0341937 U JPH0341937 U JP H0341937U JP 10231689 U JP10231689 U JP 10231689U JP 10231689 U JP10231689 U JP 10231689U JP H0341937 U JPH0341937 U JP H0341937U
- Authority
- JP
- Japan
- Prior art keywords
- main board
- bonding section
- semiconductor circuit
- pattern
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示す半導体回路基
板の概略平面図、第２図はボンデイング部の拡大
平面図、第３図は半導体回路基板に外部から曲げ
応力が加えられたときの状態を示す説明図、第４
図は他の実施例を示すマルチペレツトの場合にお
ける半導体回路基板の概略平面図である。
１……主基板、２……ボンデイング部、３……
円弧状溝孔部（溝孔部）、４……連結路、５……
ＩＣ（ＩＣ素子）。
Fig. 1 is a schematic plan view of a semiconductor circuit board showing an embodiment of the present invention, Fig. 2 is an enlarged plan view of a bonding part, and Fig. 3 is a state in which bending stress is applied to the semiconductor circuit board from the outside. Explanatory diagram showing 4th
The figure is a schematic plan view of a semiconductor circuit board in the case of a multi-pellet, showing another embodiment. 1... Main board, 2... Bonding part, 3...
Arc-shaped slot portion (slot hole portion), 4...connection path, 5...
IC (IC element).
Claims (1)
構成する半導体回路基板において、前記主基板内
に固定される前記ＩＣ素子の配線領域と主基板上
のパターンとを連結する少なくとも１つの連結路
を有してなるボンデイング部と、前記連結路を残
して前記ボンデイング部の外周を削成する溝孔部
とを備えたことを特徴とする半導体回路基板。 In a semiconductor circuit board in which an IC element is connected to a pattern on a main board to form a circuit, at least one connection path connecting a wiring area of the IC element fixed in the main board and a pattern on the main board is provided. What is claimed is: 1. A semiconductor circuit board comprising: a bonding section having a bonding section; and a groove section for cutting an outer periphery of the bonding section, leaving the connecting path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10231689U JPH0341937U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10231689U JPH0341937U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341937U true JPH0341937U (en) | 1991-04-22 |
Family
ID=31651219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10231689U Pending JPH0341937U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341937U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001357375A (en) * | 2000-06-14 | 2001-12-26 | Dainippon Printing Co Ltd | Ic carrier with planar frame body |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057152B2 (en) * | 1978-03-15 | 1985-12-13 | 株式会社日立製作所 | magnetic tape playback device |
| JPS6175986A (en) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | Loading medium for integrated circuit element |
| JPS6255196A (en) * | 1985-09-05 | 1987-03-10 | シャープ株式会社 | Integrated circuit card |
| JPH02233298A (en) * | 1989-03-07 | 1990-09-14 | Fujitsu Ltd | Ic card |
-
1989
- 1989-08-31 JP JP10231689U patent/JPH0341937U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057152B2 (en) * | 1978-03-15 | 1985-12-13 | 株式会社日立製作所 | magnetic tape playback device |
| JPS6175986A (en) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | Loading medium for integrated circuit element |
| JPS6255196A (en) * | 1985-09-05 | 1987-03-10 | シャープ株式会社 | Integrated circuit card |
| JPH02233298A (en) * | 1989-03-07 | 1990-09-14 | Fujitsu Ltd | Ic card |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001357375A (en) * | 2000-06-14 | 2001-12-26 | Dainippon Printing Co Ltd | Ic carrier with planar frame body |
| JP4580509B2 (en) * | 2000-06-14 | 2010-11-17 | 大日本印刷株式会社 | IC carrier with plate-like frame fixed to card mounting board |