JPS6142859B2 - - Google Patents

Info

Publication number: JPS6142859B2
Authority: JP; Japan
Prior art keywords: bonding; crimping; crimping tool; gigantic; lead
Prior art date: 1978-12-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP53152526A

Other languages

English (en)

Japanese (ja)

Other versions

JPS5578537A (en

Inventor

Toshihiko Tsuge

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

CHO ERU ESU AI GIJUTSU KENKYU KUMIAI

Original Assignee

CHO ERU ESU AI GIJUTSU KENKYU KUMIAI

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-12-08

Filing date

1978-12-08

Publication date

1986-09-24

1978-12-08 Application filed by CHO ERU ESU AI GIJUTSU KENKYU KUMIAI filed Critical CHO ERU ESU AI GIJUTSU KENKYU KUMIAI

1978-12-08 Priority to JP15252678A priority Critical patent/JPS5578537A/ja

1980-06-13 Publication of JPS5578537A publication Critical patent/JPS5578537A/ja

1986-09-24 Publication of JPS6142859B2 publication Critical patent/JPS6142859B2/ja

Status Granted legal-status Critical Current

Links

238000002788 crimping Methods 0.000 claims description 27
239000012530 fluid Substances 0.000 claims description 2
239000004065 semiconductor Substances 0.000 claims description 2
239000007788 liquid Substances 0.000 description 3
239000004642 Polyimide Substances 0.000 description 1
239000013013 elastic material Substances 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
239000012528 membrane Substances 0.000 description 1
239000002184 metal Substances 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920002379 silicone rubber Polymers 0.000 description 1
239000004945 silicone rubber Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1
239000000758 substrate Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

Wire Bonding (AREA)

JP15252678A 1978-12-08 1978-12-08 Gang bonding pressure welding tool Granted JPS5578537A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP15252678A JPS5578537A (en)	1978-12-08	1978-12-08	Gang bonding pressure welding tool

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP15252678A JPS5578537A (en)	1978-12-08	1978-12-08	Gang bonding pressure welding tool

Publications (2)

Publication Number	Publication Date
JPS5578537A JPS5578537A (en)	1980-06-13
JPS6142859B2 true JPS6142859B2 (fi)	1986-09-24

Family

ID=15542354

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP15252678A Granted JPS5578537A (en)	1978-12-08	1978-12-08	Gang bonding pressure welding tool

Country Status (1)

Country	Link
JP (1)	JPS5578537A (fi)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH01233795A (ja) *	1988-03-15	1989-09-19	Mitsubishi Electric Corp	混成集績回路

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5831546A (ja) *	1981-08-18	1983-02-24	Nec Corp	半導体装置の製造方法
JPH05211208A (ja) *	1992-01-23	1993-08-20	Nec Corp	ボンディング装置
JP2001230528A (ja) *	2000-02-15	2001-08-24	Sony Corp	実装装置及び実装方法

1978
- 1978-12-08 JP JP15252678A patent/JPS5578537A/ja active Granted

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH01233795A (ja) *	1988-03-15	1989-09-19	Mitsubishi Electric Corp	混成集績回路

Also Published As

Publication number	Publication date
JPS5578537A (en)	1980-06-13

Similar Documents

Publication	Publication Date	Title
US3606881A (en)	1971-09-21	Conductive rubber electrode
US4903885A (en)	1990-02-27	Method and apparatus for fastening electronic components to substrates
JPH04348540A (ja)	1992-12-03	フリップチップボンダー
US3547105A (en)	1970-12-15	Flexible conductive disc electrode
JPS6142859B2 (fi)	1986-09-24
US4482781A (en)	1984-11-13	Stabilization of semiconductor device package leads
JPH02146757A (ja)	1990-06-05	半導体装置
JP2000323534A (ja)	2000-11-24	半導体素子の実装構造及び実装方法
JPS5772336A (en)	1982-05-06	Semiconductor device
JPS5632749A (en)	1981-04-02	Manufacture of semiconductor device
JP2000235062A5 (ja)	2005-08-04	半導体装置の製造方法
JPS54114790A (en)	1979-09-07	Conductive coupling of metal and metal foil
JPH01199440A (ja)	1989-08-10	半導体装置の製造方法
JPH025536Y2 (fi)	1990-02-09
JPS54129880A (en)	1979-10-08	Manufacture for semiconductor device
JPS6132435A (ja)	1986-02-15	半導体素子の取り付け方法
JPH02250359A (ja)	1990-10-08	半導体装置
JPS6373638A (ja)	1988-04-04	ウエハ貼付装置
JPS5586125A (en)	1980-06-28	Mounting method of semiconductor device
JPS57136353A (en)	1982-08-23	Manufacture of semiconductor device
JPS59201433A (ja)	1984-11-15	半導体装置の製造方法
JPS62262436A (ja)	1987-11-14	半導体装置
JPH03101243A (ja)	1991-04-26	ボンデイング装置
JPS5575227A (en)	1980-06-06	Manufacturing pressure-contact-type semiconductor device
JPS51141580A (en)	1976-12-06	Method for drawing a lead wire of a semiconductor element