JPS5578537A - Gang bonding pressure welding tool - Google Patents
Gang bonding pressure welding toolInfo
- Publication number
- JPS5578537A JPS5578537A JP15252678A JP15252678A JPS5578537A JP S5578537 A JPS5578537 A JP S5578537A JP 15252678 A JP15252678 A JP 15252678A JP 15252678 A JP15252678 A JP 15252678A JP S5578537 A JPS5578537 A JP S5578537A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- pressurizing unit
- gas
- unevenness
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15252678A JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15252678A JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5578537A true JPS5578537A (en) | 1980-06-13 |
JPS6142859B2 JPS6142859B2 (fi) | 1986-09-24 |
Family
ID=15542354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15252678A Granted JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5578537A (fi) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5831546A (ja) * | 1981-08-18 | 1983-02-24 | Nec Corp | 半導体装置の製造方法 |
JPH05211208A (ja) * | 1992-01-23 | 1993-08-20 | Nec Corp | ボンディング装置 |
JP2001230528A (ja) * | 2000-02-15 | 2001-08-24 | Sony Corp | 実装装置及び実装方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01233795A (ja) * | 1988-03-15 | 1989-09-19 | Mitsubishi Electric Corp | 混成集績回路 |
-
1978
- 1978-12-08 JP JP15252678A patent/JPS5578537A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5831546A (ja) * | 1981-08-18 | 1983-02-24 | Nec Corp | 半導体装置の製造方法 |
JPH05211208A (ja) * | 1992-01-23 | 1993-08-20 | Nec Corp | ボンディング装置 |
JP2001230528A (ja) * | 2000-02-15 | 2001-08-24 | Sony Corp | 実装装置及び実装方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6142859B2 (fi) | 1986-09-24 |
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