JPS5575227A - Manufacturing pressure-contact-type semiconductor device - Google Patents

Manufacturing pressure-contact-type semiconductor device

Info

Publication number
JPS5575227A
JPS5575227A JP15036178A JP15036178A JPS5575227A JP S5575227 A JPS5575227 A JP S5575227A JP 15036178 A JP15036178 A JP 15036178A JP 15036178 A JP15036178 A JP 15036178A JP S5575227 A JPS5575227 A JP S5575227A
Authority
JP
Japan
Prior art keywords
compensation plate
jigs
bonding agent
compressing
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15036178A
Other languages
Japanese (ja)
Inventor
Mitsuo Odate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15036178A priority Critical patent/JPS5575227A/en
Publication of JPS5575227A publication Critical patent/JPS5575227A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To improve electrical and thermal resistances by providing the first thermal compensation plate on the lower surface of a diode element with a brazing filler being intervened and the second thermal compensation plate on the upper surface, surrounding the resultant product with a bonding agent thereafter compressing said product the compressing jigs from the top and bottom.
CONSTITUTION: The first thermal compensation plate 3 is attached to the lower surface of a diode element 1 by using a brazing filler 4, and the second thermal compensation plate 5 is attached to the upper surface thereof on the side of negative plate 2. A bonding agent 6 comprising silicone rubber with insulating and resilient property is applied to the side of the negative electrode 2 and the compensation plate 5 and cured. Then, the compensation plates 3 and 5 are held between stainless-steel ring-shaped compressing jigs 13 and 14, and compressed by a hydraulic press. Thereafter, the jigs 13 and 14d are removed. In this constitution, the bonding agent 6 does not enter deeply into the portion between the negative electrode 2 and compensation plates 5, the reduction of the effective contact area does not occur, and the resistance does not increase.
COPYRIGHT: (C)1980,JPO&Japio
JP15036178A 1978-12-04 1978-12-04 Manufacturing pressure-contact-type semiconductor device Pending JPS5575227A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15036178A JPS5575227A (en) 1978-12-04 1978-12-04 Manufacturing pressure-contact-type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15036178A JPS5575227A (en) 1978-12-04 1978-12-04 Manufacturing pressure-contact-type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5575227A true JPS5575227A (en) 1980-06-06

Family

ID=15495302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15036178A Pending JPS5575227A (en) 1978-12-04 1978-12-04 Manufacturing pressure-contact-type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5575227A (en)

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