JPS5620157A - Treatment of waste water from chemical copper plating process - Google Patents
Treatment of waste water from chemical copper plating processInfo
- Publication number
- JPS5620157A JPS5620157A JP9376179A JP9376179A JPS5620157A JP S5620157 A JPS5620157 A JP S5620157A JP 9376179 A JP9376179 A JP 9376179A JP 9376179 A JP9376179 A JP 9376179A JP S5620157 A JPS5620157 A JP S5620157A
- Authority
- JP
- Japan
- Prior art keywords
- ions
- chelating agent
- plating process
- copper plating
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9376179A JPS5620157A (en) | 1979-07-25 | 1979-07-25 | Treatment of waste water from chemical copper plating process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9376179A JPS5620157A (en) | 1979-07-25 | 1979-07-25 | Treatment of waste water from chemical copper plating process |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5620157A true JPS5620157A (en) | 1981-02-25 |
Family
ID=14091409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9376179A Pending JPS5620157A (en) | 1979-07-25 | 1979-07-25 | Treatment of waste water from chemical copper plating process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5620157A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5811774A (ja) * | 1981-07-13 | 1983-01-22 | Matsushita Electric Ind Co Ltd | 銅の化学メッキ廃液の処理方法 |
JPH04356449A (ja) * | 1991-05-31 | 1992-12-10 | K I Kasei Kk | アントラニル酸類の製造法 |
CN102180509A (zh) * | 2011-03-28 | 2011-09-14 | 浙江理工大学 | 一种成分可控CuO/Cu2O空心球的制备方法 |
-
1979
- 1979-07-25 JP JP9376179A patent/JPS5620157A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5811774A (ja) * | 1981-07-13 | 1983-01-22 | Matsushita Electric Ind Co Ltd | 銅の化学メッキ廃液の処理方法 |
JPH0223234B2 (ja) * | 1981-07-13 | 1990-05-23 | Matsushita Electric Ind Co Ltd | |
JPH04356449A (ja) * | 1991-05-31 | 1992-12-10 | K I Kasei Kk | アントラニル酸類の製造法 |
JP2541882B2 (ja) * | 1991-05-31 | 1996-10-09 | ケイ・アイ化成株式会社 | アントラニル酸類の製造法 |
CN102180509A (zh) * | 2011-03-28 | 2011-09-14 | 浙江理工大学 | 一种成分可控CuO/Cu2O空心球的制备方法 |
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