JPS5620157A - Treatment of waste water from chemical copper plating process - Google Patents

Treatment of waste water from chemical copper plating process

Info

Publication number
JPS5620157A
JPS5620157A JP9376179A JP9376179A JPS5620157A JP S5620157 A JPS5620157 A JP S5620157A JP 9376179 A JP9376179 A JP 9376179A JP 9376179 A JP9376179 A JP 9376179A JP S5620157 A JPS5620157 A JP S5620157A
Authority
JP
Japan
Prior art keywords
ions
chelating agent
plating process
copper plating
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9376179A
Other languages
Japanese (ja)
Inventor
Akira Matsuo
Hitoshi Oka
Kazumasa Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9376179A priority Critical patent/JPS5620157A/en
Publication of JPS5620157A publication Critical patent/JPS5620157A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths

Abstract

PURPOSE:To recover chelating agent of high purity efficiently, by addition of a chelating agent of cuprous ions and auxiliary decomposing agent to the waste water from chemical copper plating process so as to convert chelated cupric ions to the complex of cuprous ions. CONSTITUTION:In treating the waste soln. from chemical copper plating process comprising cupric ions, chelating agent for cupric ions, reducing agent for cupric ions, and alkali metal hydroxide, one member among sodium chloride, glycine, ammonia, monoethanolamine, diethanolamine, triethnolamine which are chelating agent for cuprous ions, and one member among ascorbic acid, alkali metal salt of boron hydride, hydrochloric acid salt and sulfuric acid salt of hydroxylamine, and hydrazine as auxiliary decomposing agent are added to the waste soln. Then the pH of the waste soln. is increased to >=12 with sodium hydroxide and stirred at about 25 deg.C temp. for 3hr so as to be decomposed, then copper oxide sludge is separated by filtration. Addition of concd. sulfuric acid to the filtrate crystallizes ethylenediaminetetraacetic acid. The crystal is separated by filtration, and the filtrate is discharged after neutralization.
JP9376179A 1979-07-25 1979-07-25 Treatment of waste water from chemical copper plating process Pending JPS5620157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9376179A JPS5620157A (en) 1979-07-25 1979-07-25 Treatment of waste water from chemical copper plating process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9376179A JPS5620157A (en) 1979-07-25 1979-07-25 Treatment of waste water from chemical copper plating process

Publications (1)

Publication Number Publication Date
JPS5620157A true JPS5620157A (en) 1981-02-25

Family

ID=14091409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9376179A Pending JPS5620157A (en) 1979-07-25 1979-07-25 Treatment of waste water from chemical copper plating process

Country Status (1)

Country Link
JP (1) JPS5620157A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5811774A (en) * 1981-07-13 1983-01-22 Matsushita Electric Ind Co Ltd Treatment of chemical plating waste liquor of copper
JPH04356449A (en) * 1991-05-31 1992-12-10 K I Kasei Kk Production of anthranillic acids
CN102180509A (en) * 2011-03-28 2011-09-14 浙江理工大学 Method for preparing hollow CuO/Cu2O spheres with controllable ingredients

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5811774A (en) * 1981-07-13 1983-01-22 Matsushita Electric Ind Co Ltd Treatment of chemical plating waste liquor of copper
JPH0223234B2 (en) * 1981-07-13 1990-05-23 Matsushita Electric Ind Co Ltd
JPH04356449A (en) * 1991-05-31 1992-12-10 K I Kasei Kk Production of anthranillic acids
JP2541882B2 (en) * 1991-05-31 1996-10-09 ケイ・アイ化成株式会社 Method for producing anthranilic acids
CN102180509A (en) * 2011-03-28 2011-09-14 浙江理工大学 Method for preparing hollow CuO/Cu2O spheres with controllable ingredients

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