JPH0478181B2 - - Google Patents

Info

Publication number: JPH0478181B2
Authority: JP; Japan
Prior art keywords: wiring board; wiring; conductor; forming; ceramic substrate
Prior art date: 1986-10-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP25797186A

Other languages

English (en)

Japanese (ja)

Other versions

JPS63110755A (ja

Inventor

Yoshitaka Fukuoka

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toshiba Corp

Original Assignee

Tokyo Shibaura Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-10-29

Filing date

1986-10-29

Publication date

1992-12-10

1986-10-29 Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd

1986-10-29 Priority to JP25797186A priority Critical patent/JPS63110755A/ja

1987-10-29 Priority to EP87309593A priority patent/EP0266210B1/de

1987-10-29 Priority to DE8787309593T priority patent/DE3784213T2/de

1988-05-16 Publication of JPS63110755A publication Critical patent/JPS63110755A/ja

1992-01-09 Priority to US07/817,996 priority patent/US5153709A/en

1992-12-10 Publication of JPH0478181B2 publication Critical patent/JPH0478181B2/ja

Status Granted legal-status Critical Current

Links

239000004020 conductor Substances 0.000 claims description 63
239000000919 ceramic Substances 0.000 claims description 33
239000000758 substrate Substances 0.000 claims description 26
238000000034 method Methods 0.000 claims description 24
229920001721 polyimide Polymers 0.000 claims description 24
239000010408 film Substances 0.000 claims description 23
239000010409 thin film Substances 0.000 claims description 18
239000012212 insulator Substances 0.000 claims description 13
229910000679 solder Inorganic materials 0.000 claims description 13
239000002184 metal Substances 0.000 claims description 11
229910052751 metal Inorganic materials 0.000 claims description 11
239000009719 polyimide resin Substances 0.000 claims description 11
229910052802 copper Inorganic materials 0.000 claims description 10
238000004519 manufacturing process Methods 0.000 claims description 10
239000011521 glass Substances 0.000 claims description 9
238000001035 drying Methods 0.000 claims description 7
238000000206 photolithography Methods 0.000 claims description 6
238000007639 printing Methods 0.000 claims description 5
238000009792 diffusion process Methods 0.000 claims description 4
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
229910052737 gold Inorganic materials 0.000 claims description 3
239000011810 insulating material Substances 0.000 claims description 3
239000000463 material Substances 0.000 claims description 3
238000005530 etching Methods 0.000 claims description 2
238000010304 firing Methods 0.000 claims description 2
238000004528 spin coating Methods 0.000 claims description 2
238000007789 sealing Methods 0.000 claims 1
239000004642 Polyimide Substances 0.000 description 13
239000010949 copper Substances 0.000 description 13
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
238000005260 corrosion Methods 0.000 description 4
230000007797 corrosion Effects 0.000 description 4
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
229910045601 alloy Inorganic materials 0.000 description 2
239000000956 alloy Substances 0.000 description 2
239000003990 capacitor Substances 0.000 description 2
238000009833 condensation Methods 0.000 description 2
230000005494 condensation Effects 0.000 description 2
230000005496 eutectics Effects 0.000 description 2
230000005012 migration Effects 0.000 description 2
238000013508 migration Methods 0.000 description 2
230000002093 peripheral effect Effects 0.000 description 2
238000004544 sputter deposition Methods 0.000 description 2
239000004593 Epoxy Substances 0.000 description 1
229910020816 Sn Pb Inorganic materials 0.000 description 1
229910020922 Sn-Pb Inorganic materials 0.000 description 1
229910008783 Sn—Pb Inorganic materials 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
238000000151 deposition Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000001307 helium Substances 0.000 description 1
229910052734 helium Inorganic materials 0.000 description 1
SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
239000011261 inert gas Substances 0.000 description 1
229910000833 kovar Inorganic materials 0.000 description 1
238000010030 laminating Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
239000011368 organic material Substances 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
230000001568 sexual effect Effects 0.000 description 1
238000005476 soldering Methods 0.000 description 1
238000007740 vapor deposition Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor

Landscapes

Production Of Multi-Layered Print Wiring Board (AREA)
Structure Of Printed Boards (AREA)

JP25797186A 1986-10-29 1986-10-29 配線基板およびその製造方法 Granted JPS63110755A (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP25797186A JPS63110755A (ja)	1986-10-29	1986-10-29	配線基板およびその製造方法
EP87309593A EP0266210B1 (de)	1986-10-29	1987-10-29	Elektronischer Apparat mit einem keramischen Substrat
DE8787309593T DE3784213T2 (de)	1986-10-29	1987-10-29	Elektronischer apparat mit einem keramischen substrat.
US07/817,996 US5153709A (en)	1986-10-29	1992-01-09	Electronic apparatus

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP25797186A JPS63110755A (ja)	1986-10-29	1986-10-29	配線基板およびその製造方法

Publications (2)

Publication Number	Publication Date
JPS63110755A JPS63110755A (ja)	1988-05-16
JPH0478181B2 true JPH0478181B2 (de)	1992-12-10

Family

ID=17313757

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP25797186A Granted JPS63110755A (ja)	1986-10-29	1986-10-29	配線基板およびその製造方法

Country Status (1)

Country	Link
JP (1)	JPS63110755A (de)

1986
- 1986-10-29 JP JP25797186A patent/JPS63110755A/ja active Granted

Also Published As

Publication number	Publication date
JPS63110755A (ja)	1988-05-16

Legal Events

Date	Code	Title	Description
2005-12-10	LAPS	Cancellation because of no payment of annual fees

Publication	Publication Date	Title
US5969424A (en)	1999-10-19	Semiconductor device with pad structure
US4827328A (en)	1989-05-02	Hybrid IC device
US4246595A (en)	1981-01-20	Electronics circuit device and method of making the same
EP0266210B1 (de)	1993-02-17	Elektronischer Apparat mit einem keramischen Substrat
US5227583A (en)	1993-07-13	Ceramic package and method for making same
US5828093A (en)	1998-10-27	Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted
JPH0454973B2 (de)	1992-09-01
JPH08274575A (ja)	1996-10-18	素子複合搭載回路基板
US20030096493A1 (en)	2003-05-22	Perimeter anchored thick film pad
US4639830A (en)	1987-01-27	Packaged electronic device
JPH0365034B2 (de)	1991-10-09
JP3263875B2 (ja)	2002-03-11	表面実装型電子部品の製造方法及び表面実装型電子部品
JP4013339B2 (ja)	2007-11-28	バンプを有する電子部品の製造方法
JPH04206658A (ja)	1992-07-28	ハーメチックシール型電気回路装置
JPH0478181B2 (de)	1992-12-10
JPH0365033B2 (de)	1991-10-09
JPH11345734A (ja)	1999-12-14	積層セラミックコンデンサ
JPS595977Y2 (ja)	1984-02-23	集積回路の塔載装置
JPS59201452A (ja)	1984-11-15	高密度テ−プボンデイング用デバイス封止
JP2841825B2 (ja)	1998-12-24	混成集積回路
KR100417854B1 (ko)	2004-02-05	칩크기 패키지 구조 및 그 제조방법
JPH0451488Y2 (de)	1992-12-03
JPH07263823A (ja)	1995-10-13	多層配線基板およびそれを用いた半導体装置
JPS62216348A (ja)	1987-09-22	半導体素子用パツケ−ジ及びその製造法
JPS624854B2 (de)	1987-02-02