JPS624854B2 - - Google Patents
Info
- Publication number
- JPS624854B2 JPS624854B2 JP54006930A JP693079A JPS624854B2 JP S624854 B2 JPS624854 B2 JP S624854B2 JP 54006930 A JP54006930 A JP 54006930A JP 693079 A JP693079 A JP 693079A JP S624854 B2 JPS624854 B2 JP S624854B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- integrated circuit
- wiring
- leads
- conductive structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP693079A JPS5598841A (en) | 1979-01-23 | 1979-01-23 | Electroconductive structure for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP693079A JPS5598841A (en) | 1979-01-23 | 1979-01-23 | Electroconductive structure for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5598841A JPS5598841A (en) | 1980-07-28 |
JPS624854B2 true JPS624854B2 (de) | 1987-02-02 |
Family
ID=11651956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP693079A Granted JPS5598841A (en) | 1979-01-23 | 1979-01-23 | Electroconductive structure for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5598841A (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01113362U (de) * | 1988-01-25 | 1989-07-31 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53105969A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Manufacture of connection structure and wiring for semiconductor device |
-
1979
- 1979-01-23 JP JP693079A patent/JPS5598841A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53105969A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Manufacture of connection structure and wiring for semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5598841A (en) | 1980-07-28 |
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