JPH0183356U - - Google Patents

Info

Publication number
JPH0183356U
JPH0183356U JP1987177777U JP17777787U JPH0183356U JP H0183356 U JPH0183356 U JP H0183356U JP 1987177777 U JP1987177777 U JP 1987177777U JP 17777787 U JP17777787 U JP 17777787U JP H0183356 U JPH0183356 U JP H0183356U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor laser
laser element
supported
side opposite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987177777U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987177777U priority Critical patent/JPH0183356U/ja
Publication of JPH0183356U publication Critical patent/JPH0183356U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案半導体レーザ装置の第1の実施
例を示す断面図、第2図は本考案半導体レーザ装
置の第2の実施例を示す断面図、第3図は従来例
を示す断面図である。 符号の説明、1……基板、6……第1のヒート
シンク、9……半導体レーザ素子、12,12a
……第2のヒートシンク。
FIG. 1 is a cross-sectional view showing a first embodiment of the semiconductor laser device of the present invention, FIG. 2 is a cross-sectional view of the second embodiment of the semiconductor laser device of the present invention, and FIG. 3 is a cross-sectional view of a conventional example. It is. Explanation of symbols: 1...Substrate, 6...First heat sink, 9...Semiconductor laser element, 12, 12a
...Second heat sink.

Claims (1)

【実用新案登録請求の範囲】 第1のヒートシンクの一つの面に半導体レーザ
素子が固着され、 第1のヒートシンクと対向した第2のヒートシ
ンクと上記半導体レーザ素子の反第1のヒートシ
ンク側の面とが固着され、 上記第1のヒートシンク及び第2のヒートシン
クが同一の基板上に支持されてなる ことを特徴とする半導体レーザ装置。
[Claims for Utility Model Registration] A semiconductor laser element is fixed to one surface of a first heat sink, a second heat sink facing the first heat sink, and a surface of the semiconductor laser element on the side opposite to the first heat sink. A semiconductor laser device, wherein the first heat sink and the second heat sink are supported on the same substrate.
JP1987177777U 1987-11-21 1987-11-21 Pending JPH0183356U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987177777U JPH0183356U (en) 1987-11-21 1987-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987177777U JPH0183356U (en) 1987-11-21 1987-11-21

Publications (1)

Publication Number Publication Date
JPH0183356U true JPH0183356U (en) 1989-06-02

Family

ID=31469428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987177777U Pending JPH0183356U (en) 1987-11-21 1987-11-21

Country Status (1)

Country Link
JP (1) JPH0183356U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100458127B1 (en) * 2002-08-31 2004-11-18 (주)애니람다 An apparatus for heat venting of a laser diode in an optical module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100458127B1 (en) * 2002-08-31 2004-11-18 (주)애니람다 An apparatus for heat venting of a laser diode in an optical module

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