JPH01146547U - - Google Patents
Info
- Publication number
- JPH01146547U JPH01146547U JP4412788U JP4412788U JPH01146547U JP H01146547 U JPH01146547 U JP H01146547U JP 4412788 U JP4412788 U JP 4412788U JP 4412788 U JP4412788 U JP 4412788U JP H01146547 U JPH01146547 U JP H01146547U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- substrate
- attachment means
- fixes
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は本考案の一実施例を示す斜視図、第2
図は従来例を示す斜視図である。
1…第2の取付手段、2…U字状薄板、10…
デバイス、11…ヒートシンク、13…基板、2
0,21…第1の取付手段。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1...Second attachment means, 2...U-shaped thin plate, 10...
device, 11... heat sink, 13... substrate, 2
0, 21...first attachment means.
Claims (1)
固定支持するヒートシンクと、このヒートシンク
を基板に固定する第1の取付手段とを備えたヒー
トシンク取付装置において、 前記ヒートシンクに、当該ヒートシンクを前記
基板に固定する第2の取付手段を装備するととも
に、この第2の取付手段を、U字状の薄板と該薄
板をヒートシンクに係止する係止部材とにより形
成したことを特徴とするデバイス取付用ヒートシ
ンク装置。[Claims for Utility Model Registration] A heat sink mounting device comprising: a heat sink that fixes and supports one or more devices at a predetermined position on a substrate; and a first attachment means that fixes the heat sink to the substrate; A second attachment means for fixing the heat sink to the substrate is provided, and the second attachment means is formed of a U-shaped thin plate and a locking member for locking the thin plate to the heat sink. A heat sink device for mounting devices featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4412788U JPH064591Y2 (en) | 1988-03-31 | 1988-03-31 | Heat sink device for device mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4412788U JPH064591Y2 (en) | 1988-03-31 | 1988-03-31 | Heat sink device for device mounting |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01146547U true JPH01146547U (en) | 1989-10-09 |
JPH064591Y2 JPH064591Y2 (en) | 1994-02-02 |
Family
ID=31270502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4412788U Expired - Lifetime JPH064591Y2 (en) | 1988-03-31 | 1988-03-31 | Heat sink device for device mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH064591Y2 (en) |
-
1988
- 1988-03-31 JP JP4412788U patent/JPH064591Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH064591Y2 (en) | 1994-02-02 |