JPH01146547U - - Google Patents

Info

Publication number
JPH01146547U
JPH01146547U JP4412788U JP4412788U JPH01146547U JP H01146547 U JPH01146547 U JP H01146547U JP 4412788 U JP4412788 U JP 4412788U JP 4412788 U JP4412788 U JP 4412788U JP H01146547 U JPH01146547 U JP H01146547U
Authority
JP
Japan
Prior art keywords
heat sink
substrate
attachment means
fixes
thin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4412788U
Other languages
Japanese (ja)
Other versions
JPH064591Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4412788U priority Critical patent/JPH064591Y2/en
Publication of JPH01146547U publication Critical patent/JPH01146547U/ja
Application granted granted Critical
Publication of JPH064591Y2 publication Critical patent/JPH064591Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す斜視図、第2
図は従来例を示す斜視図である。 1…第2の取付手段、2…U字状薄板、10…
デバイス、11…ヒートシンク、13…基板、2
0,21…第1の取付手段。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1...Second attachment means, 2...U-shaped thin plate, 10...
device, 11... heat sink, 13... substrate, 2
0, 21...first attachment means.

Claims (1)

【実用新案登録請求の範囲】 一又は二以上のデバイスを基板上の所定位置に
固定支持するヒートシンクと、このヒートシンク
を基板に固定する第1の取付手段とを備えたヒー
トシンク取付装置において、 前記ヒートシンクに、当該ヒートシンクを前記
基板に固定する第2の取付手段を装備するととも
に、この第2の取付手段を、U字状の薄板と該薄
板をヒートシンクに係止する係止部材とにより形
成したことを特徴とするデバイス取付用ヒートシ
ンク装置。
[Claims for Utility Model Registration] A heat sink mounting device comprising: a heat sink that fixes and supports one or more devices at a predetermined position on a substrate; and a first attachment means that fixes the heat sink to the substrate; A second attachment means for fixing the heat sink to the substrate is provided, and the second attachment means is formed of a U-shaped thin plate and a locking member for locking the thin plate to the heat sink. A heat sink device for mounting devices featuring:
JP4412788U 1988-03-31 1988-03-31 Heat sink device for device mounting Expired - Lifetime JPH064591Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4412788U JPH064591Y2 (en) 1988-03-31 1988-03-31 Heat sink device for device mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4412788U JPH064591Y2 (en) 1988-03-31 1988-03-31 Heat sink device for device mounting

Publications (2)

Publication Number Publication Date
JPH01146547U true JPH01146547U (en) 1989-10-09
JPH064591Y2 JPH064591Y2 (en) 1994-02-02

Family

ID=31270502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4412788U Expired - Lifetime JPH064591Y2 (en) 1988-03-31 1988-03-31 Heat sink device for device mounting

Country Status (1)

Country Link
JP (1) JPH064591Y2 (en)

Also Published As

Publication number Publication date
JPH064591Y2 (en) 1994-02-02

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