JPS61171247U - - Google Patents

Info

Publication number
JPS61171247U
JPS61171247U JP1985052747U JP5274785U JPS61171247U JP S61171247 U JPS61171247 U JP S61171247U JP 1985052747 U JP1985052747 U JP 1985052747U JP 5274785 U JP5274785 U JP 5274785U JP S61171247 U JPS61171247 U JP S61171247U
Authority
JP
Japan
Prior art keywords
semiconductor element
substrate
mounting
thermal conductivity
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985052747U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985052747U priority Critical patent/JPS61171247U/ja
Publication of JPS61171247U publication Critical patent/JPS61171247U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers

Landscapes

  • Wire Bonding (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例に係る半導体素子
の実装構造を示す断面図、第２図はこの考案の他
の実施例に係る半導体素子の実装構造を示す断面
図、第３図は半導体素子の実装構造の一従来例を
示す断面図である。 （図の主要な部分を表わす符号の説明）、１…
半導体チツプ、２…貫通穴、３…基板、１５…金
属片。 FIG. 1 is a sectional view showing a mounting structure of a semiconductor element according to an embodiment of this invention, FIG. 2 is a sectional view showing a mounting structure of a semiconductor element according to another embodiment of this invention, and FIG. FIG. 2 is a cross-sectional view showing a conventional example of an element mounting structure. (Explanation of symbols representing main parts of the figure), 1...
Semiconductor chip, 2...through hole, 3...substrate, 15...metal piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子の基板への実装構造にして、基板に
対し熱伝導率の高い部材を貫通して設け、該部材
に半導体素子の形成面の一部を固着してなること
を特徴とする半導体素子の実装構造。 A structure for mounting a semiconductor element on a substrate, characterized in that a member with high thermal conductivity is provided through the substrate, and a part of the surface on which the semiconductor element is formed is fixed to the member. Implementation structure.
JP1985052747U 1985-04-11 1985-04-11 Pending JPS61171247U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985052747U JPS61171247U (en) 1985-04-11 1985-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985052747U JPS61171247U (en) 1985-04-11 1985-04-11

Publications (1)

Publication Number Publication Date
JPS61171247U true JPS61171247U (en) 1986-10-24

Family

ID=30572970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985052747U Pending JPS61171247U (en) 1985-04-11 1985-04-11

Country Status (1)

Country Link
JP (1) JPS61171247U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270511A (en) * 2007-04-20 2008-11-06 Denso Corp Electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270511A (en) * 2007-04-20 2008-11-06 Denso Corp Electronic device

Similar Documents

Publication Publication Date Title
JPS61171247U (en)
JPS61102039U (en)
JPH01127253U (en)
JPH0187547U (en)
JPS6194356U (en)
JPS61174775U (en)
JPS62103252U (en)
JPH0183356U (en)
JPS6186939U (en)
JPS61207038U (en)
JPH01157424U (en)
JPS62168677U (en)
JPS6265862U (en)
JPS62182555U (en)
JPS6292644U (en)
JPS60174244U (en) hybrid integrated circuit
JPS6279368U (en)
JPS60163738U (en) semiconductor equipment
JPS60163740U (en) semiconductor equipment
JPS6230350U (en)
JPH0179846U (en)
JPS6185174U (en)
JPS61183540U (en)
JPS5860951U (en) semiconductor equipment
JPS6185175U (en)