JPH01127253U - - Google Patents

Info

Publication number
JPH01127253U
JPH01127253U JP2320388U JP2320388U JPH01127253U JP H01127253 U JPH01127253 U JP H01127253U JP 2320388 U JP2320388 U JP 2320388U JP 2320388 U JP2320388 U JP 2320388U JP H01127253 U JPH01127253 U JP H01127253U
Authority
JP
Japan
Prior art keywords
semiconductor
heat sink
positioning
utility
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2320388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2320388U priority Critical patent/JPH01127253U/ja
Publication of JPH01127253U publication Critical patent/JPH01127253U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案にかかるヒートシンクの見取
り図。第2図及び第3図は、この考案にかかる半
導体取り付け位置決めの為の凸部の実施例を示す
断面図。第4図は、従来の構造を示す図。 1…ヒートシンク、2…半導体素子、3…半導
体取り付け位置決めの為の凸部、4…ヒートシン
ク用半田端子、5…半導体取り付け位置決めの為
の凸部。
FIG. 1 is a sketch of a heat sink according to the present invention. FIGS. 2 and 3 are cross-sectional views showing embodiments of a convex portion for positioning semiconductor mounting according to this invention. FIG. 4 is a diagram showing a conventional structure. DESCRIPTION OF SYMBOLS 1...Heat sink, 2...Semiconductor element, 3...Convex part for semiconductor attachment positioning, 4...Solder terminal for heat sink, 5...Convex part for semiconductor attachment positioning.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子の冷却に用いられるヒートシンクに
おいて、半導体取り付け面に半導体取り付け位置
決めの為の位置決め部を持つことを特徴とするヒ
ートシンク。
A heat sink used for cooling semiconductor elements, the heat sink having a positioning part for positioning the semiconductor on the semiconductor mounting surface.
JP2320388U 1988-02-24 1988-02-24 Pending JPH01127253U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2320388U JPH01127253U (en) 1988-02-24 1988-02-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2320388U JPH01127253U (en) 1988-02-24 1988-02-24

Publications (1)

Publication Number Publication Date
JPH01127253U true JPH01127253U (en) 1989-08-31

Family

ID=31241987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2320388U Pending JPH01127253U (en) 1988-02-24 1988-02-24

Country Status (1)

Country Link
JP (1) JPH01127253U (en)

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