JPH0245691U - - Google Patents
Info
- Publication number
- JPH0245691U JPH0245691U JP12420688U JP12420688U JPH0245691U JP H0245691 U JPH0245691 U JP H0245691U JP 12420688 U JP12420688 U JP 12420688U JP 12420688 U JP12420688 U JP 12420688U JP H0245691 U JPH0245691 U JP H0245691U
- Authority
- JP
- Japan
- Prior art keywords
- cooling fin
- contact surface
- semiconductor device
- semiconductor element
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 8
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図および第２図は本考案の一実施例を示す
もので、第１図は半導体素子の冷却フイン装置を
示す断面図、第２図は第１図の要部を示す断面図
、第３図は従来例を示す半導体素子の冷却フイン
装置の断面図である。
１……冷却フイン装置、２……半導体素子、３
……第１の冷却フイン、４……第２の冷却フイン
、１５，１６……接触面、１７……凹凸部。
1 and 2 show an embodiment of the present invention, in which FIG. 1 is a sectional view showing a cooling fin device for semiconductor devices, FIG. 2 is a sectional view showing the main parts of FIG. 1, and FIG. FIG. 3 is a sectional view of a conventional cooling fin device for semiconductor devices. 1... Cooling fin device, 2... Semiconductor element, 3
...First cooling fin, 4...Second cooling fin, 15, 16...Contact surface, 17...Irregularities.
Claims (1)
冷却フイン、もしくは、前記第１の冷却フインに
接触面を介して固着された第２の冷却フインを備
えてなる半導体素子の冷却フイン装置において、 前記半導体素子と第１の冷却フインとの接触面
もしくは、第１の冷却フインと第２の冷却フイン
との接触面のうち少なくともいずれか一方に、互
いに密接嵌合する凹凸部を形成したことを特徴と
する半導体素子の冷却フイン装置。[Claims for Utility Model Registration] A first cooling fin to which a semiconductor element is fixed via a contact surface, or a second cooling fin to which a semiconductor element is fixed to the first cooling fin via a contact surface. In the cooling fin device for a semiconductor device, at least one of the contact surface between the semiconductor device and the first cooling fin, or the contact surface between the first cooling fin and the second cooling fin, each of which is closely fitted to each other. A cooling fin device for a semiconductor device, characterized in that a matching uneven portion is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12420688U JPH0245691U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12420688U JPH0245691U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245691U true JPH0245691U (en) | 1990-03-29 |
Family
ID=31373736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12420688U Pending JPH0245691U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245691U (en) |
-
1988
- 1988-09-22 JP JP12420688U patent/JPH0245691U/ja active Pending