JPS62151749U - - Google Patents

Info

Publication number
JPS62151749U
JPS62151749U JP3839986U JP3839986U JPS62151749U JP S62151749 U JPS62151749 U JP S62151749U JP 3839986 U JP3839986 U JP 3839986U JP 3839986 U JP3839986 U JP 3839986U JP S62151749 U JPS62151749 U JP S62151749U
Authority
JP
Japan
Prior art keywords
snap groove
ceramic wafer
utility
scope
same position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3839986U
Other languages
Japanese (ja)
Other versions
JPH0517887Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986038399U priority Critical patent/JPH0517887Y2/ja
Publication of JPS62151749U publication Critical patent/JPS62151749U/ja
Application granted granted Critical
Publication of JPH0517887Y2 publication Critical patent/JPH0517887Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の実施例のセラミツクウエフ
アにおける表面を示し、第２図は同じく裏面の面
図を示し、第３図は同じく縦断面図である。 １……セラミツクウエフア、２……角穴、３…
…丸穴、４……表面スナツプ溝、５……裏面スナ
ツプ溝、６……セラミツク基板。 FIG. 1 shows the front surface of a ceramic wafer according to an embodiment of this invention, FIG. 2 shows a plan view of the back surface, and FIG. 3 shows a longitudinal sectional view. 1...ceramic wafer, 2...square hole, 3...
...Round hole, 4...Snap groove on the front surface, 5...Snap groove on the back surface, 6...Ceramic substrate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一面には連続したスナツプ溝を設け、他面同位
置には不連続のスナツプ溝を設けてなるセラミツ
クウエフア。 A ceramic wafer with a continuous snap groove on one side and a discontinuous snap groove on the other side at the same position.
JP1986038399U 1986-03-18 1986-03-18 Expired - Lifetime JPH0517887Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986038399U JPH0517887Y2 (en) 1986-03-18 1986-03-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986038399U JPH0517887Y2 (en) 1986-03-18 1986-03-18

Publications (2)

Publication Number Publication Date
JPS62151749U true JPS62151749U (en) 1987-09-26
JPH0517887Y2 JPH0517887Y2 (en) 1993-05-13

Family

ID=30850605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986038399U Expired - Lifetime JPH0517887Y2 (en) 1986-03-18 1986-03-18

Country Status (1)

Country Link
JP (1) JPH0517887Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02119246A (en) * 1988-10-28 1990-05-07 Shindengen Electric Mfg Co Ltd Semiconductor device and manufacture thereof
JP2000068414A (en) * 1998-08-24 2000-03-03 Ngk Spark Plug Co Ltd Manufacture of lead-less package
JP2008544549A (en) * 2005-06-22 2008-12-04 フリースケール セミコンダクター インコーポレイテッド Chemical die unification technique
JP2015023095A (en) * 2013-07-17 2015-02-02 コーア株式会社 Manufacturing method of chip resistor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60183747A (en) * 1984-03-01 1985-09-19 Ngk Spark Plug Co Ltd Manufacture of electrolytic chip carrier provided with beveling

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60183747A (en) * 1984-03-01 1985-09-19 Ngk Spark Plug Co Ltd Manufacture of electrolytic chip carrier provided with beveling

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02119246A (en) * 1988-10-28 1990-05-07 Shindengen Electric Mfg Co Ltd Semiconductor device and manufacture thereof
JP2000068414A (en) * 1998-08-24 2000-03-03 Ngk Spark Plug Co Ltd Manufacture of lead-less package
JP2008544549A (en) * 2005-06-22 2008-12-04 フリースケール セミコンダクター インコーポレイテッド Chemical die unification technique
JP2015023095A (en) * 2013-07-17 2015-02-02 コーア株式会社 Manufacturing method of chip resistor
CN105393316A (en) * 2013-07-17 2016-03-09 兴亚株式会社 Chip-resistor manufacturing method

Also Published As

Publication number Publication date
JPH0517887Y2 (en) 1993-05-13

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