JP7136254B2 - 基板処理装置及び基板処理方法 - Google Patents
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Description
基板を保持する基板保持部と、当該基板保持部における前記基板の位置を検出するための第1の検出部と、を備え、前記基板の搬送領域に設けられる基板搬送機構と、
前記基板を処理するために当該基板が各々載置される複数の載置部が配置され、前記搬送領域に対して横方向に位置する配置領域と、
前記搬送領域と前記配置領域とを区画すると共に、前記搬送領域と前記各載置部との間で前記基板を受け渡すために前記載置部毎に設けられる開口部を備える壁部と、
前記開口部を介して前記搬送領域から前記配置領域へ進入した前記基板保持部の位置を検出するために前記載置部毎に設けられる第2の検出部と、
前記搬送領域から前記複数の載置部のうちの一の載置部に前記基板を搬送するにあたり、前記第1の検出部及び複数の前記第2の検出部のうち当該一の載置部に対応する第2の検出部の検出結果に基づいて、前記配置領域における前記基板保持部の位置を補正する位置補正部と、
を備え、
前記第1の検出部の検出結果に基づいて、前記第2の検出部による検出が行われるように設定された位置からずれた暫定位置に位置する前記基板保持部に対して前記第2の検出部による検出が行われ、
当該第2の検出部による検出結果に基づいて当該暫定位置から移動した前記基板保持部に対して前記載置部への前記基板の受け渡しが行われる。
基板の搬送領域に設けられる基板搬送機構を構成する基板保持部により前記基板を保持する工程と、
前記基板搬送機構を構成する第1の検出部により前記基板保持部における前記基板の位置を検出する工程と、
前記搬送領域に対して横方向に位置する配置領域における複数の載置部の各々に前記基板を載置して処理を行う工程と、
前記搬送領域と前記配置領域とを区画する壁部において、前記搬送領域と前記各載置部との間で前記基板を受け渡すために前記載置部毎に設けられる開口部を介して前記搬送領域から前記配置領域へ前記基板保持部を進入させる工程と、
前記載置部毎に設けられる第2の検出部により、前記配置領域に進入した前記基板保持部の位置を検出する工程と、
位置補正部により、前記搬送領域から前記複数の載置部のうちの一の載置部に前記基板を搬送するにあたり、前記第1の検出部及び複数の前記第2の検出部のうち当該一の載置部に対応する第2の検出部の検出結果に基づいて、前記配置領域における前記基板保持部の位置を補正する工程と、
を備え、
前記基板保持部の位置を検出する工程は、前記第1の検出部の検出結果に基づいて、前記第2の検出部による検出が行われるように設定された位置からずれた暫定位置に位置する前記基板保持部に対して前記第2の検出部による検出を行う工程であり、
当該第2の検出部による検出結果に基づいて当該暫定位置から移動した前記基板保持部に対して前記載置部への前記基板の受け渡しを行う工程を備える。
W ウエハ
1 塗布、現像装置
10 制御部
24 基台
25 フォーク
3 ウエハ検出ユニット
30 ウエハ検出用センサ
4 レジスト膜形成モジュール
41 スピンチャック
55、56 フォーク検出用センサ
Claims (8)
- 基板を保持する基板保持部と、当該基板保持部における前記基板の位置を検出するための第1の検出部と、を備え、前記基板の搬送領域に設けられる基板搬送機構と、
前記基板を処理するために当該基板が各々載置される複数の載置部が配置され、前記搬送領域に対して横方向に位置する配置領域と、
前記搬送領域と前記配置領域とを区画すると共に、前記搬送領域と前記各載置部との間で前記基板を受け渡すために前記載置部毎に設けられる開口部を備える壁部と、
前記開口部を介して前記搬送領域から前記配置領域へ進入した前記基板保持部の位置を検出するために前記載置部毎に設けられる第2の検出部と、
前記搬送領域から前記複数の載置部のうちの一の載置部に前記基板を搬送するにあたり、前記第1の検出部及び複数の前記第2の検出部のうち当該一の載置部に対応する第2の検出部の検出結果に基づいて、前記配置領域における前記基板保持部の位置を補正する位置補正部と、
を備え、
前記第1の検出部の検出結果に基づいて、前記第2の検出部による検出が行われるように設定された位置からずれた暫定位置に位置する前記基板保持部に対して前記第2の検出部による検出が行われ、
当該第2の検出部による検出結果に基づいて当該暫定位置から移動した前記基板保持部に対して前記載置部への前記基板の受け渡しが行われる基板処理装置。 - 前記各載置部は、前記基板を処理するために載置された前記基板を回転させる請求項1記載の基板処理装置。
- 前記配置領域には、前記基板に処理液を供給するノズルが設けられ、
前記載置部は前記処理液が供給された前記基板を回転させる請求項2記載の基板処理装置。 - 前記位置補正部は前記第1の検出部によって前記基板の中心の位置を検出し、当該基板の中心の位置に基づいて、前記配置領域における前記基板保持部の位置が補正される請求項1ないし3のいずれか一つに記載の基板処理装置。
- 前記基板保持部には、縦方向に形成された貫通孔が設けられ、
前記第2の検出部は、前記貫通孔の孔縁の位置を検出するために設けられる請求項1ないし4のいずれか一つに記載の基板処理装置。 - 前記第2の検出部は前記搬送領域において前記各開口部の口縁部に設けられ、保持した前記基板が前記配置領域に位置する状態で前記搬送領域に位置する前記貫通孔の前記孔縁の位置を検出する請求項5記載の基板処理装置。
- 前記基板搬送機構を第1の基板搬送機構とすると、
前記第1の基板搬送機構、前記搬送領域、前記配置領域及び前記壁部を備えるブロックが複数積層される処理ブロックと、
前記基板を格納する搬送容器が載置されるキャリアブロックと、
前記搬送容器と、前記処理ブロックに含まれる前記複数のブロックとの間で前記基板を受け渡すための第2の基板搬送機構と、
が設けられる請求項1ないし6のいずれか一つに記載の基板処理装置。 - 基板の搬送領域に設けられる基板搬送機構を構成する基板保持部により前記基板を保持する工程と、
前記基板搬送機構を構成する第1の検出部により前記基板保持部における前記基板の位置を検出する工程と、
前記搬送領域に対して横方向に位置する配置領域における複数の載置部の各々に前記基板を載置して処理を行う工程と、
前記搬送領域と前記配置領域とを区画する壁部において、前記搬送領域と前記各載置部との間で前記基板を受け渡すために前記載置部毎に設けられる開口部を介して前記搬送領域から前記配置領域へ前記基板保持部を進入させる工程と、
前記載置部毎に設けられる第2の検出部により、前記配置領域に進入した前記基板保持部の位置を検出する工程と、
位置補正部により、前記搬送領域から前記複数の載置部のうちの一の載置部に前記基板を搬送するにあたり、前記第1の検出部及び複数の前記第2の検出部のうち当該一の載置部に対応する第2の検出部の検出結果に基づいて、前記配置領域における前記基板保持部の位置を補正する工程と、
を備え、
前記基板保持部の位置を検出する工程は、前記第1の検出部の検出結果に基づいて、前記第2の検出部による検出が行われるように設定された位置からずれた暫定位置に位置する前記基板保持部に対して前記第2の検出部による検出を行う工程であり、
当該第2の検出部による検出結果に基づいて当該暫定位置から移動した前記基板保持部に対して前記載置部への前記基板の受け渡しを行う工程を備える基板処理方法。
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JP2021053874A JP7136254B2 (ja) | 2017-02-23 | 2021-03-26 | 基板処理装置及び基板処理方法 |
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JP2017031948A JP6862903B2 (ja) | 2017-02-23 | 2017-02-23 | 基板搬送装置、基板搬送方法及び記憶媒体 |
JP2021053874A JP7136254B2 (ja) | 2017-02-23 | 2021-03-26 | 基板処理装置及び基板処理方法 |
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JP6862903B2 (ja) * | 2017-02-23 | 2021-04-21 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及び記憶媒体 |
CN110463374B (zh) * | 2017-03-30 | 2021-03-05 | 株式会社富士 | 对基板作业机 |
JP6842555B2 (ja) * | 2017-09-08 | 2021-03-17 | 株式会社Fuji | 対基板作業機 |
JP7105629B2 (ja) * | 2018-06-20 | 2022-07-25 | 東京エレクトロン株式会社 | 自動教示方法及び制御装置 |
CN109192681B (zh) * | 2018-09-01 | 2022-05-31 | 佛山市美特智能科技有限公司 | 芯片的快速柔性制造*** |
JP7008609B2 (ja) * | 2018-10-18 | 2022-01-25 | 東京エレクトロン株式会社 | 基板処理装置、及び搬送位置補正方法 |
JP7303648B2 (ja) * | 2019-03-20 | 2023-07-05 | 株式会社Screenホールディングス | 基板処理装置および基板処理装置における対象物の搬送方法 |
KR102240925B1 (ko) * | 2019-07-17 | 2021-04-15 | 세메스 주식회사 | 기판 처리 설비 및 기판 반송 장치 |
US11295975B2 (en) * | 2019-09-13 | 2022-04-05 | Brooks Automation Us, Llc | Method and apparatus for substrate alignment |
KR20220150968A (ko) * | 2020-03-13 | 2022-11-11 | 무라다기카이가부시끼가이샤 | 그리퍼 장치, 반송차, 및 반송 방법 |
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US20220044950A1 (en) * | 2020-08-05 | 2022-02-10 | Changxin Memory Technologies, Inc. | Storage system, query system and storage method for reticles, and computer device |
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