JP6862903B2 - 基板搬送装置、基板搬送方法及び記憶媒体 - Google Patents
基板搬送装置、基板搬送方法及び記憶媒体 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 19
- 238000003860 storage Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 96
- 238000001514 detection method Methods 0.000 claims description 53
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 8
- 238000004590 computer program Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 168
- 230000007246 mechanism Effects 0.000 description 27
- 239000011248 coating agent Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 18
- 230000007723 transport mechanism Effects 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 13
- 230000003028 elevating effect Effects 0.000 description 11
- 239000000126 substance Substances 0.000 description 7
- 101150075071 TRS1 gene Proteins 0.000 description 6
- 101000662805 Homo sapiens Trafficking protein particle complex subunit 5 Proteins 0.000 description 4
- 102100037497 Trafficking protein particle complex subunit 5 Human genes 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000004929 transmission Raman spectroscopy Methods 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000072 solvent casting and particulate leaching Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
前記基板保持部が前記一のモジュールから前記基板を受け取った後、前記他のモジュールへ搬送する前に当該基板保持部における前記基板の基準位置に対する第1のずれ量を検出するための第1の検出部と、
他のモジュールに前記基板を受け渡すために設定された暫定位置に位置するように移動した前記基板保持部と、当該暫定位置との位置ずれの量である第2のずれ量を検出するための第2の検出部と、
前記第1のずれ量及び前記第2のずれ量に基づいて、前記他のモジュールに前記基板を受け渡すための受け渡し位置を決定するための位置決定部と、
を備え、
前記暫定位置は、前記第1のずれ量を補償するために予め設定された位置からずれるように前記位置決定部により設定される位置であり、
前記受け渡し位置は、前記第2のずれ量が補償されるように前記位置決定部により決定されることを特徴とする。
前記基板保持部が前記一のモジュールから前記基板を受け取った後、第1の検出部により前記他のモジュールへ搬送する前に当該基板保持部における前記基板の基準位置に対する第1のずれ量を検出する工程と、
他のモジュールに前記基板を受け渡すために設定された暫定位置に位置するように移動した前記基板保持部と、当該暫定位置との位置ずれの量である第2のずれ量を第2の検出部により検出する工程と、
位置決定部により、前記第1のずれ量及び前記第2のずれ量に基づいて、前記他のモジュールに前記基板を受け渡すための受け渡し位置を決定する工程と、
を備え、
前記暫定位置は、前記第1のずれ量を補償するために予め設定された位置からずれるように前記位置決定部により設定される位置であり、
前記受け渡し位置は、前記第2のずれ量が補償されるように前記位置決定部により決定されることを特徴とする。
前記コンピュータプログラムは、本発明の基板搬送方法を実行するようにステップ群が組まれていることを特徴とする。
W ウエハ
1 塗布、現像装置
10 制御部
24 基台
25 フォーク
3 ウエハ検出ユニット
30 ウエハ検出用センサ
4 レジスト膜形成モジュール
41 スピンチャック
55、56 フォーク検出用センサ
Claims (10)
- 基板を保持し、一のモジュールから他のモジュールへ当該基板を搬送するために横方向に移動自在な基板保持部と、
前記基板保持部が前記一のモジュールから前記基板を受け取った後、前記他のモジュールへ搬送する前に当該基板保持部における前記基板の基準位置に対する第1のずれ量を検出するための第1の検出部と、
他のモジュールに前記基板を受け渡すために設定された暫定位置に位置するように移動した前記基板保持部と、当該暫定位置との位置ずれの量である第2のずれ量を検出するための第2の検出部と、
前記第1のずれ量及び前記第2のずれ量に基づいて、前記他のモジュールに前記基板を受け渡すための受け渡し位置を決定するための位置決定部と、
を備え、
前記暫定位置は、前記第1のずれ量を補償するために予め設定された位置からずれるように前記位置決定部により設定される位置であり、
前記受け渡し位置は、前記第2のずれ量が補償されるように前記位置決定部により決定されることを特徴とする基板搬送装置。 - 前記第2の検出部は、互いに直交する2つの水平軸における基板保持部の位置を検出するために設けられることを特徴とする請求項1記載の基板搬送装置。
- 前記第2の検出部は前記基板保持部の位置を検出するために、前記他のモジュールに設けられていることを特徴とする請求項1または2記載の基板搬送装置。
- 前記第2の検出部は、前記他のモジュールに開口する前記基板の搬入口に設けられることを特徴とする請求項3記載の基板搬送装置。
- 前記第2の検出部は、前記基板保持部に設けられていることを特徴とする請求項1ないし3のいずれか一つに記載の基板搬送装置。
- 前記第1の検出部は、前記基板保持部が保持している前記基板の周縁部の位置を夫々異なる位置で検出するための複数のセンサにより構成されることを特徴とする請求項1ないし5のいずれか一つに記載の基板搬送装置。
- 前記他のモジュールは、前記基板の裏面の中心部を保持すると共に当該基板を回転させる載置部と、
回転する前記基板の周縁部に処理液を供給して処理を行う処理液供給ノズルと、を備えることを特徴とする請求項1ないし6のいずれか一つに記載の基板搬送装置。 - 前記基板保持部は、搬送路を前記横方向に移動する基台において進退自在に設けられ、
前記第2の検出部は、互いに直交する2つの水平軸における前記基板保持部の位置を検出するために、縦方向に投光する投光部と当該投光部からの光を受光する受光部との組を複数備え、
前記他のモジュールは、横方向に開口して前記基板保持部が進入するための前記基板の搬送口を備えた壁部を含み、
前記第2の検出部は、前記壁部により前記他のモジュールに対して隔てられた前記搬送路に設けられ、
前記基板保持部には、当該基板保持部が前記他のモジュール内の位置である前記暫定位置に位置するときに前記他のモジュールの外側において複数の前記投光部により、その孔縁部に光が照射されるように、縦方向に形成された貫通孔が設けられる請求項1ないし7のいずれか一つに記載の基板搬送装置。 - 基板を保持した基板保持部を、一のモジュールから他のモジュールへ当該基板を搬送するために横方向に移動させる工程と、
前記基板保持部が前記一のモジュールから前記基板を受け取った後、第1の検出部により前記他のモジュールへ搬送する前に当該基板保持部における前記基板の基準位置に対する第1のずれ量を検出する工程と、
他のモジュールに前記基板を受け渡すために設定された暫定位置に位置するように移動した前記基板保持部と、当該暫定位置との位置ずれの量である第2のずれ量を第2の検出部により検出する工程と、
位置決定部により、前記第1のずれ量及び前記第2のずれ量に基づいて、前記他のモジュールに前記基板を受け渡すための受け渡し位置を決定する工程と、
を備え、
前記暫定位置は、前記第1のずれ量を補償するために予め設定された位置からずれるように前記位置決定部により設定される位置であり、
前記受け渡し位置は、前記第2のずれ量が補償されるように前記位置決定部により決定されることを特徴とする基板搬送方法。 - 基板を基板保持部により保持して搬送する基板搬送装置に用いられるコンピュータプログラムを記憶した記憶媒体であって、
前記コンピュータプログラムは、請求項9記載の基板搬送方法を実行するようにステップ群が組まれていることを特徴とする記憶媒体。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017031948A JP6862903B2 (ja) | 2017-02-23 | 2017-02-23 | 基板搬送装置、基板搬送方法及び記憶媒体 |
TW107104629A TWI765961B (zh) | 2017-02-23 | 2018-02-09 | 基板搬運裝置、基板搬運方法及記憶媒體 |
KR1020180020548A KR102438590B1 (ko) | 2017-02-23 | 2018-02-21 | 기판 반송 장치, 기판 반송 방법 및 기억 매체 |
US15/901,954 US10879100B2 (en) | 2017-02-23 | 2018-02-22 | Substrate transfer device, substrate transfer method and recording medium |
CN201820264171.9U CN207883669U (zh) | 2017-02-23 | 2018-02-23 | 基板输送装置 |
CN201810155440.2A CN108511379A (zh) | 2017-02-23 | 2018-02-23 | 基板输送装置、基板输送方法以及存储介质 |
JP2021053874A JP7136254B2 (ja) | 2017-02-23 | 2021-03-26 | 基板処理装置及び基板処理方法 |
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JP2017031948A JP6862903B2 (ja) | 2017-02-23 | 2017-02-23 | 基板搬送装置、基板搬送方法及び記憶媒体 |
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JP6862903B2 (ja) * | 2017-02-23 | 2021-04-21 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及び記憶媒体 |
EP3606311B1 (en) * | 2017-03-30 | 2022-03-09 | Fuji Corporation | Substrate processing machine |
EP3681259B1 (en) * | 2017-09-08 | 2022-08-10 | Fuji Corporation | Substrate work machine |
JP7105629B2 (ja) * | 2018-06-20 | 2022-07-25 | 東京エレクトロン株式会社 | 自動教示方法及び制御装置 |
CN109192681B (zh) * | 2018-09-01 | 2022-05-31 | 佛山市美特智能科技有限公司 | 芯片的快速柔性制造*** |
JP7008609B2 (ja) * | 2018-10-18 | 2022-01-25 | 東京エレクトロン株式会社 | 基板処理装置、及び搬送位置補正方法 |
JP7303648B2 (ja) * | 2019-03-20 | 2023-07-05 | 株式会社Screenホールディングス | 基板処理装置および基板処理装置における対象物の搬送方法 |
KR102240925B1 (ko) * | 2019-07-17 | 2021-04-15 | 세메스 주식회사 | 기판 처리 설비 및 기판 반송 장치 |
US11295975B2 (en) * | 2019-09-13 | 2022-04-05 | Brooks Automation Us, Llc | Method and apparatus for substrate alignment |
JP7327640B2 (ja) * | 2020-03-13 | 2023-08-16 | 村田機械株式会社 | グリッパ装置、搬送車、及び搬送方法 |
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US20220044950A1 (en) * | 2020-08-05 | 2022-02-10 | Changxin Memory Technologies, Inc. | Storage system, query system and storage method for reticles, and computer device |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0714908A (ja) * | 1993-06-23 | 1995-01-17 | Nec Corp | 基板搬送装置 |
US5742393A (en) * | 1995-06-07 | 1998-04-21 | Varian Associates, Inc. | Optical position calibration system |
JPH11254359A (ja) * | 1998-03-12 | 1999-09-21 | Toyota Autom Loom Works Ltd | 部材搬送システム |
JP4696373B2 (ja) * | 2001-02-20 | 2011-06-08 | 東京エレクトロン株式会社 | 処理システム及び被処理体の搬送方法 |
US7008802B2 (en) * | 2001-05-29 | 2006-03-07 | Asm America, Inc. | Method and apparatus to correct water drift |
JP2009218622A (ja) * | 2009-06-29 | 2009-09-24 | Canon Anelva Corp | 基板処理装置及び基板処理装置における基板位置ずれ補正方法 |
JP5614326B2 (ja) * | 2010-08-20 | 2014-10-29 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 |
JP5516482B2 (ja) * | 2011-04-11 | 2014-06-11 | 東京エレクトロン株式会社 | 基板搬送方法、基板搬送装置、及び塗布現像装置 |
US9363899B2 (en) * | 2012-01-02 | 2016-06-07 | Mutracx International B.V. | Inkjet system for printing a printed circuit board |
JP6076884B2 (ja) * | 2013-11-19 | 2017-02-08 | 東京エレクトロン株式会社 | 剥離システム |
JP6199199B2 (ja) * | 2014-02-20 | 2017-09-20 | 東京エレクトロン株式会社 | 基板処理装置、位置ずれ補正方法及び記憶媒体 |
JP5858103B2 (ja) * | 2014-07-16 | 2016-02-10 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及び記憶媒体 |
JP6316742B2 (ja) * | 2014-12-24 | 2018-04-25 | 東京エレクトロン株式会社 | 基板搬送装置および基板搬送方法 |
KR102587203B1 (ko) * | 2015-07-13 | 2023-10-10 | 브룩스 오토메이션 인코퍼레이티드 | 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치 |
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