JP7001960B2 - 回路構成体 - Google Patents

回路構成体 Download PDF

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Publication number
JP7001960B2
JP7001960B2 JP2018055952A JP2018055952A JP7001960B2 JP 7001960 B2 JP7001960 B2 JP 7001960B2 JP 2018055952 A JP2018055952 A JP 2018055952A JP 2018055952 A JP2018055952 A JP 2018055952A JP 7001960 B2 JP7001960 B2 JP 7001960B2
Authority
JP
Japan
Prior art keywords
bus bar
heat transfer
heat
transfer member
base member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018055952A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019169602A (ja
Inventor
勇貴 藤村
怜也 岡本
宏 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2018055952A priority Critical patent/JP7001960B2/ja
Priority to US16/351,041 priority patent/US10971914B2/en
Priority to CN201910208267.2A priority patent/CN110300506B/zh
Publication of JP2019169602A publication Critical patent/JP2019169602A/ja
Application granted granted Critical
Publication of JP7001960B2 publication Critical patent/JP7001960B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00—Installations of bus-bars
    • H02G5/10—Cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Connection Or Junction Boxes (AREA)
JP2018055952A 2018-03-23 2018-03-23 回路構成体 Active JP7001960B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018055952A JP7001960B2 (ja) 2018-03-23 2018-03-23 回路構成体
US16/351,041 US10971914B2 (en) 2018-03-23 2019-03-12 Circuit assembly
CN201910208267.2A CN110300506B (zh) 2018-03-23 2019-03-19 电路构成体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018055952A JP7001960B2 (ja) 2018-03-23 2018-03-23 回路構成体

Publications (2)

Publication Number Publication Date
JP2019169602A JP2019169602A (ja) 2019-10-03
JP7001960B2 true JP7001960B2 (ja) 2022-01-20

Family

ID=67985994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018055952A Active JP7001960B2 (ja) 2018-03-23 2018-03-23 回路構成体

Country Status (3)

Country Link
US (1) US10971914B2 (zh)
JP (1) JP7001960B2 (zh)
CN (1) CN110300506B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7052689B2 (ja) * 2018-11-21 2022-04-12 株式会社オートネットワーク技術研究所 回路構成体
JP7024704B2 (ja) * 2018-12-28 2022-02-24 住友電装株式会社 電子モジュール
WO2021010119A1 (ja) * 2019-07-15 2021-01-21 株式会社オートネットワーク技術研究所 回路構成体
JP7351157B2 (ja) * 2019-09-18 2023-09-27 オムロン株式会社 リレー
CN110707449A (zh) * 2019-10-08 2020-01-17 联合汽车电子有限公司 一种三相铜排和电驱动总成
JP7167904B2 (ja) * 2019-11-18 2022-11-09 株式会社オートネットワーク技術研究所 回路構成体
JP7218714B2 (ja) * 2019-11-26 2023-02-07 株式会社オートネットワーク技術研究所 回路構成体
JP7352833B2 (ja) * 2020-01-30 2023-09-29 株式会社オートネットワーク技術研究所 回路構成体
JP7413872B2 (ja) * 2020-03-24 2024-01-16 住友電装株式会社 電気接続箱
JP2021180233A (ja) * 2020-05-13 2021-11-18 株式会社オートネットワーク技術研究所 回路ユニット
WO2021230125A1 (ja) * 2020-05-15 2021-11-18 株式会社オートネットワーク技術研究所 回路構成体
WO2022044093A1 (ja) 2020-08-24 2022-03-03 日産自動車株式会社 電力変換装置
EP4016772A1 (en) * 2020-12-17 2022-06-22 Vitesco Technologies GmbH High-voltage junction box for an electrically driven vehicle
JP2022123464A (ja) * 2021-02-12 2022-08-24 住友電装株式会社 電気接続箱
JP2022123473A (ja) * 2021-02-12 2022-08-24 住友電装株式会社 電気接続箱
JP2022143562A (ja) * 2021-03-17 2022-10-03 株式会社オートネットワーク技術研究所 リアクトル構造体、コンバータ、及び電力変換装置
JP7192918B1 (ja) * 2021-06-14 2022-12-20 株式会社明電舎 バスバー放熱構造及びインバータ装置
CN116828785A (zh) * 2022-03-22 2023-09-29 苏州力特奥维斯保险丝有限公司 散热螺栓
JP2023180855A (ja) * 2022-06-10 2023-12-21 株式会社オートネットワーク技術研究所 回路構成体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093959A (ja) 2000-09-20 2002-03-29 Fujitsu Ten Ltd 電子機器の放熱構造
JP2003115681A (ja) 2001-10-04 2003-04-18 Denso Corp 電子部品の実装構造
JP2006294754A (ja) 2005-04-07 2006-10-26 Denso Corp 電子装置の放熱構造
US20150061098A1 (en) 2013-08-27 2015-03-05 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
WO2017154696A1 (ja) 2016-03-10 2017-09-14 株式会社オートネットワーク技術研究所 回路構成体
WO2018038030A1 (ja) 2016-08-22 2018-03-01 株式会社オートネットワーク技術研究所 導電部材、回路構成体、及び、導電部材の製造方法

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
JPH0786717A (ja) * 1993-09-17 1995-03-31 Fujitsu Ltd プリント配線板構造体
JP2002176279A (ja) 2000-12-07 2002-06-21 Yazaki Corp 電子ユニットボックスの放熱構造及び電子ユニットの製造方法
US7167377B2 (en) * 2001-11-26 2007-01-23 Sumitoo Wiring Systems, Ltd. Circuit-constituting unit and method of producing the same
JP2004253759A (ja) * 2002-12-24 2004-09-09 Auto Network Gijutsu Kenkyusho:Kk 制御回路基板及び回路構成体
JP4584600B2 (ja) * 2004-02-06 2010-11-24 株式会社オートネットワーク技術研究所 回路構成体
US7248483B2 (en) * 2004-08-19 2007-07-24 Xantrex Technology, Inc. High power density insulated metal substrate based power converter assembly with very low BUS impedance
JP2008091610A (ja) * 2006-10-02 2008-04-17 Sumitomo Wiring Syst Ltd プリント基板
US20080158828A1 (en) * 2006-12-27 2008-07-03 Inventec Corporation Heatsink structure and assembly fixture thereof
JP4344753B2 (ja) * 2007-02-22 2009-10-14 シークス株式会社 回路基板への電子部品実装方法
JP4661830B2 (ja) * 2007-06-15 2011-03-30 トヨタ自動車株式会社 パワーモジュール
JP4666185B2 (ja) * 2008-06-26 2011-04-06 三菱電機株式会社 半導体装置
US20110024896A1 (en) * 2008-07-07 2011-02-03 Mitsubishi Electric Corporation Power semiconductor device
WO2012073306A1 (ja) * 2010-11-29 2012-06-07 トヨタ自動車株式会社 パワーモジュール
JP5939102B2 (ja) * 2012-09-18 2016-06-22 富士通株式会社 電子機器
US9178288B2 (en) * 2013-06-07 2015-11-03 Apple Inc. Spring plate for attaching bus bar to a printed circuit board
JP2016025229A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体
JP6287659B2 (ja) * 2014-07-22 2018-03-07 株式会社オートネットワーク技術研究所 回路構成体
JP6164495B2 (ja) * 2014-10-23 2017-07-19 株式会社オートネットワーク技術研究所 回路構成体及び回路構成体の製造方法
BR112018011113A2 (pt) * 2015-12-02 2019-02-05 Nsk Ltd estrutura de substrato tendo peças eletrônicas nele montadas e alojamento para acomodação do substrato
JP6443688B2 (ja) * 2015-12-16 2018-12-26 株式会社オートネットワーク技術研究所 回路構成体、及び電気接続箱

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093959A (ja) 2000-09-20 2002-03-29 Fujitsu Ten Ltd 電子機器の放熱構造
JP2003115681A (ja) 2001-10-04 2003-04-18 Denso Corp 電子部品の実装構造
JP2006294754A (ja) 2005-04-07 2006-10-26 Denso Corp 電子装置の放熱構造
US20150061098A1 (en) 2013-08-27 2015-03-05 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
WO2017154696A1 (ja) 2016-03-10 2017-09-14 株式会社オートネットワーク技術研究所 回路構成体
WO2018038030A1 (ja) 2016-08-22 2018-03-01 株式会社オートネットワーク技術研究所 導電部材、回路構成体、及び、導電部材の製造方法

Also Published As

Publication number Publication date
CN110300506A (zh) 2019-10-01
US10971914B2 (en) 2021-04-06
JP2019169602A (ja) 2019-10-03
CN110300506B (zh) 2021-02-19
US20190297720A1 (en) 2019-09-26

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