JP6857125B2 - 焼結性接合材料およびそれを用いた半導体装置 - Google Patents
焼結性接合材料およびそれを用いた半導体装置 Download PDFInfo
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- JP6857125B2 JP6857125B2 JP2017534361A JP2017534361A JP6857125B2 JP 6857125 B2 JP6857125 B2 JP 6857125B2 JP 2017534361 A JP2017534361 A JP 2017534361A JP 2017534361 A JP2017534361 A JP 2017534361A JP 6857125 B2 JP6857125 B2 JP 6857125B2
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Images
Classifications
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L2224/83399—Material
- H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/83439—Silver [Ag] as principal constituent
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/83399—Material
- H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/83399—Material
- H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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Description
本発明に係る接合材料は、銀フィラー及び焼結促進剤としての有機塩基化合物を含む。
本発明の接合材料は、上記有機塩基化合物と組み合わせて添加剤を含むことができる。
銀フィラーは、本発明の接合材の主成分である。加熱によって一緒に接合材ヒューズ(焼結)中に銀フィラーは銀焼結体を形成し、それによって優れた熱伝導性と接合強度を 有する接合層が形成される。
モード:コンタクトモード
カンチレバー:オリンパス製OMCL−TR800PSA−1
高さ方向分解能:0.01nm
横方向解像度:0.2nm
本発明の接合材料は、さらに、接合材の焼結温度以下で気化または消滅する溶媒を含むことができる。
2.別の末端に結合領域の一方の端から面以上の10枚のSEM画像を撮ります。
3.顕微鏡にイメージをインポートし、画像における空隙を輝度抽出により抽出し、および空隙の面積の割合を計算する。
結合領域の気孔率は、取り込まれたイメージの気孔の平均値として算出される。
接合すべき2つの部材を供給する工程;
2つの部材の結合すべき表面が、その間に配置される本発明の接合材料と互いに対向するように2つの部材と接合材を配置する工程;および
2つの部材をその間に配置された接着材料と共に所定の温度に加熱する工程。
半導体チップは、特に限定されない。その例としては、SiチップとSiCチップが挙げられるが、これらに限定されない。半導体チップの裏面(接合される面)は、好ましくは、銀、銅、ニッケル、金等で金属メッキされる。半導体チップの形状の例としては、特に限定されないが、正方形および約2mm〜約15mmの高さおよび幅を有する矩形が挙げられるが、これらに限定されない。
本実施形態の半導体装置の製造方法は、以下の工程を含む。
(1)基材上に本発明の接合材料を適用する工程、
(2)基材上に半導体チップを配置する工程、および
(3)半導体チップが載置された基材を加熱する工程。
上記工程(2)においては、公知の方法を、基板上(実装)半導体チップを配置するための方法として使用することができる。上記工程(2)は、半導体チップを配置する工程、および適用接合材料の厚さ等を調整する工程を含むことができる。
上記工程(3)において、加熱の方法は、適切に接着材料または接合される部材に応じて選択することができる。
乾燥工程:90℃以上、15分以上
焼結温度:250℃以上、例えば300℃
圧力:10MPa以上
時間:3分〜5分
フレーク状フィラー(アスペクト比=20〜200、Ra≦10nm)と球状フィラーの混合物、D50=0.79μm
<添加剤>
パーブチルD(ジ−tert−ブチルペルオキシド)
比較化合物1:HOOC−(CH2)n−COOH(n=4〜5)
比較化合物2:HOOC−(CH2)n−COOH(n=1〜3)
イミダゾール(1,3−ジアザ−2,4−シクロペンタジエン)
DBU(1,8−ジアザビシクロ[5.4.0]ウンデス−7−エン)
<溶媒>
BC(ブチルカルビトール)
BCA(ブチルカルビトールアセテート)
DPG(ジプロピレングリコール)
銀フィラー1:90.24wt%、表1に示す添加剤:0.2重量%、および溶媒(BCA/DPG=1/1(質量比)):9.56重量%を混合して接合材料を調製した。
1.試験片の研磨:
デバイス:BUEHLERベータグラインダー−ポリッシャー60−1990
研磨紙:ストルアスSiCペーパー#120、#220、#500、#800、#1200、#2000
バフ:ストルアスDP−ナップサイズ:200mm径
ダイヤモンドスプレー:ストルアスDP−スプレーP1μm、1/4μm
試験片を研磨紙#120、#220、#500、#800、#1200、#2000、バフ、ダイヤモンドスプレー1μm、1/4μmの順で研磨し、ボンディングの横断面を露出した。
2.SEMイメージング:接合層の横断面のSEM画像は、走査型電子顕微鏡(HITACHI S−3000、倍率=2000倍、1280×960解像度、接合領域の右端から左端の15イメージ)を使用して撮影した。
3.気孔率の計算:得られた画像を、顕微鏡(キーエンスデジタルマイクロスコープVHX−500)へインポートし、空隙は、輝度抽出によって抽出し、気孔率を画像における空気−空間の面積の割合として決定した。平均気孔率は15枚の画像の気孔率を平均して算出した。結果を表1に示す。
得られた接合材の発熱特性は示差走査熱量計(DSC)により分析した(10℃/分の昇温速度)。結果を図2に示す。
銀フィラー1:90.24重量%、焼結促進剤としてDBU:0.2重量%、表2に示す溶剤:9.56重量%を混合して接合材を調製した。
銀フィラー(鱗片状フィラー(アスペクト比=20〜200、Ra≦10nm)と球状フィラーD50 =0.45μmの混合物):94.9wt%、焼結促進剤としてのDBU:0.2wt%とBC:4.9wt%とを混合して接合材料を作製した(実施例5)。
得られた試験片を京都電子工業LFA−502に入れ、熱拡散率(α(m2/s))、比熱容量(c(J/gK))を測定して厚み方向の熱伝導率を求めた。室温(23±1℃)での材料密度(ρ(g/m3))と熱伝導率(λ(W/mK))は、λ=αcρの関係で計算した。参考として、厚さ1mmの銀メッキ銅板の熱伝導率を上記と同様に測定したところ、380W/mKであった。
2、2’:接合層
3:基材の金属表面
4:基材
5:冷却板
Claims (8)
- i)接合材料中の固体成分の全質量に基づいて、少なくとも85質量%の銀フィラー;及び
ii)有機塩基化合物である焼結促進剤
を含んでなり、
該銀フィラーは原子間力顕微鏡(AFM)を用いて測定される算術平均粗さ(Ra)が10nm以下であるフレーク状フィラーを含み、該有機塩基化合物は窒素含有ヘテロ環化合物である、焼結性接合材料。 - 有機塩基化合物は、アミジン部分および/またはグアニジン部分を有する、請求項1に記載の焼結性接合材料。
- 有機塩基化合物の共役酸のpKaは7.0以上である、請求項1又は2に記載の焼結性接合材料。
- 有機塩基化合物は、置換または非置換のイミダゾール、1,8−ジアザビシクロ[5.4.0]−7−ウンデセン、および1,5−ジアザビシクロ[4.3.0]−5−ノネンからなる群から選択される少なくとも1つである、請求項1〜3のいずれかに記載の焼結性接合材料。
- 銀フィラーは、少なくとも30質量%の前記フレーク状フィラーを含む、請求項1〜4のいずれかに記載の焼結性接合材料。
- 溶媒をさらに含む、請求項1〜5のいずれかに記載の焼結性接合材料。
- 2つの部材とその間に配置された接合層とを有し、該接合層は、請求項1〜6のいずれかに記載の焼結性接合材料の焼結体からなる、半導体装置。
- 半導体装置の製造方法であって、
接合される2つの部材を与える工程、
前記2つの部材と前記接合材料とを配置して前記2つの部材の接合面が前記接合材料を介して対向する工程、および
2つの部材をその間に配置された接合材料と共に所定の温度に加熱する工程
を含み、前記接合材料は、請求項1〜6のいずれかに記載の焼結性接合材料である、製造方法。
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