JP6712939B2 - 静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法 - Google Patents

静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法 Download PDF

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JP6712939B2
JP6712939B2 JP2016207649A JP2016207649A JP6712939B2 JP 6712939 B2 JP6712939 B2 JP 6712939B2 JP 2016207649 A JP2016207649 A JP 2016207649A JP 2016207649 A JP2016207649 A JP 2016207649A JP 6712939 B2 JP6712939 B2 JP 6712939B2
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sensors
electrode
electrodes
base substrate
measuring instrument
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Japanese (ja)
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JP2017228754A (ja
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吉平 杉田
吉平 杉田
朋秀 南
朋秀 南
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to US15/623,109 priority Critical patent/US10634479B2/en
Priority to KR1020170075800A priority patent/KR102381838B1/ko
Priority to TW106120306A priority patent/TWI724185B/zh
Publication of JP2017228754A publication Critical patent/JP2017228754A/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2412Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying overlap
    • G01D5/2415Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying overlap adapted for encoders
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G01D18/001Calibrating encoders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2016207649A 2016-06-20 2016-10-24 静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法 Active JP6712939B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US15/623,109 US10634479B2 (en) 2016-06-20 2017-06-14 Measuring instrument for measuring electrostatic capacity and method of calibrating transfer position data in processing system by using measuring instrument
KR1020170075800A KR102381838B1 (ko) 2016-06-20 2017-06-15 정전 용량 측정용 측정기, 및 측정기를 이용하여 처리 시스템에 있어서의 반송 위치 데이터를 교정하는 방법
TW106120306A TWI724185B (zh) 2016-06-20 2017-06-19 靜電電容檢測用之檢測器及使用檢測器來校正處理系統中之搬送位置資料之方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016121714 2016-06-20
JP2016121714 2016-06-20

Publications (2)

Publication Number Publication Date
JP2017228754A JP2017228754A (ja) 2017-12-28
JP6712939B2 true JP6712939B2 (ja) 2020-06-24

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JP (1) JP6712939B2 (ko)
KR (1) KR102381838B1 (ko)
TW (1) TWI724185B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7029983B2 (ja) * 2018-03-09 2022-03-04 東京エレクトロン株式会社 測定器及び測定器のずれ量を求める方法
JP7037964B2 (ja) * 2018-03-09 2022-03-17 東京エレクトロン株式会社 測定器、及びフォーカスリングを検査するためのシステムの動作方法
US10794681B2 (en) 2018-09-04 2020-10-06 Applied Materials, Inc. Long range capacitive gap measurement in a wafer form sensor system
US11521872B2 (en) 2018-09-04 2022-12-06 Applied Materials, Inc. Method and apparatus for measuring erosion and calibrating position for a moving process kit
US11404296B2 (en) 2018-09-04 2022-08-02 Applied Materials, Inc. Method and apparatus for measuring placement of a substrate on a heater pedestal
US10847393B2 (en) 2018-09-04 2020-11-24 Applied Materials, Inc. Method and apparatus for measuring process kit centering
US11342210B2 (en) * 2018-09-04 2022-05-24 Applied Materials, Inc. Method and apparatus for measuring wafer movement and placement using vibration data
JP2020085452A (ja) 2018-11-15 2020-06-04 オムロン株式会社 近接センサユニットおよび距離観測装置
JP7129325B2 (ja) * 2018-12-14 2022-09-01 東京エレクトロン株式会社 搬送方法及び搬送システム
JP2020115499A (ja) * 2019-01-17 2020-07-30 東京エレクトロン株式会社 プラズマ処理装置、及びリング部材の位置ずれ測定方法
US20230178406A1 (en) * 2020-03-20 2023-06-08 Asml Netherlands B.V. Method, apparatus, and system for dynamically controlling an electrostatic chuck during an inspection of wafer
JP7514695B2 (ja) 2020-08-18 2024-07-11 株式会社安川電機 アライメント装置、基板搬送システム、アライメント方法、及び基板搬送方法
JP2022068582A (ja) 2020-10-22 2022-05-10 東京エレクトロン株式会社 搬送位置データの較正方法
JP2022107401A (ja) 2021-01-08 2022-07-21 東京エレクトロン株式会社 測定器及び測定方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0866375A3 (en) * 1997-03-17 2000-05-24 Nikon Corporation Article positioning apparatus and exposing apparatus having the same
JP3697477B2 (ja) * 2001-08-06 2005-09-21 ソニー株式会社 基板収納容器測定装置および基板収納容器測定用治具
JP2009054993A (ja) * 2007-08-02 2009-03-12 Tokyo Electron Ltd 位置検出用治具
JP4460592B2 (ja) * 2007-08-07 2010-05-12 小島プレス工業株式会社 車両搭載機器操作装置
JP4956328B2 (ja) * 2007-08-24 2012-06-20 東京エレクトロン株式会社 搬送アームの移動位置の調整方法及び位置検出用治具
KR101016229B1 (ko) * 2008-11-06 2011-02-25 한양대학교 산학협력단 초정밀 리니어 스테이지의 운동오차 측정방법 및 측정시스템

Also Published As

Publication number Publication date
TWI724185B (zh) 2021-04-11
KR20170142905A (ko) 2017-12-28
JP2017228754A (ja) 2017-12-28
TW201803004A (zh) 2018-01-16
KR102381838B1 (ko) 2022-04-04

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