TWI724185B - 靜電電容檢測用之檢測器及使用檢測器來校正處理系統中之搬送位置資料之方法 - Google Patents

靜電電容檢測用之檢測器及使用檢測器來校正處理系統中之搬送位置資料之方法 Download PDF

Info

Publication number
TWI724185B
TWI724185B TW106120306A TW106120306A TWI724185B TW I724185 B TWI724185 B TW I724185B TW 106120306 A TW106120306 A TW 106120306A TW 106120306 A TW106120306 A TW 106120306A TW I724185 B TWI724185 B TW I724185B
Authority
TW
Taiwan
Prior art keywords
sensors
electrode
detector
base substrate
electrodes
Prior art date
Application number
TW106120306A
Other languages
English (en)
Chinese (zh)
Other versions
TW201803004A (zh
Inventor
杉田吉平
南朋秀
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201803004A publication Critical patent/TW201803004A/zh
Application granted granted Critical
Publication of TWI724185B publication Critical patent/TWI724185B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2412—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying overlap
    • G01D5/2415—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying overlap adapted for encoders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G01D18/001—Calibrating encoders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW106120306A 2016-06-20 2017-06-19 靜電電容檢測用之檢測器及使用檢測器來校正處理系統中之搬送位置資料之方法 TWI724185B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP??2016-121714 2016-06-20
JP2016121714 2016-06-20
JP??2016-207649 2016-10-24
JP2016207649A JP6712939B2 (ja) 2016-06-20 2016-10-24 静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法

Publications (2)

Publication Number Publication Date
TW201803004A TW201803004A (zh) 2018-01-16
TWI724185B true TWI724185B (zh) 2021-04-11

Family

ID=60892229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106120306A TWI724185B (zh) 2016-06-20 2017-06-19 靜電電容檢測用之檢測器及使用檢測器來校正處理系統中之搬送位置資料之方法

Country Status (3)

Country Link
JP (1) JP6712939B2 (ko)
KR (1) KR102381838B1 (ko)
TW (1) TWI724185B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7029983B2 (ja) * 2018-03-09 2022-03-04 東京エレクトロン株式会社 測定器及び測定器のずれ量を求める方法
JP7037964B2 (ja) * 2018-03-09 2022-03-17 東京エレクトロン株式会社 測定器、及びフォーカスリングを検査するためのシステムの動作方法
US10794681B2 (en) 2018-09-04 2020-10-06 Applied Materials, Inc. Long range capacitive gap measurement in a wafer form sensor system
US11521872B2 (en) 2018-09-04 2022-12-06 Applied Materials, Inc. Method and apparatus for measuring erosion and calibrating position for a moving process kit
US11404296B2 (en) 2018-09-04 2022-08-02 Applied Materials, Inc. Method and apparatus for measuring placement of a substrate on a heater pedestal
US10847393B2 (en) 2018-09-04 2020-11-24 Applied Materials, Inc. Method and apparatus for measuring process kit centering
US11342210B2 (en) * 2018-09-04 2022-05-24 Applied Materials, Inc. Method and apparatus for measuring wafer movement and placement using vibration data
JP2020085452A (ja) 2018-11-15 2020-06-04 オムロン株式会社 近接センサユニットおよび距離観測装置
JP7129325B2 (ja) * 2018-12-14 2022-09-01 東京エレクトロン株式会社 搬送方法及び搬送システム
JP2020115499A (ja) * 2019-01-17 2020-07-30 東京エレクトロン株式会社 プラズマ処理装置、及びリング部材の位置ずれ測定方法
US20230178406A1 (en) * 2020-03-20 2023-06-08 Asml Netherlands B.V. Method, apparatus, and system for dynamically controlling an electrostatic chuck during an inspection of wafer
JP7514695B2 (ja) 2020-08-18 2024-07-11 株式会社安川電機 アライメント装置、基板搬送システム、アライメント方法、及び基板搬送方法
JP2022068582A (ja) 2020-10-22 2022-05-10 東京エレクトロン株式会社 搬送位置データの較正方法
JP2022107401A (ja) 2021-01-08 2022-07-21 東京エレクトロン株式会社 測定器及び測定方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6333572B1 (en) * 1997-03-17 2001-12-25 Nikon Corporation Article positioning apparatus and exposing apparatus having the article positioning apparatus
US20030046998A1 (en) * 2001-08-06 2003-03-13 Semiconductor Leading Edge Technologies, Inc. Substrate-container measuring device, and substrate-container measuring jig
TW200921836A (en) * 2007-08-02 2009-05-16 Tokyo Electron Ltd Jig for detecting position
TW200931581A (en) * 2007-08-24 2009-07-16 Tokyo Electron Ltd Method of adjusting moving position of transfer arm and position detecting jig
WO2010053229A1 (en) * 2008-11-06 2010-05-14 Iucf-Hyu(Industry-University Cooperation Foundation Hanyang University) Method and system of measuring motion error in precision linear stage

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4460592B2 (ja) * 2007-08-07 2010-05-12 小島プレス工業株式会社 車両搭載機器操作装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6333572B1 (en) * 1997-03-17 2001-12-25 Nikon Corporation Article positioning apparatus and exposing apparatus having the article positioning apparatus
US20030046998A1 (en) * 2001-08-06 2003-03-13 Semiconductor Leading Edge Technologies, Inc. Substrate-container measuring device, and substrate-container measuring jig
TW200921836A (en) * 2007-08-02 2009-05-16 Tokyo Electron Ltd Jig for detecting position
TW200931581A (en) * 2007-08-24 2009-07-16 Tokyo Electron Ltd Method of adjusting moving position of transfer arm and position detecting jig
WO2010053229A1 (en) * 2008-11-06 2010-05-14 Iucf-Hyu(Industry-University Cooperation Foundation Hanyang University) Method and system of measuring motion error in precision linear stage

Also Published As

Publication number Publication date
JP6712939B2 (ja) 2020-06-24
KR20170142905A (ko) 2017-12-28
JP2017228754A (ja) 2017-12-28
TW201803004A (zh) 2018-01-16
KR102381838B1 (ko) 2022-04-04

Similar Documents

Publication Publication Date Title
TWI724185B (zh) 靜電電容檢測用之檢測器及使用檢測器來校正處理系統中之搬送位置資料之方法
TWI781253B (zh) 獲得測量器之偏離量的方法以及校正處理系統之搬送位置資料的方法
KR102636225B1 (ko) 측정기를 교정하는 방법 및 케이스
US10634479B2 (en) Measuring instrument for measuring electrostatic capacity and method of calibrating transfer position data in processing system by using measuring instrument
JP6537433B2 (ja) 静電容量測定用のセンサチップ及び同センサチップを備えた測定器
KR102675477B1 (ko) 반송 방법 및 반송 시스템
KR102299122B1 (ko) 정전 용량을 나타내는 데이터를 취득하는 방법
JP6502232B2 (ja) フォーカスリング及びセンサチップ
JP7037964B2 (ja) 測定器、及びフォーカスリングを検査するためのシステムの動作方法
TWI753140B (zh) 靜電容量測定用之測定器
CN110246796B (zh) 测定器和求出测定器的偏离量的方法
TW202232108A (zh) 測定器及測定方法
WO2022249973A1 (ja) プラズマモニタシステム、プラズマモニタ方法およびモニタ装置
KR20230099647A (ko) 측정기
TW202220091A (zh) 搬運位置資料之校正方法