JP6579930B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP6579930B2 JP6579930B2 JP2015231243A JP2015231243A JP6579930B2 JP 6579930 B2 JP6579930 B2 JP 6579930B2 JP 2015231243 A JP2015231243 A JP 2015231243A JP 2015231243 A JP2015231243 A JP 2015231243A JP 6579930 B2 JP6579930 B2 JP 6579930B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- holding
- magnetic force
- chuck table
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Jigs For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
4 基台
4a,4b,4c,4d 開口
6 X軸移動テーブル
8 防塵防滴カバー
10,72,74,76 チャックテーブル
10a 保持面
12 切削ユニット(加工ユニット、加工手段)
14 支持構造
16 切削ユニット移動機構
18 Y軸ガイドレール
20 Y軸移動プレート
22 Y軸ボールネジ
24 Y軸パルスモータ
26 Z軸ガイドレール
28 Z軸移動プレート
30 Z軸ボールネジ
32 Z軸パルスモータ
34 切削ブレード
36 カメラ
42 搬入側テーブル
42a 保持面
44 位置決め部材
46 搬出側テーブル
46a 保持面
48,92,94,96 搬送ユニット(搬送手段)
48a 保持面
50 ノズル
62 支持プレート
62a 吸引路
62b 溝
64 磁石(第1磁力保持部)
66 カバープレート
68 クランプ
82 保持プレート
84 磁石(第2磁力保持部)
86 カバープレート
102 保持フレーム
104 保持部
106 磁石(第2磁力保持部)
108 吸引保持部
114 カセット支持台
116 カセット
118 洗浄ユニット
120 把持部
122 ガイドレール
11 被加工物
13 粘着テープ
15 フレーム
Claims (2)
- 強磁性を示す物質を含んで形成された被加工物を加工する加工装置であって、
被加工物を保持面で保持するチャックテーブルと、該チャックテーブルで保持した被加工物を加工する加工手段と、該チャックテーブルに被加工物を搬入し、又は該チャックテーブルから被加工物を搬出する搬送手段と、を備え、
該チャックテーブルは、該保持面側に設けられ被加工物を磁力で保持する第1磁力保持部と、被加工物に貼り付けられた粘着テープの外縁部を吸引して保持できるように開口した吸引路と、を有し、
該搬送手段は、被加工物を磁力で保持する第2磁力保持部と、粘着テープの外縁部に固定された支持部材を吸引して保持する吸引保持部と、を有し、
該吸引保持部を吸引源に接続する吸引路には、圧力センサーが設けられていることを特徴とする加工装置。 - 該第1磁力保持部及び該第2磁力保持部の一方には電磁石が用いられ、該第1磁力保持部及び該第2磁力保持部の他方には永久磁石が用いられることを特徴とする請求項1記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015231243A JP6579930B2 (ja) | 2015-11-27 | 2015-11-27 | 加工装置 |
TW105132909A TWI708657B (zh) | 2015-11-27 | 2016-10-12 | 加工裝置 |
KR1020160146508A KR102486302B1 (ko) | 2015-11-27 | 2016-11-04 | 가공 장치 |
CN201610987077.1A CN107068606B (zh) | 2015-11-27 | 2016-11-09 | 加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015231243A JP6579930B2 (ja) | 2015-11-27 | 2015-11-27 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017098471A JP2017098471A (ja) | 2017-06-01 |
JP6579930B2 true JP6579930B2 (ja) | 2019-09-25 |
Family
ID=58803855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015231243A Active JP6579930B2 (ja) | 2015-11-27 | 2015-11-27 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6579930B2 (ja) |
KR (1) | KR102486302B1 (ja) |
CN (1) | CN107068606B (ja) |
TW (1) | TWI708657B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6765751B2 (ja) * | 2016-06-21 | 2020-10-07 | 株式会社ディスコ | 被加工物の保持機構及び加工装置 |
JP6973931B2 (ja) * | 2017-12-25 | 2021-12-01 | 株式会社ディスコ | 切削装置 |
JP6976660B2 (ja) * | 2018-02-07 | 2021-12-08 | 株式会社ディスコ | 加工装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63159836U (ja) * | 1987-04-08 | 1988-10-19 | ||
JPH08264617A (ja) * | 1995-03-27 | 1996-10-11 | Kawasaki Steel Corp | 半導体装置の搬送方法および搬送装置 |
JP2004200440A (ja) | 2002-12-19 | 2004-07-15 | Disco Abrasive Syst Ltd | 基板保持システム |
JP4590314B2 (ja) | 2005-06-22 | 2010-12-01 | 三菱電機株式会社 | ウェハキャリア |
JP2008103648A (ja) * | 2006-10-23 | 2008-05-01 | Matsushita Electric Ind Co Ltd | 半導体装置の製造装置および半導体装置の製造方法 |
JP2009206166A (ja) * | 2008-02-26 | 2009-09-10 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2010129622A (ja) * | 2008-11-26 | 2010-06-10 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP5466964B2 (ja) * | 2010-02-08 | 2014-04-09 | 株式会社ディスコ | ワーク保持機構 |
JP5947010B2 (ja) | 2011-09-15 | 2016-07-06 | 株式会社ディスコ | 分割装置 |
JP6050626B2 (ja) * | 2012-07-03 | 2016-12-21 | 株式会社ディスコ | 切削装置のチャックテーブル機構 |
JP2014116486A (ja) | 2012-12-11 | 2014-06-26 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2015012263A (ja) * | 2013-07-02 | 2015-01-19 | 株式会社ディスコ | 加工装置 |
JP6261967B2 (ja) * | 2013-12-03 | 2018-01-17 | 株式会社ディスコ | 加工装置 |
JP6325335B2 (ja) * | 2014-05-13 | 2018-05-16 | 株式会社ディスコ | 切削装置のチャックテーブル |
-
2015
- 2015-11-27 JP JP2015231243A patent/JP6579930B2/ja active Active
-
2016
- 2016-10-12 TW TW105132909A patent/TWI708657B/zh active
- 2016-11-04 KR KR1020160146508A patent/KR102486302B1/ko active IP Right Grant
- 2016-11-09 CN CN201610987077.1A patent/CN107068606B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN107068606B (zh) | 2022-02-18 |
KR102486302B1 (ko) | 2023-01-06 |
KR20170062377A (ko) | 2017-06-07 |
JP2017098471A (ja) | 2017-06-01 |
TW201720573A (zh) | 2017-06-16 |
CN107068606A (zh) | 2017-08-18 |
TWI708657B (zh) | 2020-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106956370B (zh) | 加工装置的搬送机构 | |
CN107527853B (zh) | 被加工物的保持机构和加工装置 | |
TWI689027B (zh) | 被加工物之搬運托盤 | |
JP6218600B2 (ja) | 加工装置 | |
JP2017054956A (ja) | 被加工物の支持治具 | |
JP6579930B2 (ja) | 加工装置 | |
TW201732987A (zh) | 晶片收容托盤 | |
TWI789474B (zh) | 工件的切割方法以及切割裝置的卡盤台 | |
TW201742186A (zh) | 吸盤台 | |
JP6762220B2 (ja) | 加工装置の搬送機構 | |
KR20170072136A (ko) | 가공 장치 | |
TWI715727B (zh) | 封裝基板之處置方法 | |
JP6579929B2 (ja) | 加工装置 | |
JP5872799B2 (ja) | レーザー加工装置 | |
JP2016092237A (ja) | フレームユニット | |
JP6193133B2 (ja) | 加工装置 | |
JP2018078209A (ja) | 搬送装置、加工装置及び搬送方法 | |
JP2011060898A (ja) | ワーク収納カセット | |
JP6448456B2 (ja) | 加工装置 | |
JP6061529B2 (ja) | 搬送機構 | |
JP2017199863A (ja) | カセット | |
JP2008241444A (ja) | 加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180928 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190610 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190618 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190814 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190827 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190827 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6579930 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |