JP6569375B2 - 半導体装置、半導体装置の製造方法及び電子装置 - Google Patents
半導体装置、半導体装置の製造方法及び電子装置 Download PDFInfo
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- JP6569375B2 JP6569375B2 JP2015158794A JP2015158794A JP6569375B2 JP 6569375 B2 JP6569375 B2 JP 6569375B2 JP 2015158794 A JP2015158794 A JP 2015158794A JP 2015158794 A JP2015158794 A JP 2015158794A JP 6569375 B2 JP6569375 B2 JP 6569375B2
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- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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Description
一形態に係る半導体装置の構成例を図19に示す。図19には、一形態に係る半導体装置の要部断面を模式的に図示している。
基板110内には、信号配線、電源配線、接地配線といった各種配線が含まれる。図19には、基板110内の配線の一例として、接地配線111を図示している。基板110の表面110aには、接地配線111等の配線に電気的に接続された複数のパッド112が設けられる。基板110の表面110aのパッド112は、例えば、半導体素子120が実装される領域、及び端部に、設けられる。基板110の表面110aの端部に設けられるパッド112(112b)は、接地配線111に電気的に接続される。
このような基板110の、その表面110aに、半導体素子120が実装される。
放熱体130には、例えば、金属材料が用いられる。ここでは一例として平板状の放熱体130を図示するが、半導体装置100では、基板110に実装された半導体素子120の上方及び側方を覆うような箱状の放熱体130を用いることもできる。
図1及び図2は第1の実施の形態に係る半導体装置の構成例を示す図である。図1には、第1の実施の形態に係る半導体装置の一例の要部断面を模式的に図示している。図2には、第1の実施の形態に係る半導体装置の一例の要部平面を模式的に図示している。図2では便宜上、放熱体、熱伝導材及び接着剤についてはそれぞれその一部を図示している。図1は図2のL2−L2断面模式図である。
基板10は、プリント基板等の回路基板である。基板10内には、信号配線、電源配線、接地配線といった各種配線が含まれる。図1には、基板10内の配線の一例として、接地配線11を図示している。
半導体素子20は、LSI(Large Scale Integration)等の半導体チップ、そのような半導体チップとそれが実装されるパッケージ基板とを含む半導体パッケージ等である。半導体素子20は、図1に示すように、それが実装される基板10の領域10aaのパッド12a群と対応する位置に設けられたパッド22群を含む。半導体素子20と基板10とは、互いのパッド22群とパッド12a群とがそれぞれ半田ボール(バンプ)23が用いられて接合され、機械的及び電気的に接続される。
放熱体30には、一定の熱伝導性及び導電性を有する材料、例えば、CuやAl等の金属が用いられる。放熱体30は、図1及び図2に示すように、基板10の表面10a側に実装された半導体素子20の上面に、熱伝導材50を用いて接着される。熱伝導材50には、熱界面材料、半田、導電性ペースト等、一定の熱伝導性を有する材料が用いられる。放熱体30は、熱伝導材50を介して、半導体素子20と熱的に接続される。
接着剤60には、例えば、導電性接着剤が用いられる。接着剤60は、図1に示すように、表面10a側に半導体素子20、突起70群及びアンダーフィル樹脂40が設けられた基板10と、半導体素子20上に熱伝導材50を介して設けられた放熱体30との間を埋める。接着剤60は、図1に示すように、各突起70の、アンダーフィル樹脂40のフィレット部41から露出する部位に、接する。放熱体30と基板10とは、導電性の接着剤60及びそれに少なくとも一部が接する各突起70を通じて、電気的に接続される。
図3は図1のA部の拡大模式図である。
半導体装置1において、アンダーフィル樹脂40のフィレット部41が形成されるような領域に設けられる突起70は、図4に示すように、その一部がフィレット部41から露出し、他部がフィレット部41で覆われる。即ち、基板10の、突起70のパッド12b側下部の括れた部位15には、アンダーフィル樹脂40のフィレット部41が入り込む。接着剤60は、このような基板10の括れた部位15に一部が入り込んだアンダーフィル樹脂40のフィレット部41上に、そのフィレット部41から露出する突起70の一部に接して、設けられる。ここで、接着剤60とフィレット部41(アンダーフィル樹脂40)とは、いずれも樹脂材料が用いられ、互いの接着性は良好である。そのため、接着剤60とそれに良好に接着したフィレット部41との積層体61の内部で突起70がアンカーとして働く。また、当該積層体61によって突起70がホールドされる。熱応力により、基板10と放熱体30とを引き離そうとする力(図4に太矢印で図示)が生じたとしても、アンカー効果、或いはアンカー効果とホールド効果により、基板10からのフィレット部41及び接着剤60(積層体61)の剥がれが抑えられる。
このように放熱体30を電磁シールドに用いる半導体装置1において、例えば、突起70群の少なくとも一部(1つ又は2つ以上)を、半導体素子20近傍の、アンダーフィル樹脂40のフィレット部41が形成されるような領域に設ける場合、次のような利点が得られる。
即ち、放熱体30を、接着剤60を介して突起70群に電気的に接続するため、それら突起70群によって放熱体30と基板10(接地配線11)との間の電気的な接続パスを増大させることができる。放熱体30と基板10との間の電気的な接続パスを増大させることで、放熱体30と基板10との間の断線リスクの低減、及び電気抵抗の低減を図ることができる。
図5〜図11は第1の実施の形態に係る半導体装置の製造方法の説明図である。以下、図5〜図11を参照し、各工程について説明する。
基板10は、その内部に設けられた配線(図5(B)に接地配線11のみ図示)、表面10aに設けられたパッド12a群及びパッド12b群、裏面10bに設けられたパッド12c群、並びに表面10a及び裏面10bに設けられた保護膜14を含む。各パッド12aの少なくとも一部、各パッド12bの少なくとも一部、及び各パッド12cの少なくとも一部が、保護膜14から露出する。
基板10には、例えば、プリント基板が用いられる。基板10の層数は限定されるものではなく、多層プリント板でも単層プリント板でもよい。基板10は、コア基板上にプリプレグ等を用いた配線層をラミネートして形成されるビルドアップ基板でもよい。
半導体素子20には、半導体チップ等が用いられる。半導体素子20は、基板10の領域10aaのパッド12a群と対応する位置に設けられたパッド22群を含む。例えば、基板10への実装前に、パッド22群上にそれぞれバンプ(半田ボール)23が搭載された半導体素子20が準備される。
まず、基板10のパッド12a群及びパッド12b群の上に、半田ペーストのスクリーン印刷等の手法により、予備半田層(図示せず)を形成する。そして、予備半田層が形成されたパッド12a群上に、半導体素子20に搭載したバンプ23群を付着させ、予備半田層が形成されたパッド12b群上にそれぞれ、突起70用の所定の材料及びサイズの半田ボールを付着させる。基板10上への半導体素子20(それに搭載したバンプ23群)の付着と、突起70用の半田ボール群の付着とは、いずれを先に行ってもよいし、同時に行ってもよい。
アンダーフィル樹脂40には、エポキシ樹脂等の樹脂材料が用いられる。このような樹脂材料にシリカやアルミナ等の絶縁性フィラーが含有されてもよい。アンダーフィル樹脂40の樹脂材料には、基板10上への供給時には一定の流動性を有し、供給後、加熱や紫外線照射によって硬化できるものが用いられる。
熱伝導材50には、一定の熱伝導性を有する材料が用いられる。熱伝導材50には、例えば、シリコーン、或いは、金属やセラミック等の熱伝導性フィラーを含有させたシリコーンのシート若しくはペーストを用いることができる。このほか、熱伝導材50には、半田、或いは、半田やAg等を樹脂材料に含有させた導電性ペースト等を用いることもできる。このような熱伝導材50を、基板10上に実装された半導体素子20の上面(背面)に、貼付、載置、塗布等、熱伝導材50の種類に応じた手法で設け、必要に応じて加熱や紫外線照射の手法で硬化する。熱伝導材50を加熱により硬化する場合には、その加熱時に突起70群及びバンプ23群の半田が溶融して性能上或いは品質上望ましくない流出や変質が生じないように、加熱温度、或いは、熱伝導材50及び半田の種類が適宜選択される。
放熱体30には、例えば、一定の熱伝導性を有する材料が用いられる。放熱体30を電磁シールドに用いる場合、放熱体30には、導電性を有する材料が用いられる。放熱体30には、例えば、一定の熱伝導性及び導電性を有するCu、Al等の金属を用いることができる。
尚、上記図9(A)及び図9(B)に示すように接着剤60を設ける前に、この図10(A)及び図10(B)に示す放熱体30を熱伝導材50上に設け、その後、放熱体30と基板10との間に接着剤60を設ける手順を採用することもできる。
図12及び図13は第2の実施の形態に係る半導体装置の構成例を示す図である。図12及び図13にはそれぞれ、第2の実施の形態に係る半導体装置の一例の要部断面を模式的に図示している。
図14は第3の実施の形態に係る半導体装置の構成例を示す図である。図14には、第3の実施の形態に係る半導体装置の一例の要部断面を模式的に図示している。
フィレット部41は、アンダーフィル樹脂40に用いる樹脂材料の粘度や、基板10及び半導体素子20の平面サイズによっては、この図14に示すように、基板10の縁まで広がり得る。半導体装置1Cでは、基板10の縁まで広がるフィレット部41から各々の一部が露出するように突起70群が設けられる。
図15は第4の実施の形態に係る半導体装置の構成例を示す図である。図15には、第4の実施の形態に係る半導体装置の一例の要部断面を模式的に図示している。
図16は第5の実施の形態に係る半導体装置の構成例を示す図である。図16には、第5の実施の形態に係る半導体装置の一例の要部断面を模式的に図示している。
図17は第6の実施の形態に係る半導体装置の構成例を示す図である。図17には、第6の実施の形態に係る半導体装置の一例の要部断面を模式的に図示している。
このようなピラー状の突起70群は、例えば、上記図6(A)及び図6(B)に示す工程において、基板10のパッド12b群上にそれぞれ、半田ボールに代えて、半田、Cu、Ni、Au等の金属ピラー部材を実装することで、得ることができる。或いは、基板10に対するメッキ処理により、パッド12b上に選択的に所定の金属を堆積することで、ピラー状の突起70群を得ることもできる。
ここでは一例として、基板10の縁まで達しないフィレット部41を図示するが、上記第3の実施の形態で述べた例に従い、基板10上にはその縁まで広がるフィレット部41が形成されてもよい。或いは、上記第4の実施の形態で述べた例に従い、基板10上にはピラー状の突起70群の配置領域(領域10ab)よりも内側にフィレット部41が形成されてもよい。
次に、第7の実施の形態について説明する。
電子部品90は、例えば、回路基板又は半導体装置である。回路基板には、プリント基板のほか、Siインターポーザ等の中継基板を用いることができる。半導体装置には、LSI等の半導体チップ、半導体チップとそれが実装されるパッケージ基板とを含む半導体パッケージ、半導体チップとそれが埋設される樹脂層と樹脂層上に設けられた再配線層とを含む擬似SoC(System on a Chip)等を用いることができる。
(付記1) 基板と、
前記基板の第1面に実装された半導体素子と、
前記第1面に設けられ、平面視で前記半導体素子の外側に位置する第1パッドと、
前記第1パッド上に設けられた第1突起と、
前記半導体素子及び前記第1突起の上方に設けられた放熱体と、
前記第1面と前記放熱体との間に設けられ、前記第1突起と前記放熱体とを接着する第1接着剤と
を含むことを特徴とする半導体装置。
前記第1パッド、前記第1突起及び前記第1接着剤を通じて前記基板と前記放熱体とが電気的に接続されることを特徴とする付記1に記載の半導体装置。
(付記4) 前記第1突起と前記放熱体とが離れていることを特徴とする付記1乃至3のいずれかに記載の半導体装置。
(付記6) 前記半導体素子は、前記第1面との間に設けられた接合部を通じて前記基板と電気的に接続され、
前記第1突起は、前記接合部と同一又は実質的に同一のサイズであることを特徴とする付記1乃至5のいずれかに記載の半導体装置。
前記第1突起は、一部が前記第2接着剤の前記延在部に接し、他部が前記第1接着剤に接することを特徴とする付記1乃至6のいずれかに記載の半導体装置。
前記第2パッド上に設けられた第2突起と
を更に含み、
前記第1接着剤は、前記第1突起及び前記第2突起と、前記放熱体とを接着することを特徴とする付記1乃至7のいずれかに記載の半導体装置。
前記第2パッド、前記第2突起及び前記第1接着剤を通じて前記基板と前記放熱体とが電気的に接続されることを特徴とする付記8に記載の半導体装置。
前記第1面に設けられ、平面視で前記第1パッドよりも外側に位置する第2パッドと、
前記第2パッド上に設けられた第2突起と
を更に含み、
前記第1接着剤は、前記第1突起及び前記第2突起と、前記放熱体とを接着し、
前記第1突起及び前記第2突起の、少なくとも前記第1突起は、前記第2接着剤の前記延在部に接することを特徴とする付記1乃至6のいずれかに記載の半導体装置。
前記第1面に設けられ、平面視で前記第1パッドよりも外側に位置する第2パッドと、
前記第2パッド上に設けられた第2突起と
を更に含み、
前記第1接着剤は、前記第1突起及び前記第2突起と、前記放熱体とを接着し、
前記第1突起は、平面視で前記第2接着剤の前記延在部よりも外側に位置することを特徴とする付記1乃至6のいずれかに記載の半導体装置。
前記領域に前記半導体素子を設ける工程と、
前記第1パッド上に第1突起を設ける工程と、
前記半導体素子及び前記第1突起が設けられた前記第1面に第1接着剤を設ける工程と、
前記第1面に設けられた前記半導体素子及び前記第1突起の上方に放熱体を設ける工程と、
前記第1接着剤を用いて、前記第1面に設けられた前記第1突起と、前記第1突起の上方に設けられた前記放熱体とを接着する工程と
を含むことを特徴とする半導体装置の製造方法。
前記第2接着剤は、平面視で前記半導体素子の側面から外側に延在し、前記第1突起の一部に接する延在部を含むことを特徴とする付記12又は13に記載の半導体装置の製造方法。
前記第1接着剤を設ける工程前に、前記第2パッド上に第2突起を設ける工程を更に含むことを特徴とする付記12乃至15のいずれかに記載の半導体装置の製造方法。
前記基板の第1面に実装された半導体素子と、
前記第1面に設けられ、平面視で前記半導体素子の外側に位置する第1パッドと、
前記第1パッド上に設けられた第1突起と、
前記半導体素子及び前記第1突起の上方に設けられた放熱体と、
前記第1面と前記放熱体との間に設けられ、前記第1突起と前記放熱体とを接着する第1接着剤と
を含む半導体装置と、
前記半導体装置と電気的に接続された電子部品と
を含むことを特徴とする電子装置。
10,110 基板
10a,110a 表面
10aa,10ab 領域
10b,110b 裏面
11,111 接地配線
12a,12b,12c,22,112,112b,122 パッド
13,91,113 端子
14,114 保護膜
15 部位
20,120 半導体素子
23,123 バンプ
30,130 放熱体
40,140 アンダーフィル樹脂
41,141 フィレット部
50,150 熱伝導材
60,160 接着剤
61 積層体
70,70A 突起
80 電子装置
90 電子部品
Claims (7)
- 基板と、
前記基板の第1面に実装された半導体素子と、
前記第1面に設けられ、平面視で前記半導体素子の外側に位置する第1パッドと、
前記第1パッド上に設けられた第1突起と、
前記半導体素子及び前記第1突起の上方に設けられた放熱体と、
前記第1面と前記放熱体との間に設けられ、前記第1突起と前記放熱体とを接着する第1接着剤と、
前記第1面と前記半導体素子との間に設けられた第1部分と、平面視で前記半導体素子の外側の前記第1面上に設けられた第2部分とを有する第2接着剤と
を含み、
前記第1接着剤は、前記第2部分上に設けられ、
前記第1突起は、前記第1接着剤及び前記第2部分中に設けられ、
前記第1パッド、前記第1突起及び前記第1接着剤が導電性であり、
前記第1パッド、前記第1突起及び前記第1接着剤を通じて前記基板と前記放熱体とが電気的に接続されることを特徴とする半導体装置。 - 前記放熱体は、前記第1面と対向する面が平坦面であることを特徴とする請求項1に記載の半導体装置。
- 前記第1突起と前記放熱体とが離れていることを特徴とする請求項1又は2に記載の半導体装置。
- 前記半導体素子は、前記第1面との間に設けられた接合部を通じて前記基板と電気的に接続され、
前記第1突起は、前記接合部と同一又は実質的に同一のサイズであることを特徴とする請求項1乃至3のいずれかに記載の半導体装置。 - 前記第1面に設けられ、平面視で前記第1パッドよりも外側に位置する第2パッドと、
前記第2パッド上に設けられた第2突起と
を更に含み、
前記第1接着剤は、前記第1突起及び前記第2突起と、前記放熱体とを接着することを特徴とする請求項1乃至4のいずれかに記載の半導体装置。 - 第1面に、半導体素子が実装される領域と、平面視で前記領域の外側に位置する第1パッドとを含む基板を準備する工程と、
前記領域に前記半導体素子を設ける工程と、
前記第1パッド上に第1突起を設ける工程と、
前記第1面と前記半導体素子との間の第1部分と、平面視で前記半導体素子の外側の前記第1面上の第2部分とを有する第2接着剤を設ける工程と、
前記半導体素子、前記第1突起及び前記第2接着剤が設けられた前記第1面に第1接着剤を設ける工程と、
前記第1面に設けられた前記半導体素子、前記第1突起及び前記第2接着剤の上方に放熱体を設ける工程と、
前記第1接着剤を用いて、前記第1面に設けられた前記第1突起と、前記第1突起の上方に設けられた前記放熱体とを接着する工程と
を含み、
前記第1接着剤は、前記第2部分上に設けられ、
前記第1突起は、前記第1接着剤及び前記第2部分中に設けられ、
前記第1パッド、前記第1突起及び前記第1接着剤が導電性であり、
前記第1パッド、前記第1突起及び前記第1接着剤を通じて前記基板と前記放熱体とが電気的に接続されることを特徴とする半導体装置の製造方法。 - 基板と、
前記基板の第1面に実装された半導体素子と、
前記第1面に設けられ、平面視で前記半導体素子の外側に位置する第1パッドと、
前記第1パッド上に設けられた第1突起と、
前記半導体素子及び前記第1突起の上方に設けられた放熱体と、
前記第1面と前記放熱体との間に設けられ、前記第1突起と前記放熱体とを接着する第1接着剤と、
前記第1面と前記半導体素子との間に設けられた第1部分と、平面視で前記半導体素子の外側の前記第1面上に設けられた第2部分とを有する第2接着剤と
を含み、
前記第1接着剤は、前記第2部分上に設けられ、
前記第1突起は、前記第1接着剤及び前記第2部分中に設けられ、
前記第1パッド、前記第1突起及び前記第1接着剤が導電性であり、
前記第1パッド、前記第1突起及び前記第1接着剤を通じて前記基板と前記放熱体とが電気的に接続される半導体装置と、
前記半導体装置と電気的に接続された電子部品と
を含むことを特徴とする電子装置。
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