JP5282113B2 - 基材フィルムおよび該基材フィルムを備えた粘着シート - Google Patents
基材フィルムおよび該基材フィルムを備えた粘着シート Download PDFInfo
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- JP5282113B2 JP5282113B2 JP2011062947A JP2011062947A JP5282113B2 JP 5282113 B2 JP5282113 B2 JP 5282113B2 JP 2011062947 A JP2011062947 A JP 2011062947A JP 2011062947 A JP2011062947 A JP 2011062947A JP 5282113 B2 JP5282113 B2 JP 5282113B2
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Classifications
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Landscapes
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- Medicinal Chemistry (AREA)
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesive Tapes (AREA)
- Polyurethanes Or Polyureas (AREA)
- Laminated Bodies (AREA)
Description
〔1〕半導体ウエハに貼付される粘着シートの基材フィルムであって、
(A)ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーとエネルギー線硬化性モノマーとを含む配合物をエネルギー線硬化させた硬化物からなる層と、
(B)熱可塑性樹脂からなる層とから構成される基材フィルム。
(A)ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーとエネルギー線硬化性モノマーとを含む配合物をエネルギー線硬化させた硬化物からなる層(以下、「エネルギー線硬化層」と略記することがある)と、
(B)熱可塑性樹脂からなる層(以下、「熱可塑性樹脂層」と略記することがある)とから構成されることを特徴としている。
エネルギー線硬化層(A)は、ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーとエネルギー線硬化性モノマーとを含む配合物をエネルギー線硬化させた硬化物である。
熱可塑性樹脂層(B)としては、ポリエチレンテレフタレート(PET)等のポリエステル樹脂、ポリエチレン(PE)、ポリプロピレン(PP)等のポリオレフィン系樹脂、ポリイミド(PI)、ポリエーテルエーテルケトン(PEEK)、ポリ塩化ビニル(PVC)、ポリ塩化ビニリデン系樹脂、ポリアミド系樹脂、ポリウレタン系樹脂、ポリスチレン系樹脂、アクリル系樹脂、フッ素系樹脂、セルロース系樹脂、ポリカーボネート系樹脂等の熱可塑性樹脂が使用される。これらの熱可塑性樹脂は単一層、または積層することによって複層品として用いることができる。
基材フィルムは、前記のように、エネルギー線硬化層(A)と熱可塑性樹脂層(B)とが積層されてなる。エネルギー線硬化層(A)と熱可塑性樹脂層(B)とは直接積層されていてもよく、接着剤層を介して接着されていてもよい。
粘着剤層(C)は、ウエハに対し適度な再剥離性があればその種類は特定されず、従来より公知の種々の粘着剤により形成され得る。このような粘着剤としては、何ら限定されるものではないが、たとえばゴム系、アクリル系、シリコーン系、ポリビニルエーテル等の粘着剤が用いられる。また、エネルギー線の照射により硬化して再剥離性となるエネルギー線硬化型粘着剤や、加熱発泡型、水膨潤型の粘着剤も用いることができる。
本発明に係る粘着シートは、上記基材フィルムの片面に粘着剤層(C)が形成されてなる。基材フィルムが、エネルギー線硬化層(A)の片面に熱可塑性樹脂層(B)が積層された2層構造の場合には、粘着剤層(C)はエネルギー線硬化層(A)の表面に設けられてなることが好ましい。 本発明に係る粘着シートは、テープ状、ラベル状などあらゆる形状をとり得る。
本発明の粘着シートは、下記に示すように半導体ウエハの加工に用いることが出来る。
(ウエハ裏面研削方法)
ウエハの裏面研削においては、表面に回路が形成された半導体ウエハの回路面に粘着シートを貼付して回路面を保護しつつウエハの裏面を研削し、所定厚みのウエハとする。
本発明の粘着シートはダイシングシートとして使用することもできる。
ダイシングシートとして使用する際は、ウエハに本発明の粘着シートを貼付して、ウエハを切断する。特に、ウエハの回路面に本発明の粘着シートを貼付して、回路面を粘着シートで保護しながらウエハを切断する場合に好適である。ダイシングシートの貼付は、マウンターと呼ばれる装置により行われるのが一般的だが特に限定はされない。
さらにまた、本発明の粘着シートは、いわゆる先ダイシング法による高バンプ付ウエハのチップ化において好ましく用いられ、具体的には、
バンプを有する回路が表面に形成された半導体ウエハ表面からそのウエハ厚さよりも浅い切込み深さの溝を形成し、
該回路形成面に、上記粘着シートを表面保護シートとして貼付し、
その後上記半導体ウエハの裏面研削をすることでウエハの厚みを薄くするとともに、最終的には個々のチップへの分割を行なう、
半導体チップの製造方法に好ましく用いられる。
本発明の粘着シートを用いることで、チップと粘着剤層との間に高い密着性が得られるため、回路面への研削水の滲入がなく、チップの汚染を防止できる。
直径8mm、厚さ3mmのエネルギー線硬化層を用意し、粘弾性測定装置(Rheometrics社製、装置名:DYNAMIC ANALYZER RDA II)を用いて1Hzで23℃での捻り貯蔵弾性率を測定した。
熱可塑性樹脂層、エネルギー線硬化層とアクリル系粘着剤層からなる粘着シートを、縦15mm×横15mmの形状に裁断した。粘着シートから剥離シートを取り除いて、表出した粘着剤層面に縦10mm×横10mm×厚み200μmのシリコンウエハからなるバンプ付チップ(バンプ高さ250μm、バンプピッチ500μm)をチップ平面全体のバンプが均等に接触するように0.6mm/分の速度で、万能引張圧縮試験機[インストロン社製、製品名「インストロン5581型」]で深さ140μmまでバンプを押し込んだ。その際に粘着シートからシリコンウエハチップにかかる荷重(圧縮荷重)を測定した。測定は温度23℃、相対湿度50%の環境下で行った。測定された圧縮荷重と押し込まれたチップ平面全体のバンプの表面積から、圧縮応力を算出した。
なお、バンプの直径を280μmとし、バンプの半分まで押し込んだ時の荷重を測定していると仮定した。140μm押し込んだ際のチップ平面全体のバンプの表面積(39.9mm2)は、1バンプの表面積とバンプの数(324個)とから算出され、圧縮応力は以下の式(1)から算出される。
圧縮応力=圧縮荷重/チップ平面全体のバンプの表面積 ・・・(1)
ソルダーバンプ付ウエハ(チップサイズ縦10mm×横10mmのチップが整列している8インチシリコンウエハ、バンプ高さ250μm、バンプピッチ500μm、全厚720μm)を粘着シートに貼付、固定し、厚み250μmまたは400μmまで研削した後((株)ディスコ社製 グラインダーDGP8760を使用)、ウエハの裏面を目視にて観察し、ウエハ裏面のバンプに対応する部分にディンプルが発生していないか確認した。ディンプルが発生していないものをA、わずかにディンプルが発生しているのが確認されたが実用上問題ないものをB、明らかにディンプルが発生したものをCとした。
また、ウエハのクラック(ウエハのひび、割れ)の有無を目視にて確認した。
バンプ高さ250μmのバンプ付ウエハに粘着シートをリンテック(株)製ラミネーター「RAD3510」を用いて貼付し、直後にテクロック社製 定圧厚さ測定器:PG−02にてバンプの有る部分の全厚“A”(ウエハの裏面から粘着シートの基材フィルム表面までの距離)、バンプが無い部分の全厚“B”を測定し、「A−B」を高低差として算出した。高低差が小さいほど、バンプ高さに起因する凹凸が粘着シートによって緩和されていることを意味する。
ウエハ表面に粘着シートを貼付した後、水を噴霧しつつウエハ裏面を全厚250μmまたは400μmまで研削し、ウエハ表面から粘着シートを剥がし、ウエハ表面への研削水の浸入の有無を光学デジタル顕微鏡(倍率100倍)にて確認した。
バンプ付ウエハの回路面に粘着シートをリンテック(株)製ラミネーター「RAD3510」を用いて貼付し、直後に光学デジタル顕微鏡(倍率300倍)にて観察し、バンプ間の埋め込み距離を測定した。なお、バンプ間の埋め込み距離は、次のように定義する。
水酸基価から算出した分子量4000のポリプロピレングリコール(以下PPG4000と記述)とイソホロンジイソシアネート(以下IPDIと記述)を重合させて得られる末端イソシアナートウレタンプレポリマーの末端に、2−ヒドロキシエチルメタクリレート(以下HEMAと記述)を反応させ、重量平均分子量が47000のポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーを得た。なお、当該重量平均分子量は、市販の分子量測定機(本体製品名「HLC−8220GPC」、東ソー(株)製;カラム製品名「TSKGel SuperHZM-M」、東ソー(株)製;展開溶媒 テトラヒドロフラン)を用いて得た値である(以下、同様。)。
実施例1において、エネルギー線硬化層の厚みを350μmとした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。
実施例1において、エネルギー線硬化層の厚みを400μmとした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。
実施例1において、ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーの重量平均分子量を53000とした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。なお、配合物(常温液体のエネルギー線硬化型組成物)の粘度η=4800mPa・s、25℃であった。
実施例1において、イソホロンジイソシアネートに代えて、水添キシリレンジイソシアネート(以下HXDIと記述)を用い、ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーの重量平均分子量を46000とした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。なお、配合物(常温液体のエネルギー線硬化型組成物)の粘度η=3400mPa・s、25℃であった。
実施例1において、イソホロンジイソシアネートに代えて、ヘキサメチレンジイソシアネート(以下HDIと記述)を用い、ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーの重量平均分子量を45000とした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。なお、配合物(常温液体のエネルギー線硬化型組成物)の粘度η=3300mPa・s、25℃であった。
実施例1において、PPG4000に代えて、分子量8000のポリプロピレングリコール(以下PPG8000と記述)を用い、ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーの重量平均分子量を68000とした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。なお、配合物(常温液体のエネルギー線硬化型組成物)の粘度η=3700mPa・s、25℃であった。
実施例1において、PPG4000に代えて、分子量3000のポリ(オキシテトラメチレン)グリコール(以下PTMG3000と記述)を用い、ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーの重量平均分子量を45000とした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。なお、配合物(常温液体のエネルギー線硬化型組成物)の粘度η=4100mPa・s、25℃であった。
実施例1で用いたポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーに代えて、重量平均分子量が40000のポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーを用いた以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。なお、配合物(常温液体のエネルギー線硬化型組成物)の粘度η=2200mPa・s、25℃であった。
実施例1において、PPG4000に代えて、分子量2000のポリプロピレングリコール(以下PPG2000と記述)を用い、ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーの重量平均分子量を41000とした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。なお、配合物(常温液体のエネルギー線硬化型組成物)の粘度η=2300mPa・s、25℃であった。
実施例1において、PPG4000に代えて、分子量10000のポリプロピレングリコール(以下PPG10000と記述)を用い、ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーの重量平均分子量を44000とした以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。なお、配合物(常温液体のエネルギー線硬化型組成物)の粘度η=2500mPa・s、25℃であった。
実施例1で用いたポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーに代えて、ポリエステル系ウレタン(メタ)アクリレートオリゴマー(重量平均分子量4000)を用い、実施例1と同様の配合で配合物(粘度η=4500mPa・s、25℃)を得た。得られた配合物を使用した以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。
実施例1で用いたポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーに代えて、ポリカーボネート系ウレタン(メタ)アクリレートオリゴマー(重量平均分子量6000)を用い、実施例1と同様の配合で配合物(粘度η=4500mPa・s、25℃)を得た。得られた配合物を使用した以外は、実施例1と同様の方法にて粘着シートを得、評価を行った。結果を表1及び表2に示す。
Claims (4)
- 半導体ウエハに貼付される粘着シートの基材フィルムであって、
(A)ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーとエネルギー線硬化性モノマーとを含む配合物をエネルギー線硬化させた硬化物からなる層と、
(B)熱可塑性樹脂からなる層とから構成され、
前記ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーのポリエーテル型ポリオール部位の分子量が1000〜10000である基材フィルム。 - 前記ポリエーテルポリオール系ウレタン(メタ)アクリレートオリゴマーの重量平均分子量が、40000〜100000である請求項1に記載の基材フィルム。
- 請求項1または2に記載の基材フィルム上に、さらに粘着剤層(C)を備える粘着シート。
- 23℃における圧縮応力が0.05〜1.0MPaである請求項3に記載の粘着シート。
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JP5715330B2 (ja) | 2009-08-04 | 2015-05-07 | 株式会社ブリヂストン | 光硬化性樹脂組成物及びそれからなる粘着シート |
JP2011054940A (ja) * | 2009-08-07 | 2011-03-17 | Nitto Denko Corp | 半導体ウェハ保持保護用粘着シート及び半導体ウェハの裏面研削方法 |
JP2011105858A (ja) * | 2009-11-18 | 2011-06-02 | Nitto Denko Corp | 粘着シート |
JP5762781B2 (ja) | 2011-03-22 | 2015-08-12 | リンテック株式会社 | 基材フィルムおよび該基材フィルムを備えた粘着シート |
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US9670382B2 (en) | 2017-06-06 |
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US20140065414A1 (en) | 2014-03-06 |
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