JP6470428B2 - 電子部品搭載用パッケージおよび電子装置 - Google Patents
電子部品搭載用パッケージおよび電子装置 Download PDFInfo
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- JP6470428B2 JP6470428B2 JP2017552680A JP2017552680A JP6470428B2 JP 6470428 B2 JP6470428 B2 JP 6470428B2 JP 2017552680 A JP2017552680 A JP 2017552680A JP 2017552680 A JP2017552680 A JP 2017552680A JP 6470428 B2 JP6470428 B2 JP 6470428B2
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- electronic component
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- component mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/03—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect
- G02F1/0327—Operation of the cell; Circuit arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/03—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect
- G02F1/035—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect in an optical waveguide structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
1a・・・・・・本体部
1b・・・・・・凹部
1c・・・・・・切り欠き部
2・・・・・・・貫通孔
3・・・・・・・同軸コネクタ
3a・・・・・・端子
3b・・・・・・保持部材
3c・・・・・・封止材
4・・・・・・・回路基板
5・・・・・・・基台
5a・・・・・・挿通孔
6・・・・・・・フレキシブル基板
6a・・・・・・遊端部
6b・・・・・・固定端部
7・・・・・・・突条部
7a・・・・・・面取り部
8・・・・・・・接合材
9・・・・・・・溝
10・・・・・・面取り部
11・・・・・・電子部品
12・・・・・・ボンディングワイヤ
13・・・・・・蓋体
20・・・・・・電子部品搭載用パッケージ
30・・・・・・電子装置
Claims (3)
- 電子部品が収容される凹部を有する上面、および切り欠き部を有する下面を有し、前記凹部の底面から前記切り欠き部の底面にかけて貫通孔がある本体部と、前記切り欠き部の前記底面に位置し、前記本体部の切り欠かれた側面側の端部に沿って延在する突条部とを含む筐体と、
前記切り欠き部に設けられた同軸コネクタであって、前記貫通孔を通って前記凹部内に突出する上端と前記切り欠き部内に突出する下端とを有する端子を含む同軸コネクタと、
前記切り欠き部内から前記切り欠き部外に延在するフレキシブル基板であって、前記端子の前記下端に接合された固定端部と、該第固定端部と反対側の遊端部とを有しているとともに、前記突条部に当接してたわんでいるフレキシブル基板と、を備え、
前記貫通孔は、前記切り欠き部の前記底面側の開口面積が、前記凹部の前記底面側の開口面積よりも大きく、
前記同軸コネクタは、前記端子が挿通される孔を有する保持部材を有し、該保持部材は、前記貫通孔に収容されており、
前記突条部に沿って延びる溝が、前記切り欠き部の底面の前記突条部と前記同軸コネクタとの間の領域にあり、前記溝は、前記貫通孔に連通している、電子部品搭載用パッケージ。 - 前記突条部は、前記同軸コネクタに臨む内側の角部に面取り部を有する直方体形状であり、前記面取り部が前記フレキシブル基板に当接している請求項1に記載の電子部品搭載用パッケージ。
- 請求項1または2に記載の電子部品搭載用パッケージと、
前記電子部品搭載用パッケージの前記凹部に収容された電子部品と、
前記電子部品を覆うように前記電子部品搭載用パッケージに接合された蓋体と、を備える電子装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015231706 | 2015-11-27 | ||
JP2015231706 | 2015-11-27 | ||
PCT/JP2016/084731 WO2017090651A1 (ja) | 2015-11-27 | 2016-11-24 | 電子部品搭載用パッケージおよび電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017090651A1 JPWO2017090651A1 (ja) | 2018-06-07 |
JP6470428B2 true JP6470428B2 (ja) | 2019-02-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017552680A Active JP6470428B2 (ja) | 2015-11-27 | 2016-11-24 | 電子部品搭載用パッケージおよび電子装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10136517B2 (ja) |
JP (1) | JP6470428B2 (ja) |
CN (1) | CN107924880B (ja) |
WO (1) | WO2017090651A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111164836B (zh) | 2017-08-03 | 2023-05-12 | 安费诺有限公司 | 用于低损耗互连***的连接器 |
JP6965060B2 (ja) * | 2017-08-28 | 2021-11-10 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
JP7013879B2 (ja) * | 2018-01-12 | 2022-02-01 | 住友大阪セメント株式会社 | 光変調器、及びそれを用いた光送信装置 |
CN112514175B (zh) | 2018-04-02 | 2022-09-09 | 安达概念股份有限公司 | 受控阻抗顺应性线缆终端头 |
JP7240160B2 (ja) * | 2018-12-11 | 2023-03-15 | 新光電気工業株式会社 | ステム |
WO2020138209A1 (ja) * | 2018-12-26 | 2020-07-02 | 京セラ株式会社 | 配線基体、電子部品収納用パッケージおよび電子装置 |
CN117175250A (zh) | 2019-01-25 | 2023-12-05 | 富加宜(美国)有限责任公司 | 被配置用于线缆连接到中板的i/o连接器 |
CN117175239A (zh) | 2019-01-25 | 2023-12-05 | 富加宜(美国)有限责任公司 | 插座连接器和电连接器 |
CN110459523A (zh) * | 2019-07-23 | 2019-11-15 | 中国科学技术大学 | 一体化信号连接结构及量子芯片封装盒体 |
CN110474192A (zh) * | 2019-07-23 | 2019-11-19 | 中国科学技术大学 | 基于过盈配合的信号连接结构及量子芯片封装盒体 |
WO2021055584A1 (en) | 2019-09-19 | 2021-03-25 | Amphenol Corporation | High speed electronic system with midboard cable connector |
CN113258325A (zh) * | 2020-01-28 | 2021-08-13 | 富加宜(美国)有限责任公司 | 高频中板连接器 |
Family Cites Families (14)
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TW311267B (ja) * | 1994-04-11 | 1997-07-21 | Raychem Ltd | |
IL113065A (en) * | 1994-04-11 | 2000-06-01 | Raychem Corp | Sealed electronic packaging and a method for environmental protection of active electronics |
TW518806B (en) * | 2001-01-12 | 2003-01-21 | Northrop Grumman Corp | High speed, high density interconnect system for differential and single-ended transmission applications |
US6843657B2 (en) * | 2001-01-12 | 2005-01-18 | Litton Systems Inc. | High speed, high density interconnect system for differential and single-ended transmission applications |
KR20060080756A (ko) * | 2005-01-06 | 2006-07-11 | 삼성전자주식회사 | 신호전송필름, 이를 갖는 표시장치 및 이의 제조 방법 |
JP5682182B2 (ja) | 2010-08-30 | 2015-03-11 | 富士通オプティカルコンポーネンツ株式会社 | 光変調器モジュール |
US8836587B2 (en) * | 2012-03-30 | 2014-09-16 | Apple Inc. | Antenna having flexible feed structure with components |
JP6122309B2 (ja) * | 2013-02-23 | 2017-04-26 | 京セラ株式会社 | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP6258724B2 (ja) * | 2013-02-27 | 2018-01-10 | 京セラ株式会社 | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP6039470B2 (ja) * | 2013-03-14 | 2016-12-07 | 京セラ株式会社 | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
JP2015172682A (ja) * | 2014-03-12 | 2015-10-01 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
JP6430160B2 (ja) * | 2014-07-07 | 2018-11-28 | 日本オクラロ株式会社 | 光モジュール及び光モジュールの製造方法 |
JP5949858B2 (ja) * | 2014-08-29 | 2016-07-13 | 住友大阪セメント株式会社 | 光変調器、及び光スイッチ |
JP6203802B2 (ja) | 2015-09-30 | 2017-09-27 | 住友大阪セメント株式会社 | 光変調器 |
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2016
- 2016-11-24 WO PCT/JP2016/084731 patent/WO2017090651A1/ja active Application Filing
- 2016-11-24 US US15/754,670 patent/US10136517B2/en active Active
- 2016-11-24 JP JP2017552680A patent/JP6470428B2/ja active Active
- 2016-11-24 CN CN201680047050.2A patent/CN107924880B/zh active Active
Also Published As
Publication number | Publication date |
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CN107924880B (zh) | 2020-11-24 |
WO2017090651A1 (ja) | 2017-06-01 |
US10136517B2 (en) | 2018-11-20 |
JPWO2017090651A1 (ja) | 2018-06-07 |
CN107924880A (zh) | 2018-04-17 |
US20180255641A1 (en) | 2018-09-06 |
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