JP6238456B2 - チップ電子部品及びその実装基板 - Google Patents
チップ電子部品及びその実装基板 Download PDFInfo
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- JP6238456B2 JP6238456B2 JP2014232500A JP2014232500A JP6238456B2 JP 6238456 B2 JP6238456 B2 JP 6238456B2 JP 2014232500 A JP2014232500 A JP 2014232500A JP 2014232500 A JP2014232500 A JP 2014232500A JP 6238456 B2 JP6238456 B2 JP 6238456B2
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- 239000004020 conductor Substances 0.000 claims description 291
- 238000007747 plating Methods 0.000 claims description 121
- 239000000758 substrate Substances 0.000 claims description 61
- 238000009713 electroplating Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 description 38
- 239000010409 thin film Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 239000000696 magnetic material Substances 0.000 description 10
- 229910000859 α-Fe Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000007429 general method Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
以下では、本発明の一実施形態によるチップ電子部品を説明するにあたり、特に、薄膜型インダクタを例に挙げて説明するが、本発明はこれに制限されない。
図8は図1のチップ電子部品が印刷回路基板に実装された形状を示した斜視図である。
23 絶縁基板
31、32 外部電極
42、44 コイル導体パターン
42'、44' 最内側コイル導体パターン
42''、44'' 内部コイル導体パターン
42'''、44''' 最外側コイル導体パターン
42a、44a パターンめっき層
42b、44b 電解めっき層
46 ビア電極
50 磁性体本体
200 実装基板
210 印刷回路基板
221、222 第1及び第2電極パッド
230 はんだ
Claims (16)
- 絶縁基板、及び前記絶縁基板の少なくとも一面に形成されるコイル導体パターンを含む磁性体本体と、
前記コイル導体パターンの端部と連結されるように前記磁性体本体の両端部に形成される外部電極と、を含み、
前記磁性体本体の長さ方向の断面において、前記コイル導体パターンのうち最内側コイル導体パターンの厚さは残りのコイル導体パターンの厚さより薄く、
前記コイル導体パターンのうち最内側コイル導体パターンはパターンめっき層で構成され、残りのコイル導体パターンはパターンめっき層、及び前記パターンめっき層上に形成された電解めっき層を含む、チップ電子部品。 - 前記コイル導体パターンのうち最内側コイル導体パターンの幅をWo1、最外側コイル導体パターンの幅をWo2、及び前記最外側コイル導体パターンと最内側コイル導体パターンとの間の内部コイル導体パターンの幅をWiとすると、Wo1<Wi<Wo2を満たす、請求項1に記載のチップ電子部品。
- 前記コイル導体パターンのうち最外側コイル導体パターンと最内側コイル導体パターンとの間の内部コイル導体パターンの幅は同一である、請求項1または2に記載のチップ電子部品。
- 絶縁基板、及び前記絶縁基板の少なくとも一面に形成されるコイル導体パターンを含む磁性体本体と、
前記コイル導体パターンの端部と連結されるように前記磁性体本体の両端部に形成される外部電極と、を含み、
前記磁性体本体の長さ方向の断面において、前記コイル導体パターンのうち最内側コイル導体パターンの幅をWo1、及び隣接する内部コイル導体パターンの幅をWiとすると、Wo1<Wiを満たし、
前記コイル導体パターンのうち最内側コイル導体パターンはパターンめっき層で構成され、残りのコイル導体パターンはパターンめっき層、及び前記パターンめっき層上に形成された電解めっき層を含む、チップ電子部品。 - 前記コイル導体パターンのうち最外側コイル導体パターンの幅をWo2とすると、Wo2>Wiを満たす、請求項4に記載のチップ電子部品。
- 前記コイル導体パターンのうち最外側コイル導体パターンと最内側コイル導体パターンとの間の内部コイル導体パターンの幅は同一である、請求項4または5に記載のチップ電子部品。
- 前記コイル導体パターンのうち最内側コイル導体パターンの厚さは、残りのコイル導体パターンの厚さより薄い、請求項4から6のいずれか一項に記載のチップ電子部品。
- 絶縁基板、及び前記絶縁基板の少なくとも一面に形成されるコイル導体パターンを含む磁性体本体と、
前記コイル導体パターンの端部と連結されるように前記磁性体本体の両端部に形成される外部電極と、を含み、
前記磁性体本体の長さ方向の断面において、前記コイル導体パターンのうち最内側コイル導体パターンの幅をWo1、及び最外側コイル導体パターンの幅をWo2とすると、Wo1<Wo2を満たし、
前記コイル導体パターンのうち最内側コイル導体パターンはパターンめっき層で構成され、残りのコイル導体パターンはパターンめっき層、及び前記パターンめっき層上に形成された電解めっき層を含む、チップ電子部品。 - 前記コイル導体パターンのうち最外側コイル導体パターンと最内側コイル導体パターンとの間の内部コイル導体パターンの幅をWiとすると、Wo1<Wi<Wo2を満たす、請求項8に記載のチップ電子部品。
- 前記コイル導体パターンのうち最外側コイル導体パターンと最内側コイル導体パターンとの間の内部コイル導体パターンの幅は同一である、請求項8または9に記載のチップ電子部品。
- 前記コイル導体パターンのうち最内側コイル導体パターンの厚さは、残りのコイル導体パターンの厚さより薄い、請求項8から10のいずれか一項に記載のチップ電子部品。
- 絶縁基板、及び前記絶縁基板の少なくとも一面に形成されるコイル導体パターンを含む磁性体本体と、
前記コイル導体パターンの端部と連結されるように前記磁性体本体の両端部に形成される外部電極と、を含み、
前記磁性体本体の長さ方向の断面において、前記コイル導体パターンのうち最内側コイル導体パターンはパターンめっき層で構成され、残りのコイル導体パターンはパターンめっき層、及び前記パターンめっき層上に形成された電解めっき層を含む、チップ電子部品。 - 前記コイル導体パターンのうち最内側コイル導体パターンの幅をWo1、最外側コイル導体パターンの幅をWo2、及び前記最外側コイル導体パターンと最内側コイル導体パターンとの間の内部コイル導体パターンの幅をWiとすると、Wo1<Wi<Wo2を満たす、請求項12に記載のチップ電子部品。
- 前記コイル導体パターンのうち最外側コイル導体パターンと最内側コイル導体パターンとの間の内部コイル導体パターンの幅は同一である、請求項12または13に記載のチップ電子部品。
- 前記コイル導体パターンのうち最内側コイル導体パターンの厚さは、残りのコイル導体パターンの厚さより薄い、請求項12から14のいずれか一項に記載のチップ電子部品。
- 上部に第1及び第2電極パッドを有する印刷回路基板と、
前記印刷回路基板上に設置された請求項1から15のいずれか一項に記載のチップ電子部品と、を含む、チップ電子部品の実装基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140060769A KR102004791B1 (ko) | 2014-05-21 | 2014-05-21 | 칩 전자부품 및 그 실장기판 |
KR10-2014-0060769 | 2014-05-21 |
Publications (2)
Publication Number | Publication Date |
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JP2015220452A JP2015220452A (ja) | 2015-12-07 |
JP6238456B2 true JP6238456B2 (ja) | 2017-11-29 |
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