JP6121371B2 - チップ電子部品及びその実装基板 - Google Patents
チップ電子部品及びその実装基板 Download PDFInfo
- Publication number
- JP6121371B2 JP6121371B2 JP2014169125A JP2014169125A JP6121371B2 JP 6121371 B2 JP6121371 B2 JP 6121371B2 JP 2014169125 A JP2014169125 A JP 2014169125A JP 2014169125 A JP2014169125 A JP 2014169125A JP 6121371 B2 JP6121371 B2 JP 6121371B2
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- JP
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- Prior art keywords
- plating layer
- coil conductor
- electronic component
- chip electronic
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 60
- 238000007747 plating Methods 0.000 claims description 59
- 238000009713 electroplating Methods 0.000 claims description 50
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 24
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 21
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 21
- 239000010931 gold Substances 0.000 claims description 14
- 239000010936 titanium Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 description 27
- 239000010408 film Substances 0.000 description 12
- 239000010409 thin film Substances 0.000 description 12
- 229910000859 α-Fe Inorganic materials 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000011160 research Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
図4は、図1のチップ電子部品が印刷回路基板に実装された状態を図示した斜視図である。
23 絶縁基板
31、32 外部電極
42、44 コイル導体パターン
42a、44a パターンめっき層
42b、44b 電解めっき層
42c、44c 異方性めっき層
46 ビア電極
50 磁性体本体
200 実装基板
210 印刷回路基板
221、222 第1及び第2電極パッド
230 半田
Claims (8)
- 絶縁基板、及び前記絶縁基板の少なくとも一面に形成されたコイル導体パターンを有する磁性体本体と、
前記コイル導体パターンの端部と連結されるように前記磁性体本体の両端部に形成された外部電極と、を含み、
前記コイル導体パターンは、パターンめっき層と、前記パターンめっき層を覆うように形成された電解めっき層と、前記電解めっき層上に形成された異方性めっき層と、を含み、前記磁性体本体の長さ‐厚さ方向の断面において、前記電解めっき層は、前記絶縁基板に隣接した下辺の長さが上辺の長さより長く、前記異方性めっき層は前記絶縁基板上から形成されることを特徴とする、チップ電子部品。 - 前記電解めっき層の断面形状は台形状であることを特徴とする、請求項1に記載のチップ電子部品。
- 前記電解めっき層の上面は平面であることを特徴とする、請求項1に記載のチップ電子部品。
- 前記コイル導体パターンは、銀(Ag)、パラジウム(Pd)、アルミニウム(Al)、ニッケル(Ni)、チタン(Ti)、金(Au)、銅(Cu)、及び白金(Pt)からなる群から選択される何れか一つ以上を含有することを特徴とする、請求項1に記載のチップ電子部品。
- 上部に第1及び第2電極パッドを有する印刷回路基板と、
前記印刷回路基板上に設けられたチップ電子部品と、を含み、
前記チップ電子部品は、絶縁基板、及び前記絶縁基板の少なくとも一面に形成されたコイル導体パターンを有する磁性体本体と、前記コイル導体パターンの端部と連結されるように前記磁性体本体の両端部に形成された外部電極と、を含み、前記コイル導体パターンは、パターンめっき層と、前記パターンめっき層を覆うように形成された電解めっき層と、前記電解めっき層上に形成された異方性めっき層と、を含み、前記磁性体本体の長さ‐厚さ方向の断面において、前記電解めっき層は、前記絶縁基板に隣接した下辺の長さが上辺の長さより長く、前記異方性めっき層は前記絶縁基板上から形成されることを特徴とする、チップ電子部品の実装基板。 - 前記電解めっき層の断面形状は台形状であることを特徴とする、請求項5に記載のチップ電子部品の実装基板。
- 前記電解めっき層の上面は平面であることを特徴とする、請求項5に記載のチップ電子部品の実装基板。
- 前記コイル導体パターンは、銀(Ag)、パラジウム(Pd)、アルミニウム(Al)、ニッケル(Ni)、チタン(Ti)、金(Au)、銅(Cu)、及び白金(Pt)からなる群から選択される何れか一つ以上を含有することを特徴とする、請求項5に記載のチップ電子部品の実装基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140066924A KR101532172B1 (ko) | 2014-06-02 | 2014-06-02 | 칩 전자부품 및 그 실장기판 |
KR10-2014-0066924 | 2014-06-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015228479A JP2015228479A (ja) | 2015-12-17 |
JP6121371B2 true JP6121371B2 (ja) | 2017-04-26 |
Family
ID=53519973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014169125A Active JP6121371B2 (ja) | 2014-06-02 | 2014-08-22 | チップ電子部品及びその実装基板 |
Country Status (3)
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---|---|
JP (1) | JP6121371B2 (ja) |
KR (1) | KR101532172B1 (ja) |
CN (1) | CN105185507B (ja) |
Families Citing this family (10)
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KR101719908B1 (ko) * | 2015-07-01 | 2017-03-24 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
KR101751117B1 (ko) * | 2015-07-31 | 2017-06-26 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
KR102632366B1 (ko) * | 2016-09-01 | 2024-02-02 | 삼성전기주식회사 | 코일 부품 |
KR101981466B1 (ko) * | 2016-09-08 | 2019-05-24 | 주식회사 모다이노칩 | 파워 인덕터 |
KR101862503B1 (ko) * | 2017-01-06 | 2018-05-29 | 삼성전기주식회사 | 인덕터 및 그의 제조방법 |
KR20190038972A (ko) * | 2017-10-02 | 2019-04-10 | 엘지이노텍 주식회사 | 무선충전코일, 그 제조방법 및 이를 구비한 무선충전장치 |
KR102475201B1 (ko) * | 2017-10-24 | 2022-12-07 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
KR102232600B1 (ko) * | 2017-12-15 | 2021-03-26 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
KR102381269B1 (ko) * | 2020-04-27 | 2022-03-30 | 삼성전기주식회사 | 코일 부품 |
TWI760275B (zh) | 2021-08-26 | 2022-04-01 | 奇力新電子股份有限公司 | 電感元件及其製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719950B2 (ja) * | 1992-03-06 | 1995-03-06 | 株式会社エス・エム・シー | 配線基板およびその製造方法 |
JP2001028110A (ja) * | 1999-07-13 | 2001-01-30 | Hitachi Ltd | 磁気抵抗効果ヘッドの製造方法と磁気抵抗効果ヘッド及びそれを用いた磁気ディスク装置 |
JP2004342645A (ja) * | 2003-05-13 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 平面コイルの製造方法 |
JP2005005298A (ja) * | 2003-06-09 | 2005-01-06 | Tdk Corp | 積層型チップインダクタとその製造方法 |
JP2006278909A (ja) * | 2005-03-30 | 2006-10-12 | Tdk Corp | コイル基材、コイル部品及びその製造方法 |
CN103180919B (zh) * | 2010-10-21 | 2016-05-18 | Tdk株式会社 | 线圈部件及其制造方法 |
KR20130031082A (ko) * | 2011-09-20 | 2013-03-28 | 삼성전기주식회사 | 적층형 인덕터의 제조 방법 |
US9287034B2 (en) * | 2012-02-27 | 2016-03-15 | Ibiden Co., Ltd. | Printed wiring board, inductor component, and method for manufacturing inductor component |
JP6060508B2 (ja) * | 2012-03-26 | 2017-01-18 | Tdk株式会社 | 平面コイル素子およびその製造方法 |
KR20140020505A (ko) * | 2012-08-09 | 2014-02-19 | 삼성전기주식회사 | 인덕터 소자 및 이의 제조 방법 |
KR101506910B1 (ko) * | 2012-09-27 | 2015-03-30 | 티디케이가부시기가이샤 | 이방성 도금 방법 및 박막 코일 |
JP6102578B2 (ja) * | 2012-09-27 | 2017-03-29 | Tdk株式会社 | 異方性めっき方法 |
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2014
- 2014-06-02 KR KR1020140066924A patent/KR101532172B1/ko active IP Right Grant
- 2014-08-22 JP JP2014169125A patent/JP6121371B2/ja active Active
- 2014-09-12 CN CN201410465055.XA patent/CN105185507B/zh active Active
Also Published As
Publication number | Publication date |
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CN105185507A (zh) | 2015-12-23 |
JP2015228479A (ja) | 2015-12-17 |
KR101532172B1 (ko) | 2015-06-26 |
CN105185507B (zh) | 2017-11-14 |
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