JP5923641B2 - 3次元メモリおよびその形成方法 - Google Patents
3次元メモリおよびその形成方法 Download PDFInfo
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- JP5923641B2 JP5923641B2 JP2015083308A JP2015083308A JP5923641B2 JP 5923641 B2 JP5923641 B2 JP 5923641B2 JP 2015083308 A JP2015083308 A JP 2015083308A JP 2015083308 A JP2015083308 A JP 2015083308A JP 5923641 B2 JP5923641 B2 JP 5923641B2
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- memory
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- memory device
- dielectric
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 229910052814 silicon oxide Inorganic materials 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000012535 impurity Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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- H—ELECTRICITY
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- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/50—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the boundary region between the core region and the peripheral circuit region
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/10—EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
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- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/50—EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
- H10B63/34—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors of the vertical channel field-effect transistor type
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- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
- H10B63/84—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays
- H10B63/845—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays the switching components being connected to a common vertical conductor
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- G—PHYSICS
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Description
本特許出願は、参照により本明細書に組み込まれる、2010年6月28日出願の米国特許出願第12/825,211号の優先権の利益を主張するものである。
Integration on the same Plane(PIPE)」(2008 Symposium on VLSI Technology Digest of Technical Papers、22〜23ページ)の論文で説明されている。
よって互いに分離されている、ことを特徴とする。
32は、不揮発性メモリデバイス内のメモリセルストリングの共通ソース270に結合される、ノード(例えば、ドレイン)を有する。
2つの区画は、本体391の2つの両側上にのみ配置される。
リシリコン、または別の導電材料を含み得る。
1が形成された後、例えば、ピラー705、ならびにトレンチ711、712、および713(図7)の上に、導電材料を付着させ、次にその導電材料の一部分を除去(例えば、エッチング)することによって、選択線841、842、843、および844を形成し、図8に示す構造を有する、選択線841、842、843、および844を形成することができる。選択線841、842、843、および844のための導電材料の例としては、ポリシリコン、金属、あるいは、TiNおよびTaNなどの、他の導電材料が挙げられる。
253、および253へと移動することができる(例えば、局所消去)。
2、および3413の形成は、基材3201、材料3301、および材料3401の諸部分を除去(例えば、エッチング)する工程を含み得る。デバイス構造体3460は、トレンチ3411、3412、および3413の形成の結果として形成される。
セル210、211、212、2910、2911、2912、3810、3811、および3812などの装置の説明は、様々な実施形態の構造の、全般的な理解を提供することを意図するものであり、本明細書で説明される構造を利用することができる装置の、全ての要素および機構の、完全な説明を提供することを意図するものではない。
102 メモリアレイ
110 メモリセル
116 I/O回路
118 メモリ制御ユニット
132 行デコーダ
134 列デコーダ
140 センス増幅器回路
200 メモリデバイス
210、211、212 メモリセル
215、216 ストリング
221、222、223 制御ゲート
231、232 トランジスタ
241、242、243、244 選択線
251、252、253 データ線
261、262、263 選択線
270 共通ソース
301、302、303 デバイスレベル
329、349、359 コンタクト
391 本体
420 空洞
421、427 誘電体
430 メモリ素子
441 チャネル
442 導電材料部分
500 メモリデバイス
501、502 材料
503 基材(基板)
504、505 材料
511、512 トレンチ
605 デバイス構造体
651、652、653 データ線
705 ピラー
711、712、713 トレンチ
831 誘電体
833 ドープ領域
841、842、843、844 選択線
941、942、943、944 選択線
1001、1003、1005、1007 材料
1002、1004、1006 材料
1041、1042、1043 間隙
1101 開口部(穴)
1110、1120 空洞
1220 空洞
1221、1222、1223 制御ゲート
1225 側壁
1421 誘電体
1422、1423、1424 材料
1425 側壁
1430 メモリ素子
1627 誘電体
1801 開口部
1841 チャネル
2001 導電材料
2101 誘電材料
2201 開口部(穴)
2241、2260 導電材料部分
2301 ドープ領域
2401 誘電体
2402 チャネル
2501 導電材料
2601 ドープ領域
2602 トレンチ
2661、2662、2663 選択線
2701 材料
2770 共通ソース
2910、2911、2912 メモリセル
2929、2949、2959 コンタクト
3000 メモリデバイス
3070 共通ソース
3101 基材(基板)
3200 メモリデバイス
3201 基材(基板)
3211、3212、3213 トレンチ
3270、3271 基材部分
3301 材料
3401 材料
3411、3412、3413 トレンチ
3460 デバイス構造体
3501 ドープ領域
3502 材料
3561、3562、3563 選択線
3601 材料
3701 溝
3810、3811、3812 メモリセル
3821、3822、3823 制御ゲート
3851、3852、3853 データ線
Claims (3)
- 導電材料層の形成と当該導電材料層上への誘電材料層の形成とを複数回繰り返し、複数の導電材料層および複数の誘電材料層とを形成する工程と、
前記複数の導電材料層および前記複数の誘電材料層を垂直方向に貫通する開口を形成する工程と、
前記開口内に露出した前記複数の導電材料層を選択的にエッチングし、前記複数の導電材料層のそれぞれの側面を前記複数の誘電材料層のそれぞれの側面から水平に後退させる工程と、
前記複数の導電材料層の前記後退した側面のそれぞれと、前記複数の誘電材料層のそれぞれと、で区画された複数の空洞の各々を、埋設するように複数のメモリ素子を形成する工程と、
前記複数のメモリ素子と前記複数の誘電材料層の側面のそれぞれを覆い垂直方向に延在する導電チャネル柱を形成する工程と、
を含み、
前記複数のメモリ素子を形成した後、前記複数のメモリ素子の表面のそれぞれを覆うように第1の誘電体膜を形成する工程と、
前記複数の導電材料層のそれぞれの側面を水平方向に後退させた後、前記後退した側面のそれぞれを覆うように第2の誘電体膜を形成する工程と、
を更に含み、
前記第2の誘電体膜は、前記複数の導電材料層の前記後退した側面から、前記複数の誘電材料層の前記複数の空洞内の露出面および前記開口内の露出側面へ渡って連続して延在するように形成され、
前記第2の誘電体膜を形成する工程は、前記複数の導電材料層の前記後退した側面を酸化する工程と、2つの誘電材料層を順次堆積する工程と、を含む、
ことを特徴とする半導体装置の製造方法。 - 前記複数のメモリ素子を形成する工程は、
前記メモリ素子を形成する材料を、前記複数の空洞を埋設し、且つ前記開口の内壁面を覆うように形成する工程と、
前記メモリ素子を形成する材料の前記開口の内壁面を覆う部分を異方性のエッチングで除去し、前記メモリ素子を形成する材料を、前記複数の空洞内のそれぞれを埋設する前記複数のメモリ素子に分離する工程と、
を含む、ことを特徴とする請求項1に記載の半導体装置の製造方法。 - 前記導電チャネル柱は、側壁面のみを有する中空構造であって、当該中空部分を埋設材料で充填する工程を更に含む、ことを特徴とする請求項1に記載の半導体装置の製造方法。
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