JP5489013B2 - 可撓印刷配線板 - Google Patents
可撓印刷配線板 Download PDFInfo
- Publication number
- JP5489013B2 JP5489013B2 JP2011533529A JP2011533529A JP5489013B2 JP 5489013 B2 JP5489013 B2 JP 5489013B2 JP 2011533529 A JP2011533529 A JP 2011533529A JP 2011533529 A JP2011533529 A JP 2011533529A JP 5489013 B2 JP5489013 B2 JP 5489013B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed wiring
- wiring board
- bonding
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010410 layer Substances 0.000 claims description 47
- 238000005219 brazing Methods 0.000 claims description 33
- 239000011888 foil Substances 0.000 claims description 24
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
Claims (10)
- 電子部品の三次元接続用可撓印刷配線板であって、支持体箔(1)、支持体箔(1)上に設けられる複数のボンディング面(10)、支持体箔(1)上に設けられかつ導体条片を介してボンディング面(10)に接続されている複数のろう付け面(2)及び支持体箔(1)に分離不能に結合されている補強板(3)を有し、ろう付け面(2)及び補強板(3)が支持体箔(1)のろう付け側(4)に設けられ、ボンディング面(10)がろう付け側(4)とは反対側のボンディング側(12)に設けられ、支持体箔(1)が部分的に穴をあけられ、穴面(5)とろう付け面(2)が互いに同心的に設けられ、ろう付け面(2)が穴面(5)より大きく、可撓印刷配線板の特性を監視する少なくとも1つの検査面(13)が支持体箔(1)に設けられ、検査面(13)がろう付け面(2)に接続されていないボンディング面(10)である、可撓印刷配線板。
- 支持体箔(1)が、ろう付け側(4)へ向かって上部覆い層(15)により包囲されかつボンディング側(12)へ向かって下部覆い層(16)により包囲されている導電層(8)を持っていることを特徴とする、請求項1に記載の可撓印刷配線板。
- 覆い層(15,16)がそれぞれ接着層(14)及び保護層(17)を持ち、覆い層(15,16)がそれぞれ接着層(14)により導電層(8)に取付けられていることを特徴とする、請求項2に記載の可撓印刷配線板。
- 保護層(17)がプラスチックであることを特徴とする、請求項3に記載の可撓印刷配線板。
- 導電層(8)が銅箔であることを特徴とする、請求項3又は4に記載の可撓印刷配線板。
- 支持体箔(1)が実質的に四角形状を持ち、ろう付け面(2)及びボンディング面(10)が四角形の2つの対向する縁(9,11)に設けられていることを特徴とする、請求項1〜5の1つに記載の可撓印刷配線板。
- 支持体箔(1)が平らに形成されていないことを特徴とする、請求項1〜6の1つに記載の可撓印刷配線板。
- 支持体箔(1)の覆い層(15,16)が部分的に除去され、そこにボンディング層(7)が設けられていることを特徴とする、請求項2〜7の1つに記載の可撓印刷配線板。
- ボンディング層(7)がニッケル−金化合物から成っていることを特徴とする、請求項8に記載の可撓印刷配線板。
- ろう付け面(2)の数が、ボンディング面(10)の数と検査面(13)の数との和に等しいことを特徴とする、請求項1に記載の可撓印刷配線板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200810052244 DE102008052244A1 (de) | 2008-10-18 | 2008-10-18 | Flexible Leiterplatte |
DE102008052244.9 | 2008-10-18 | ||
PCT/DE2009/001409 WO2010043203A1 (de) | 2008-10-18 | 2009-10-09 | Flexible leiterplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012506161A JP2012506161A (ja) | 2012-03-08 |
JP5489013B2 true JP5489013B2 (ja) | 2014-05-14 |
Family
ID=41403905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011533529A Active JP5489013B2 (ja) | 2008-10-18 | 2009-10-09 | 可撓印刷配線板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8853547B2 (ja) |
EP (1) | EP2345314A1 (ja) |
JP (1) | JP5489013B2 (ja) |
DE (2) | DE102008052244A1 (ja) |
WO (1) | WO2010043203A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008052243A1 (de) | 2008-10-18 | 2010-04-22 | Carl Freudenberg Kg | Schutzabdeckung für eine flexible Leiterplatte |
JP6781631B2 (ja) * | 2014-08-29 | 2020-11-04 | タツタ電線株式会社 | フレキシブルプリント配線板用補強部材、及びそれを備えたフレキシブルプリント配線板 |
KR102637499B1 (ko) * | 2018-12-17 | 2024-02-15 | 엘지디스플레이 주식회사 | 플렉서블 인쇄 회로 기판과 이를 포함하는 플렉서블 디스플레이 모듈 및 전자 기기 |
CN113597090B (zh) * | 2021-07-28 | 2024-03-26 | 京东方科技集团股份有限公司 | 柔性电路板、显示面板及显示装置 |
DE102022213615A1 (de) | 2022-12-14 | 2024-06-20 | Robert Bosch Gesellschaft mit beschränkter Haftung | Zugentlastung für eine Kontaktierung einer flexiblen Leiterfolie mit einer starren Leiterplatte sowie Verfahren zur Herstellung einer derartigen Zugentlastung |
Family Cites Families (94)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4604799A (en) * | 1982-09-03 | 1986-08-12 | John Fluke Mfg. Co., Inc. | Method of making molded circuit board |
JPS61154094A (ja) | 1984-12-26 | 1986-07-12 | 住友ベークライト株式会社 | フレキシブルプリント回路板の製造方法 |
US4687695A (en) * | 1985-09-27 | 1987-08-18 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
US4715928A (en) * | 1985-09-27 | 1987-12-29 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
US5097390A (en) * | 1986-12-10 | 1992-03-17 | Interflex Corporation | Printed circuit and fabrication of same |
US4961806A (en) * | 1986-12-10 | 1990-10-09 | Sanders Associates, Inc. | Method of making a printed circuit |
US4815990A (en) * | 1987-04-10 | 1989-03-28 | Rogers Corporation | Flexible circuit having termination features and method of making the same |
DE3813565A1 (de) * | 1988-04-22 | 1989-11-02 | Bosch Gmbh Robert | Elektrischer anschluss von hybridbaugruppen |
EP0395443B1 (en) | 1989-04-28 | 1993-02-17 | Nikkan Industries Co., Ltd. | Circuit board and overlay |
US5048747A (en) * | 1989-06-27 | 1991-09-17 | At&T Bell Laboratories | Solder assembly of components |
DE3925155A1 (de) * | 1989-07-28 | 1991-02-07 | Siemens Ag | Steckverbinder |
DE4003344C1 (ja) * | 1990-02-05 | 1991-06-13 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4003345C1 (ja) * | 1990-02-05 | 1991-08-08 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4041507A1 (de) * | 1990-12-22 | 1992-06-25 | Bosch Gmbh Robert | Verfahren zum fuegen einer leiterbahnfolie mit einem elektrischen bauteil, damit erzeugtes geraet sowie vorrichtung zum montieren einer leiterbahnfolie |
JPH0521515A (ja) * | 1991-07-15 | 1993-01-29 | Seiko Epson Corp | 液晶表示デバイスとその製造方法 |
JP3253203B2 (ja) * | 1993-01-19 | 2002-02-04 | キヤノン株式会社 | フレキシブル配線基板、及びこれを使用したインクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法 |
JP3226240B2 (ja) * | 1993-05-14 | 2001-11-05 | 株式会社東芝 | フイルムキャリアlsi |
BR9406809A (pt) | 1993-06-09 | 1996-07-23 | United Technologies Automotive | Caixa de ligaçao para a ligaçao de dois ou mais membros condutores de corrente elétrica externos dentro de um sistema elétrico de veiculos e interconexao de caixa de ligaçao para conectar eletricamente um par de lâminas macho em uma caixa de ligaçao de veiculo automotivo |
CA2154409C (en) * | 1994-07-22 | 1999-12-14 | Yuzo Shimada | Connecting member and a connecting method using the same |
CA2156795C (en) * | 1994-08-31 | 1999-08-17 | Yuzo Shimada | An electronic device assembly and a manufacturing method of the same |
US5976910A (en) * | 1995-08-30 | 1999-11-02 | Nec Corporation | Electronic device assembly and a manufacturing method of the same |
US5669775A (en) * | 1995-09-05 | 1997-09-23 | International Business Machines Corporation | Assembly for mounting components to flexible cables |
JP3243684B2 (ja) * | 1995-09-12 | 2002-01-07 | シャープ株式会社 | デバイスの実装構造 |
JP3666955B2 (ja) * | 1995-10-03 | 2005-06-29 | 日本メクトロン株式会社 | 可撓性回路基板の製造法 |
US5760465A (en) * | 1996-02-01 | 1998-06-02 | International Business Machines Corporation | Electronic package with strain relief means |
US5879786A (en) * | 1996-11-08 | 1999-03-09 | W. L. Gore & Associates, Inc. | Constraining ring for use in electronic packaging |
US5888630A (en) * | 1996-11-08 | 1999-03-30 | W. L. Gore & Associates, Inc. | Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly |
JP3588801B2 (ja) * | 1998-01-12 | 2004-11-17 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
US6333468B1 (en) * | 1998-06-11 | 2001-12-25 | International Business Machines Corporation | Flexible multi-layered printed circuit cable |
US6099745A (en) * | 1998-06-05 | 2000-08-08 | Parlex Corporation | Rigid/flex printed circuit board and manufacturing method therefor |
JP3565090B2 (ja) * | 1998-07-06 | 2004-09-15 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP2000059051A (ja) | 1998-08-11 | 2000-02-25 | Murata Mfg Co Ltd | シャーシ構造体の製造方法およびそれに用いる治具装置 |
JP2000138262A (ja) * | 1998-10-31 | 2000-05-16 | Anam Semiconductor Inc | チップスケ―ル半導体パッケ―ジ及びその製造方法 |
US6396136B2 (en) * | 1998-12-31 | 2002-05-28 | Texas Instruments Incorporated | Ball grid package with multiple power/ground planes |
TW483074B (en) * | 1999-05-14 | 2002-04-11 | Seiko Epson Corp | Semiconductor apparatus, its manufacturing method, circuit board and electronic machine |
JP3312611B2 (ja) * | 1999-05-14 | 2002-08-12 | 日本電気株式会社 | フィルムキャリア型半導体装置 |
DE19929179A1 (de) * | 1999-06-25 | 2001-01-11 | Siemens Ag | Flexible Leiterplatte mit beidseitigem Zugriff |
WO2001015231A1 (fr) * | 1999-08-19 | 2001-03-01 | Seiko Epson Corporation | Panneau de cablage, dispositif semiconducteur, procede de fabrication d'un dispositif semiconducteur, carte a circuit imprime et dispositif electronique |
US6570250B1 (en) * | 2000-02-24 | 2003-05-27 | Honeywell International Inc. | Power conditioning substrate stiffener |
US6741778B1 (en) * | 2000-05-23 | 2004-05-25 | International Business Machines Corporation | Optical device with chip level precision alignment |
JP4592875B2 (ja) * | 2000-06-12 | 2010-12-08 | Nec液晶テクノロジー株式会社 | フレキシブル配線基板及びその製造方法並びに表示装置 |
KR20020000012A (ko) * | 2000-06-20 | 2002-01-04 | 윤종용 | 슬릿이 형성된 칩 스케일 패키지 제조 방법 |
JP4054169B2 (ja) * | 2000-08-11 | 2008-02-27 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープ |
JP2002093950A (ja) * | 2000-09-20 | 2002-03-29 | Mitsui Mining & Smelting Co Ltd | 電子部品の実装方法および電子部品実装体 |
AT410728B (de) | 2001-02-09 | 2003-07-25 | Pollmann Austria Ohg | Verfahren zum einbetten zumindest einer flexiblen leiterbahnfolie in kunststoff, leiterbahneneinheitsowie einbettungseinheit hiefür |
US20020189854A1 (en) * | 2001-04-10 | 2002-12-19 | Crumly William R. | Design for long fatigue life in flexible circuits |
KR100783591B1 (ko) | 2001-04-26 | 2007-12-07 | 삼성전자주식회사 | 액정 표시 장치 |
JP2002368370A (ja) * | 2001-06-07 | 2002-12-20 | Matsushita Electric Ind Co Ltd | フレキシブルプリント基板の接合構造及びその方法 |
US6607942B1 (en) * | 2001-07-26 | 2003-08-19 | Taiwan Semiconductor Manufacturing Company | Method of fabricating as grooved heat spreader for stress reduction in an IC package |
JP3803596B2 (ja) * | 2002-03-14 | 2006-08-02 | 日本電気株式会社 | パッケージ型半導体装置 |
US6842585B2 (en) * | 2002-04-18 | 2005-01-11 | Olympus Optical Co., Ltd. | Camera |
US20040099958A1 (en) * | 2002-11-21 | 2004-05-27 | Schildgen William R. | Crack resistant interconnect module |
US7071420B2 (en) * | 2002-12-18 | 2006-07-04 | Micron Technology, Inc. | Methods and apparatus for a flexible circuit interposer |
TWI351548B (en) * | 2003-01-15 | 2011-11-01 | Semiconductor Energy Lab | Manufacturing method of liquid crystal display dev |
US6872589B2 (en) * | 2003-02-06 | 2005-03-29 | Kulicke & Soffa Investments, Inc. | High density chip level package for the packaging of integrated circuits and method to manufacture same |
JP2004259904A (ja) * | 2003-02-26 | 2004-09-16 | Hitachi Ltd | 電子回路装置の回路基板およびその製造方法 |
JP4222882B2 (ja) * | 2003-06-03 | 2009-02-12 | 日東電工株式会社 | 配線回路基板 |
JP4222885B2 (ja) | 2003-06-04 | 2009-02-12 | 日東電工株式会社 | 配線回路基板 |
JP4175197B2 (ja) * | 2003-06-27 | 2008-11-05 | 株式会社デンソー | フリップチップ実装構造 |
JP2005051150A (ja) * | 2003-07-31 | 2005-02-24 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
US7541734B2 (en) * | 2003-10-03 | 2009-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device having a layer with a metal oxide and a benzoxazole derivative |
JP3976019B2 (ja) * | 2004-02-10 | 2007-09-12 | セイコーエプソン株式会社 | 実装構造体、電気光学装置、および電子機器 |
JP4843979B2 (ja) * | 2004-03-30 | 2011-12-21 | 住友ベークライト株式会社 | 回路基板 |
JP4660259B2 (ja) * | 2004-06-10 | 2011-03-30 | 三洋電機株式会社 | 半導体装置の製造方法 |
CN1806474A (zh) * | 2004-06-11 | 2006-07-19 | 揖斐电株式会社 | 刚挠性电路板及其制造方法 |
JP2006080440A (ja) * | 2004-09-13 | 2006-03-23 | Casio Micronics Co Ltd | 回路基板及び半導体装置 |
JP2006179606A (ja) * | 2004-12-21 | 2006-07-06 | Nitto Denko Corp | 配線回路基板 |
TWM271354U (en) | 2005-01-26 | 2005-07-21 | Wintek Corp | Frame for optical display device |
US7718927B2 (en) * | 2005-03-15 | 2010-05-18 | Medconx, Inc. | Micro solder pot |
JP4347246B2 (ja) * | 2005-03-22 | 2009-10-21 | 株式会社日立製作所 | プリント配線板および浸食状態判定方法 |
JP2007045974A (ja) * | 2005-08-11 | 2007-02-22 | Nitto Denko Corp | 熱硬化型粘接着剤組成物、熱硬化型粘接着テープ又はシートおよび配線回路基板 |
JP2007049036A (ja) * | 2005-08-11 | 2007-02-22 | Nitto Denko Corp | 配線回路基板 |
JP4533283B2 (ja) * | 2005-08-29 | 2010-09-01 | 新光電気工業株式会社 | 半導体装置の製造方法 |
WO2007059152A1 (en) * | 2005-11-14 | 2007-05-24 | World Properties, Inc. | Circuit material, multi-layer circuits, and methods of manufacture thereof |
DE102005063272A1 (de) * | 2005-12-30 | 2007-07-05 | Robert Bosch Gmbh | Flexible Leiterplatte und Kontaktierverfahren |
DE102006005941A1 (de) | 2006-02-09 | 2007-08-23 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Halter für eine flexible Leiterplatte |
JP4841272B2 (ja) * | 2006-03-14 | 2011-12-21 | 日東電工株式会社 | 配線回路基板および配線回路基板の接続構造 |
JP5195422B2 (ja) * | 2006-03-31 | 2013-05-08 | 日本電気株式会社 | 配線基板、実装基板及び電子装置 |
JP4171499B2 (ja) * | 2006-04-10 | 2008-10-22 | 日立電線株式会社 | 電子装置用基板およびその製造方法、並びに電子装置およびその製造方法 |
JP2007305960A (ja) * | 2006-04-14 | 2007-11-22 | Sharp Corp | 半導体装置およびその製造方法 |
US7649254B2 (en) * | 2006-05-01 | 2010-01-19 | Flextronics Ap, Llc | Conductive stiffener for a flexible substrate |
JP2008021832A (ja) | 2006-07-13 | 2008-01-31 | Fujikura Ltd | フレキシブルプリント基板の固定構造 |
KR20080023554A (ko) | 2006-09-11 | 2008-03-14 | 엘지전자 주식회사 | 디스플레이모듈 및 이를 구비하는 이동통신 단말기 |
CN101273494B (zh) * | 2006-10-27 | 2012-02-22 | 株式会社旭电化研究所 | 电连接构造 |
JP4835401B2 (ja) | 2006-11-16 | 2011-12-14 | 日本電気株式会社 | フレキシブルプリント基板の固定構造 |
JP4383461B2 (ja) * | 2007-03-14 | 2009-12-16 | 長野計器株式会社 | センサ及びセンサの製造方法 |
KR101092389B1 (ko) * | 2007-04-03 | 2011-12-09 | 가부시키가이샤 아드반테스트 | 콘택터의 제조방법 |
WO2008132802A1 (ja) * | 2007-04-13 | 2008-11-06 | Panasonic Corporation | 固体撮像装置およびその製造方法 |
US8648263B2 (en) * | 2007-05-17 | 2014-02-11 | Ibiden Co., Ltd. | Wiring board and method of manufacturing wiring board |
US8669480B2 (en) * | 2007-05-17 | 2014-03-11 | Ibiden Co., Ltd. | Wiring board and method of manufacturing wiring board |
US8040685B2 (en) * | 2007-07-17 | 2011-10-18 | Ibiden Co., Ltd. | Stacked wiring board and method of manufacturing stacked wiring board |
US8035983B2 (en) * | 2007-07-17 | 2011-10-11 | Ibiden Co., Ltd. | Wiring board and method of manufacturing wiring board |
JP2009081342A (ja) * | 2007-09-27 | 2009-04-16 | Sharp Corp | 多層プリント配線板とその製造方法 |
DE102008052243A1 (de) | 2008-10-18 | 2010-04-22 | Carl Freudenberg Kg | Schutzabdeckung für eine flexible Leiterplatte |
-
2008
- 2008-10-18 DE DE200810052244 patent/DE102008052244A1/de not_active Withdrawn
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2009
- 2009-10-09 DE DE112009002460.2T patent/DE112009002460B4/de active Active
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- 2009-10-09 EP EP09744937A patent/EP2345314A1/de not_active Ceased
- 2009-10-09 JP JP2011533529A patent/JP5489013B2/ja active Active
- 2009-10-09 US US13/124,699 patent/US8853547B2/en active Active
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EP2345314A1 (de) | 2011-07-20 |
DE112009002460B4 (de) | 2022-01-20 |
WO2010043203A1 (de) | 2010-04-22 |
US8853547B2 (en) | 2014-10-07 |
DE112009002460A5 (de) | 2011-07-14 |
JP2012506161A (ja) | 2012-03-08 |
US20110232946A1 (en) | 2011-09-29 |
DE102008052244A1 (de) | 2010-04-22 |
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