JP5392884B2 - 銅粉の製造方法 - Google Patents
銅粉の製造方法 Download PDFInfo
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- JP5392884B2 JP5392884B2 JP2007246083A JP2007246083A JP5392884B2 JP 5392884 B2 JP5392884 B2 JP 5392884B2 JP 2007246083 A JP2007246083 A JP 2007246083A JP 2007246083 A JP2007246083 A JP 2007246083A JP 5392884 B2 JP5392884 B2 JP 5392884B2
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- Prior art keywords
- copper
- copper powder
- slurry
- cuprous oxide
- hydrazine
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 194
- 238000004519 manufacturing process Methods 0.000 title claims description 52
- 239000002002 slurry Substances 0.000 claims description 85
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 79
- -1 copper salt compound Chemical class 0.000 claims description 63
- 239000010949 copper Substances 0.000 claims description 61
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 60
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 60
- 229940112669 cuprous oxide Drugs 0.000 claims description 60
- 229910052802 copper Inorganic materials 0.000 claims description 50
- 238000006722 reduction reaction Methods 0.000 claims description 50
- 239000003638 chemical reducing agent Substances 0.000 claims description 49
- 229910052698 phosphorus Inorganic materials 0.000 claims description 40
- 239000011574 phosphorus Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 33
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 150000001879 copper Chemical class 0.000 claims description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 14
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 13
- 239000007864 aqueous solution Substances 0.000 claims description 13
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 12
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 11
- 239000012066 reaction slurry Substances 0.000 claims description 11
- 239000012670 alkaline solution Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 230000002829 reductive effect Effects 0.000 claims description 7
- 239000012266 salt solution Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 description 85
- 238000009826 distribution Methods 0.000 description 42
- 230000009467 reduction Effects 0.000 description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 24
- 229910052799 carbon Inorganic materials 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 22
- 239000000243 solution Substances 0.000 description 17
- 239000012535 impurity Substances 0.000 description 15
- 239000007788 liquid Substances 0.000 description 15
- 239000004020 conductor Substances 0.000 description 13
- 238000005406 washing Methods 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 238000004220 aggregation Methods 0.000 description 7
- 230000002776 aggregation Effects 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 230000001186 cumulative effect Effects 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- GJYJYFHBOBUTBY-UHFFFAOYSA-N alpha-camphorene Chemical compound CC(C)=CCCC(=C)C1CCC(CCC=C(C)C)=CC1 GJYJYFHBOBUTBY-UHFFFAOYSA-N 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000003002 pH adjusting agent Substances 0.000 description 4
- 239000012756 surface treatment agent Substances 0.000 description 4
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- QKSIFUGZHOUETI-UHFFFAOYSA-N copper;azane Chemical compound N.N.N.N.[Cu+2] QKSIFUGZHOUETI-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- 230000001376 precipitating effect Effects 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 238000011946 reduction process Methods 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000006228 supernatant Substances 0.000 description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 230000002431 foraging effect Effects 0.000 description 2
- 150000002429 hydrazines Chemical class 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 2
- 229940048086 sodium pyrophosphate Drugs 0.000 description 2
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 2
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000012493 hydrazine sulfate Substances 0.000 description 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- YWXYYJSYQOXTPL-SLPGGIOYSA-N isosorbide mononitrate Chemical compound [O-][N+](=O)O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 YWXYYJSYQOXTPL-SLPGGIOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- ASTWEMOBIXQPPV-UHFFFAOYSA-K trisodium;phosphate;dodecahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[Na+].[O-]P([O-])([O-])=O ASTWEMOBIXQPPV-UHFFFAOYSA-K 0.000 description 1
- 238000009692 water atomization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
Description
比較例1は、湿式還元法による銅粉の製造に際し、有機系還元剤を用いる例である。
比較例2は、湿式還元法による銅粉の製造に際し、リン化合物を添加しない例である。即ち、リン化合物を全く添加しない点以外は、実施例1と同様の方法で銅粉を得た。得られた銅粉の粉体特性について、実施例1と同様のデータを測定、算出した。この結果を表2に示す。また、比較例2で得られた銅粉の体積基準粒度分布図を図6に示す。
比較例3は、特許文献4に開示の方法を用いて、銅含有溶液の濃度を実施例1の銅塩含有スラリーと同等の濃度とした例である。まず、硫酸銅五水和物395gと純水0.05Lとを混合し、更に、ピロリン酸ナトリウム40gを添加して銅含有溶液を作製した。次に、この銅含有溶液中に、濃アンモニア水(濃度28%)500gを加え、混合して銅アンモニア錯イオン溶液を作製した。この銅アンモニア錯イオン溶液中に純水を加えて全液量を0.79Lにし、実施例1と同じ銅濃度とした。この銅アンモニア錯イオン溶液に、還元剤として飽水ヒドラジン200gを30℃の温度下で添加して混合した後、液温を80℃まで上昇させて2時間維持することにより反応を十分に行わせた。その後、金属銅として得られた銅粉末を溶液中から回収し、洗浄した。
Claims (6)
- 銅塩水溶液にアルカリ溶液を添加して得られた銅塩化合物スラリーに、ヒドラジン系還元剤を添加して亜酸化銅スラリーとし、当該亜酸化銅スラリーを水洗し、再スラリー化した洗浄亜酸化銅スラリーに再びヒドラジン系還元剤を添加する銅粉の製造方法において、
最終還元反応が終了するまでに、リンと銅のモル比がP/Cu=0.0001〜0.003となるように、リン化合物を反応スラリーに添加することを特徴とする銅粉の製造方法。 - 前記銅塩化合物スラリーの銅濃度を1mol/L〜3mol/Lとする請求項1に記載の銅粉の製造方法。
- 前記アルカリ溶液がアンモニア水溶液である請求項1または請求項2に記載の銅粉の製造方法。
- 前記銅塩化合物スラリーに、ヒドラジン系還元剤を添加し、還元反応を行う際のpHを3.5〜6.0に調整する請求項1〜請求項3のいずれかに記載の銅粉の製造方法。
- 前記銅塩化合物スラリーに、ヒドラジン系還元剤を添加し、還元反応を行う際のpH調整をアンモニア水溶液で行う請求項4に記載の銅粉の製造方法。
- 前記洗浄亜酸化銅スラリーに再びヒドラジン系還元剤添加前のスラリーのpHを4.1〜6.0に調整することを特徴とする請求項1〜請求項5のいずれかに記載の銅粉の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007246083A JP5392884B2 (ja) | 2007-09-21 | 2007-09-21 | 銅粉の製造方法 |
TW097136051A TWI455777B (zh) | 2007-09-21 | 2008-09-19 | 銅粉之製造方法及銅粉 |
PCT/JP2008/067078 WO2009038207A1 (ja) | 2007-09-21 | 2008-09-22 | 銅粉の製造方法及び銅粉 |
CN2008801074240A CN101801568B (zh) | 2007-09-21 | 2008-09-22 | 铜粉的制造方法及铜粉 |
KR20107004861A KR101510369B1 (ko) | 2007-09-21 | 2008-09-22 | 동분말의 제조 방법 및 동분말 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007246083A JP5392884B2 (ja) | 2007-09-21 | 2007-09-21 | 銅粉の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013172140A Division JP5729842B2 (ja) | 2013-08-22 | 2013-08-22 | 銅粉 |
Publications (2)
Publication Number | Publication Date |
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JP2009074152A JP2009074152A (ja) | 2009-04-09 |
JP5392884B2 true JP5392884B2 (ja) | 2014-01-22 |
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JP2007246083A Active JP5392884B2 (ja) | 2007-09-21 | 2007-09-21 | 銅粉の製造方法 |
Country Status (5)
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---|---|
JP (1) | JP5392884B2 (ja) |
KR (1) | KR101510369B1 (ja) |
CN (1) | CN101801568B (ja) |
TW (1) | TWI455777B (ja) |
WO (1) | WO2009038207A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5476631B2 (ja) * | 2010-03-05 | 2014-04-23 | 株式会社村田製作所 | 電子部品およびその製造方法 |
JP5531691B2 (ja) * | 2010-03-16 | 2014-06-25 | 株式会社村田製作所 | 導電性ペーストおよびセラミック電子部品の製造方法 |
JP5759688B2 (ja) * | 2010-08-17 | 2015-08-05 | 三井金属鉱業株式会社 | 扁平銅粒子 |
JP5820202B2 (ja) * | 2010-09-30 | 2015-11-24 | Dowaエレクトロニクス株式会社 | 導電性ペースト用銅粉およびその製造方法 |
TWI487581B (zh) * | 2010-11-12 | 2015-06-11 | Mitsui Mining & Smelting Co | Low carbon copper particles and methods for producing the same |
KR101239391B1 (ko) * | 2011-01-05 | 2013-03-05 | 한국지질자원연구원 | 입도 제어가 용이한 전자소재용 미세 구리 분말 제조 방법 |
JP5120477B2 (ja) * | 2011-04-07 | 2013-01-16 | 日立化成工業株式会社 | 電極用ペースト組成物及び太陽電池 |
JP5785433B2 (ja) * | 2011-04-28 | 2015-09-30 | 三井金属鉱業株式会社 | 低炭素銅粒子 |
KR101918323B1 (ko) * | 2011-05-18 | 2018-11-13 | 도다 고교 가부시끼가이샤 | 구리 분말, 구리 페이스트, 도전성 도막의 제조 방법 및 도전성 도막 |
JP6199430B2 (ja) * | 2011-09-30 | 2017-09-20 | Dowaエレクトロニクス株式会社 | 亜酸化銅粉末およびその製造方法 |
KR102118308B1 (ko) * | 2012-11-26 | 2020-06-03 | 미쓰이금속광업주식회사 | 구리분 및 그 제조방법 |
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CN107921532B (zh) * | 2015-09-03 | 2020-05-08 | 同和电子科技有限公司 | 含磷铜粉及其制造方法 |
JP2017179428A (ja) * | 2016-03-29 | 2017-10-05 | Dowaエレクトロニクス株式会社 | 導電性材料、導電膜の形成方法、回路基板、半導体装置及び半導体装置の製造方法 |
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CN108526490B (zh) * | 2018-05-14 | 2021-05-25 | 六盘水中联工贸实业有限公司 | 一种用氯化铜或氯化亚铜生产金属铜粉的方法 |
CN112296345B (zh) * | 2019-07-23 | 2022-02-18 | 富兰克科技(深圳)股份有限公司 | 具有长有机碳链可自分散纳米铜的制备方法、纳米铜制剂及其应用 |
CN110773177B (zh) * | 2019-09-10 | 2022-05-20 | 安徽德诠新材料科技有限公司 | 一种高比表面积三元铜催化剂的制备方法 |
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JPS6299406A (ja) * | 1985-10-28 | 1987-05-08 | Mitsui Mining & Smelting Co Ltd | 銅粉末の製造法 |
JP3570591B2 (ja) * | 1996-03-22 | 2004-09-29 | 株式会社村田製作所 | 銅粉末の製造方法 |
CN1060108C (zh) * | 1997-01-21 | 2001-01-03 | 北京化工大学 | 超细铜粉的制备方法 |
JP2911429B2 (ja) * | 1997-06-04 | 1999-06-23 | 三井金属鉱業株式会社 | 銅微粉末の製造方法 |
JP3635451B2 (ja) * | 1998-09-11 | 2005-04-06 | 株式会社村田製作所 | 金属粉末およびその製造方法ならびに導電性ペースト |
KR100743844B1 (ko) * | 1999-12-01 | 2007-08-02 | 도와 마이닝 가부시끼가이샤 | 구리 분말 및 구리 분말의 제조 방법 |
JP2002363618A (ja) * | 2001-06-11 | 2002-12-18 | Sumitomo Electric Ind Ltd | 銅超微粒子とその製造方法 |
JP4868716B2 (ja) * | 2004-04-28 | 2012-02-01 | 三井金属鉱業株式会社 | フレーク銅粉及び導電性ペースト |
JP4879473B2 (ja) * | 2004-10-25 | 2012-02-22 | 三井金属鉱業株式会社 | フレーク銅粉及びフレーク銅粉の製造方法並びにフレーク銅粉を含む導電性スラリー |
JP4662760B2 (ja) * | 2004-12-22 | 2011-03-30 | 三井金属鉱業株式会社 | 超微粒銅粉、超微粒銅粉スラリー及び超微粒銅粉スラリーの製造方法 |
JP4651533B2 (ja) * | 2005-12-26 | 2011-03-16 | 三井金属鉱業株式会社 | 銅粒子の製造方法 |
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