JP5357694B2 - 位置ずれ防止装置、これを備えた基板保持具、基板搬送装置および基板搬送方法 - Google Patents

位置ずれ防止装置、これを備えた基板保持具、基板搬送装置および基板搬送方法 Download PDF

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Publication number: JP5357694B2
Authority: JP; Japan
Prior art keywords: substrate; prevention device; height; movable; movable pin
Prior art date: 2009-07-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2009241200A

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English (en)

Japanese (ja)

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JP2011026111A (ja

Inventor

秀樹駒田

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Electron Ltd

Original Assignee

Tokyo Electron Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-07-03

Filing date

2009-10-20

Publication date

2013-12-04

2009-10-20 Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd

2009-10-20 Priority to JP2009241200A priority Critical patent/JP5357694B2/ja

2010-06-21 Priority to KR1020100058378A priority patent/KR101208644B1/ko

2010-07-02 Priority to TW099121830A priority patent/TWI555681B/zh

2010-07-02 Priority to CN2010102229394A priority patent/CN101944497B/zh

2011-02-10 Publication of JP2011026111A publication Critical patent/JP2011026111A/ja

2013-12-04 Application granted granted Critical

2013-12-04 Publication of JP5357694B2 publication Critical patent/JP5357694B2/ja

Status Active legal-status Critical Current

2029-10-20 Anticipated expiration legal-status Critical

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Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Drying Of Semiconductors (AREA)

JP2009241200A 2009-07-03 2009-10-20 位置ずれ防止装置、これを備えた基板保持具、基板搬送装置および基板搬送方法 Active JP5357694B2 (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP2009241200A JP5357694B2 (ja)	2009-07-03	2009-10-20	位置ずれ防止装置、これを備えた基板保持具、基板搬送装置および基板搬送方法
KR1020100058378A KR101208644B1 (ko)	2009-07-03	2010-06-21	위치 이탈 방지 장치, 이를 구비한 기판 보지구, 기판 반송 장치 및 기판 반송 방법
TW099121830A TWI555681B (zh)	2009-07-03	2010-07-02	A position shift preventing device, a substrate holder including the same, a substrate handling device, and a substrate handling method
CN2010102229394A CN101944497B (zh)	2009-07-03	2010-07-02	防位置偏移装置、具有它的基板保持器、基板输送装置及基板输送方法

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2009158808		2009-07-03
JP2009158808		2009-07-03
JP2009241200A JP5357694B2 (ja)	2009-07-03	2009-10-20	位置ずれ防止装置、これを備えた基板保持具、基板搬送装置および基板搬送方法

Publications (2)

Publication Number	Publication Date
JP2011026111A JP2011026111A (ja)	2011-02-10
JP5357694B2 true JP5357694B2 (ja)	2013-12-04

Family

ID=43635327

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2009241200A Active JP5357694B2 (ja)	2009-07-03	2009-10-20	位置ずれ防止装置、これを備えた基板保持具、基板搬送装置および基板搬送方法

Country Status (2)

Country	Link
JP (1)	JP5357694B2 (zh)
TW (1)	TWI555681B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2021080706A1 (en) *	2019-10-23	2021-04-29	Eugenus, Inc.	Systems and methods of placing substrates in semiconductor manufacturing equipment

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20120315113A1 (en) *	2010-02-05	2012-12-13	Tokyo Electron Limited	Substrate holder, substrate transfer apparatus, and substrate processing apparatus
EP2879171B1 (en) *	2012-07-26	2019-05-08	Senju Metal Industry Co., Ltd.	Semiconductor wafer transfer jig
CN103963812A (zh) *	2014-05-15	2014-08-06	桐乡市锡良罐业有限公司	一种易碎品运送小车
CN106571329A (zh) *	2015-10-12	2017-04-19	沈阳拓荆科技有限公司	一种晶圆基板支架结构
WO2017072858A1 (ja) *	2015-10-27	2017-05-04	平田機工株式会社	移送ユニット、移載装置及び移載方法
JP7231205B2 (ja) *	2019-02-06	2023-03-01	株式会社ブイ・テクノロジー	マスク検査装置
JP7259476B2 (ja) *	2019-03-27	2023-04-18	東京エレクトロン株式会社	アライメント装置、基板処理装置、アライメント方法及び基板処理方法
CN110112588A (zh) *	2019-06-19	2019-08-09	广东电网有限责任公司	一种接地线五防***

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Publication number	Priority date	Publication date	Assignee	Title
JPH05169387A (ja) *	1991-12-17	1993-07-09	Fujitsu Ltd	ロボットハンド
DE4339102A1 (de) *	1992-11-26	1994-06-01	Friedhelm Prof Dipl Ing Sehrt	Handhabungsvorrichtung zum mechanischen Greifen, Halten, Bewegen oder dergl. Handhaben von Gegenständen insbesondere für Handhabungsgeräte
JPH06236913A (ja) *	1993-02-09	1994-08-23	Toshiba Corp	ウェハーフォーク
JPH1080890A (ja) *	1996-09-09	1998-03-31	Kanto Auto Works Ltd	工作物把持装置
JP4072212B2 (ja) *	1996-11-19	2008-04-09	キヤノン株式会社	走査露光装置
JP2002321184A (ja) *	2001-04-23	2002-11-05	Yamazaki Mazak Corp	クランプユニット及び該クランプユニットを用いたガントリロボット
JP4038653B2 (ja) *	2001-12-03	2008-01-30	株式会社安川電機	ウェハ搬送フォーク
CN100492608C (zh) *	2005-04-04	2009-05-27	弘塑科技股份有限公司	以多组夹指夹持晶片的装置的机械构造
JP5059573B2 (ja) *	2007-12-06	2012-10-24	東京エレクトロン株式会社	基板保持具、基板搬送装置および基板処理システム
JP2009147042A (ja) *	2007-12-13	2009-07-02	Sharp Corp	基板受取方法および基板ステージ装置

2009
- 2009-10-20 JP JP2009241200A patent/JP5357694B2/ja active Active
2010
- 2010-07-02 TW TW099121830A patent/TWI555681B/zh active

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2021080706A1 (en) *	2019-10-23	2021-04-29	Eugenus, Inc.	Systems and methods of placing substrates in semiconductor manufacturing equipment
US11328944B2 (en) *	2019-10-23	2022-05-10	Eugenus, Inc.	Systems and methods of placing substrates in semiconductor manufacturing equipment

Also Published As

Publication number	Publication date
TWI555681B (zh)	2016-11-01
JP2011026111A (ja)	2011-02-10
TW201119913A (en)	2011-06-16

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