CN106571329A - 一种晶圆基板支架结构 - Google Patents

一种晶圆基板支架结构 Download PDF

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CN106571329A
CN106571329A CN201510658838.4A CN201510658838A CN106571329A CN 106571329 A CN106571329 A CN 106571329A CN 201510658838 A CN201510658838 A CN 201510658838A CN 106571329 A CN106571329 A CN 106571329A
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wafer substrate
support rack
rack structure
rack body
sapphire ball
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范川
周仁
方仕彩
廉杰
杜广宇
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Piotech Inc
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Piotech Shenyang Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种晶圆基板支架结构，主要解决现有晶圆基板与支架结构定位不准确，摩擦大等问题，本发明提供一种晶圆基板支架结构该支架结构包括定位蓝宝石球、支撑蓝宝石球、支架主体、内六角螺栓、弹簧垫片、双向沉头孔。本发明的支架结构可以充分保证晶圆基板在传递过程中达到所需的位置精度，并可减少基板与支架结构之间的摩擦和碰撞，减少颗粒物的产生，有助于提高半导体的生产效率和产品良率，并且可以正反安装，同时适用于上下腔体两种安装情况，结构简单可靠，制造成本较低。

Description

一种晶圆基板支架结构
技术领域
本发明涉及一种晶圆基板支架结构，属于半导体薄膜设备的应用技术领域。
背景技术
在半导体设备中，晶圆基板常需要用机械手从大气环境与真空腔体之间来回传送，因此需要一个气压可自由切换的负载模块作为过渡空间；对于机械手将晶圆基板置入或取出负载模块的过程，由于机械手的传递过程具有一定误差，晶圆基板的放置位置必须达到一定的精度要求，又要尽可能减小晶圆基板与支撑结构之间的接触和碰撞，以防接触碰撞过程产生颗粒物带入反应腔内影响产品良率；为了满足以上要求，需要设计一种基板支架结构，既能保证定位的准确性、可靠性，又要有尽可能有小的接触面积，减小基板与支架结构间的摩擦和碰撞。
发明内容
本发明以解决上述问题为目的，提供一种晶圆基板支架结构，该支架结构具有自动定位功能，可以充分保证晶圆基板在传递过程中达到所需的位置精度，并可减小基板和支撑结构相互之间的接触面积、减少基板与支架结构之间的摩擦和碰撞，进而减少颗粒物的产生，定位过程迅速可靠，有助于提高半导体的生产效率和产品良率。
为实现上述目的，本发明采用下述技术方案：
一种晶圆基板支架结构，该支架结构包括定位蓝宝石球、支撑蓝宝石球、支架主体、内六角螺栓、弹簧垫片、双向沉头孔；所述定位蓝宝石球与支撑蓝宝石球分别安装于支架主体上的圆孔中，双向沉头孔安装于支架主体上，采用内六角螺栓与弹簧垫片通过双向沉头孔将支架主体正装在上负载腔体或反装在下负载腔体上。
进一步地，所述支架主体与上负载腔体和下负载腔体的接触面为精加工平面。
本发明的有益效果是：
1、具有自动定位功能：晶圆基板放置在支架上，将会自动调整至中心位置，定位准确可靠，与机械手配合性好；
2、安装方便，支架主体在腔体内依靠精加工面定位，因而无需使用特制的工装对支架主体进行精确位置调整；
3、晶圆基板与本支架结构的接触过程中产生的颗粒物较少，能有效减少污染晶圆的颗粒物，对产品良率的提升起到帮助作用；
4、可以正反安装，同时适用于上下腔体两种安装情况；
5、结构简单可靠，制造成本较低。
附图说明
图1为本发明的晶圆基板支架结构俯视图；
图2为本发明的晶圆基板支架结构主视图；
图3为图2中A的局部视图；
图4为实施例1中晶圆基板支架结构腔体安装定位剖视图；
图5为图4中B的局部视图；
图6为图4中C的局部视图；
图7为图4的D-D向剖视图；
图8为图7的E的局部视图；
图9为实施例2中晶圆基板支架结构腔体安装定位剖视图；
图10为图9中F的局部视图；
图11为图1的H-H向剖视图。
具体实施方式
下面结合实施例进一步对本发明进行详细说明，但发明保护内容不局限于所述实施例：
实施例1
参照图1-11，一种晶圆基板支架结构，该支架结构包括定位蓝宝石球1、支撑蓝宝石球2、支架主体3、内六角螺栓8、弹簧垫片9、双向沉头孔11；所述定位蓝宝石球1与支撑蓝宝石球2分别安装于支架主体3上的圆孔中，双向沉头孔11对称安装于支架主体3上，采用内六角螺栓8与弹簧垫片9通过双向沉头孔11将支架主体3正装在上负载腔体6。
所述支架主体3与上负载腔体6的接触面为精加工平面。
使用前，先把定位蓝宝石球1和支撑蓝宝石球2安装在支架主体3上的圆孔中，所述定位蓝宝石球1的顶点高于支撑蓝宝石球2的顶点，如图1-3；然后将支架主体3采用内六角螺栓8与弹簧垫片9通过双向沉头孔11固定在上负载腔体6上，如图4与图7；其中，支架主体3与上负载腔体6之间的接触面为精加工平面，如图5，因此可实现支架主体3在上负载腔体6内的准确定位。
在使用时，通过陶瓷机械手5将12寸晶圆基板4送入上负载腔体6中的指定位置，然后从12寸晶圆基板4下方撤离，12寸晶圆基板4被放置在支撑蓝宝石球2上，如图3。由于支撑蓝宝石球2的球面与12寸晶圆基板4的平面接触面积非常小，故能有效减少颗粒物的产生；12寸晶圆基板4的边缘在陶瓷机械手5的运动方向并未直接接触，故能有效减少碰撞产生的颗粒物；若12寸晶圆基板4被陶瓷机械手手指5放置的位置并非支架主体3的绝对中心，由于重力作用且二者的摩擦系数非常小，12寸晶圆基板4可沿定位蓝宝石球1表面滑动到中心位置，保证了12寸晶圆基板4相对支架主体3的相对位置，实现自动定心功能，如图6。
实施例2
参照图1-11，一种晶圆基板支架结构，该支架结构包括定位蓝宝石球1、支撑蓝宝石球2、支架主体3、内六角螺栓8、弹簧垫片9、双向沉头孔11；所述定位蓝宝石球1与支撑蓝宝石球2分别安装于支架主体3上的圆孔中，双向沉头孔11对称安装于支架主体3上，采用内六角螺栓8与弹簧垫片9通过双向沉头孔11将支架主体3反装在下负载腔体10上。
所述支架主体3与下负载腔体10的接触面为精加工平面。
使用前，先把定位蓝宝石球1和支撑蓝宝石球2安装在支架主体3上的圆孔中，所述定位蓝宝石球1的顶点高于支撑蓝宝石球2的顶点，如附图1-3；然后将支架主体3采用内六角螺栓8与弹簧垫片9通过双向沉头孔11固定在下负载腔体10上，如图9与图10；其中，支架主体3与下负载腔体10之间的接触面为精加工平面，因此可实现支架主体3在下负载腔体10内的准确定位。
在使用时，通过陶瓷机械手5将12寸晶圆基板4送入下负载腔体10中的指定位置，然后从12寸晶圆基板4下方撤离，12寸晶圆基板4被放置在支撑蓝宝石球2上，如图3。由于支撑蓝宝石球2的球面与12寸晶圆基板4的平面接触面积非常小，故能有效减少颗粒物的产生；12寸晶圆基板4的边缘在陶瓷机械手5的运动方向并未直接接触，故能有效减少碰撞产生的颗粒物；若12寸晶圆基板4被陶瓷机械手手指5放置的位置并非支架主体3的绝对中心，由于重力作用且二者的摩擦系数非常小，12寸晶圆基板4可沿定位蓝宝石球1表面滑动到中心位置，保证了12寸晶圆基板4与支架主体3的相对位置，实现自动定心功能。

Claims (2)

1.一种晶圆基板支架结构，其特征在于，该支架结构包括定位蓝宝石球、支撑蓝宝石球、支架主体、内六角螺栓、弹簧垫片、双向沉头孔；所述定位蓝宝石球与支撑蓝宝石球分别安装于支架主体上的圆孔中，双向沉头孔对称安装于支架主体上，采用内六角螺栓与弹簧垫片通过双向沉头孔将支架主体正装在上负载腔体或反装在下负载腔体上。
2.如权利要求1所述的一种晶圆基板支架结构，其特征在于,所述支架主体与上负载腔体和下负载腔体的接触面为精加工平面。
CN201510658838.4A 2015-10-12 2015-10-12 一种晶圆基板支架结构 Pending CN106571329A (zh)

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Cited By (2)

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CN110491774A (zh) * 2019-08-19 2019-11-22 中国科学院苏州纳米技术与纳米仿生研究所 一种蓝宝石衬底的表面处理方法及其使用的坩埚
CN111211082A (zh) * 2018-11-22 2020-05-29 沈阳拓荆科技有限公司 晶圆传输装置

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Publication number Priority date Publication date Assignee Title
CN111211082A (zh) * 2018-11-22 2020-05-29 沈阳拓荆科技有限公司 晶圆传输装置
CN111211082B (zh) * 2018-11-22 2022-10-25 拓荆科技股份有限公司 晶圆传输装置
CN110491774A (zh) * 2019-08-19 2019-11-22 中国科学院苏州纳米技术与纳米仿生研究所 一种蓝宝石衬底的表面处理方法及其使用的坩埚
CN110491774B (zh) * 2019-08-19 2021-10-26 中国科学院苏州纳米技术与纳米仿生研究所 一种蓝宝石衬底的表面处理方法及其使用的坩埚

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