JP5319908B2 - 回路装置 - Google Patents
回路装置 Download PDFInfo
- Publication number
- JP5319908B2 JP5319908B2 JP2007284348A JP2007284348A JP5319908B2 JP 5319908 B2 JP5319908 B2 JP 5319908B2 JP 2007284348 A JP2007284348 A JP 2007284348A JP 2007284348 A JP2007284348 A JP 2007284348A JP 5319908 B2 JP5319908 B2 JP 5319908B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit board
- lead
- circuit element
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
11 領域
12 ケース材
13 露出部
14 第1封止樹脂
16 第2封止樹脂
18 第1回路基板
20 第2回路基板
21 導電パターン
21A パッド
22 第1回路素子
24 第2回路素子
26 中空部
28A、28B リード
30 リード
32 実装基板
34 絶縁基板
36 絶縁層
38 導電パターン
38A、38B パッド
40 絶縁層
41 整流回路
42 金属細線
43 平滑回路
44 ドライバIC
45 スイッチング回路
46 モーター
48 室外機
50 筐体
52 圧縮機
54 凝縮機
56 ファン
58 ヒートシンク
60 実装基板
Claims (3)
- ケース材と、
前記ケース材に組み込まれると共に、表面に第1導電パターンが形成された第1回路基板と、
前記第1回路基板と重畳して前記ケース材に組み込まれると共に、表面に第2導電パターンが形成された第2回路基板と、
前記第1回路基板に実装されて前記第1導電パターンに電気的に接続された第1回路素子と、
前記第2回路基板に実装されて前記第2導電パターンに電気的に接続された第2回路素子と、
前記第1回路基板または前記第2回路基板の何れかに固着されるリードと、
前記第2回路素子が被覆されるように前記第2回路基板の上面に形成された封止樹脂と、
を備え、
前記リードには、
前記第1回路基板に実装された前記第1回路素子のみに接続して前記封止樹脂を貫通して外部に導出する第1リードと、
前記第2回路基板に実装された前記第2回路素子のみに接続して前記封止樹脂を貫通して外部に導出する第2リードと、
前記第1回路基板に実装された前記第1回路素子および前記第2回路基板に実装された前記第2回路素子の両方に接続して、端部が前記封止樹脂の内部に位置する第3リードと、
前記第1回路基板に実装された前記第1回路素子および前記第2回路基板に実装された前記第2回路素子の両方に接続して、前記第1回路素子から前記第2回路素子に供給される出力信号が通過する第4リードと、が含まれ、
前記第1回路基板に実装される前記第1回路素子にはパワートランジスタが含まれ、
前記第2回路基板に実装される前記第2回路素子には、前記第3リードを経由して前記パワートランジスタを制御する制御信号を生成する制御素子が含まれ、
前記第1リード、前記第3リードおよび前記第4リードが前記第2回路基板を貫通する貫通孔には接合材が充填されることを特徴とする回路装置。 - 前記パワートランジスタによりインバータ回路が構成されることを特徴とする請求項1に記載の回路装置。
- 前記インバータ回路により生成された正弦波電圧が前記第4リードを経由して前記制御素子に供給されることを特徴とする請求項2に記載の回路装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007284348A JP5319908B2 (ja) | 2007-10-31 | 2007-10-31 | 回路装置 |
TW097136816A TWI402952B (zh) | 2007-09-27 | 2008-09-25 | 電路裝置及其製造方法 |
US12/239,407 US8102670B2 (en) | 2007-09-27 | 2008-09-26 | Circuit device and method of manufacturing the same |
CN200810211468.XA CN101419965B (zh) | 2007-09-27 | 2008-09-26 | 电路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007284348A JP5319908B2 (ja) | 2007-10-31 | 2007-10-31 | 回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009111288A JP2009111288A (ja) | 2009-05-21 |
JP5319908B2 true JP5319908B2 (ja) | 2013-10-16 |
Family
ID=40630676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007284348A Active JP5319908B2 (ja) | 2007-09-27 | 2007-10-31 | 回路装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5319908B2 (ja) |
CN (1) | CN101419965B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10026665B2 (en) | 2015-09-15 | 2018-07-17 | Fuji Electric Co., Ltd. | Semiconductor device |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200461525Y1 (ko) * | 2010-09-28 | 2012-07-23 | 한상우 | 드라이버가 일체화된 송풍모터 제어용 파워트랜지스터 모듈 장치 |
JP5338830B2 (ja) * | 2011-03-15 | 2013-11-13 | 株式会社豊田自動織機 | 半導体装置 |
KR101321277B1 (ko) * | 2011-07-04 | 2013-10-28 | 삼성전기주식회사 | 전력 모듈 패키지 및 그 제조방법 |
JP5633496B2 (ja) * | 2011-09-29 | 2014-12-03 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
EP2635097B1 (en) * | 2012-02-28 | 2021-07-07 | Electrolux Home Products Corporation N.V. | An electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector |
US9179536B2 (en) * | 2012-05-30 | 2015-11-03 | Lear Corporation | Printed circuit board assembly and solder validation method |
WO2014064822A1 (ja) * | 2012-10-26 | 2014-05-01 | 株式会社日立産機システム | パワー半導体モジュールおよびこれを搭載した電力変換装置 |
CN103441120B (zh) * | 2013-08-22 | 2016-01-27 | 华东光电集成器件研究所 | 一种叠装的集成电路 |
DE102014216767A1 (de) * | 2014-08-22 | 2016-02-25 | Zf Friedrichshafen Ag | Anordnung zur Kontaktierung einer Leiterplatte |
CN106611758B (zh) * | 2015-10-23 | 2020-01-03 | 台达电子工业股份有限公司 | 整合功率模块封装结构 |
FR3044862B1 (fr) * | 2015-12-02 | 2020-10-16 | Valeo Systemes De Controle Moteur | Support d'une carte electronique, ensemble d'une carte electronique et d'un tel support, convertisseur de tension le comprenant et machine electrique pour vehicule automobile le comprenant |
FR3044864B1 (fr) * | 2015-12-02 | 2018-01-12 | Valeo Systemes De Controle Moteur | Dispositif electrique et procede d'assemblage d'un tel dispositif electrique |
US10204886B2 (en) * | 2016-01-29 | 2019-02-12 | Mitsubishi Electric Corporation | Semiconductor device |
JP6770456B2 (ja) * | 2017-02-17 | 2020-10-14 | ルネサスエレクトロニクス株式会社 | 電子装置 |
DE102018201842A1 (de) * | 2018-02-06 | 2019-08-08 | Siemens Aktiengesellschaft | Leistungselektronische Schaltung mit mehreren Leistungsmodulen |
CN110197824A (zh) * | 2019-06-20 | 2019-09-03 | 深圳市汇川技术股份有限公司 | 智能功率模块封装结构 |
CN111834353B (zh) * | 2020-07-17 | 2023-03-24 | 北京市科通电子继电器总厂有限公司 | 一种sip叠层结构 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6216554A (ja) * | 1985-07-15 | 1987-01-24 | Sharp Corp | 制御回路内蔵型電力半導体装置 |
JPS62222659A (ja) * | 1986-03-24 | 1987-09-30 | Sharp Corp | 電力半導体装置 |
JP2614764B2 (ja) * | 1989-04-28 | 1997-05-28 | 三菱電機株式会社 | 半導体装置 |
JPH079969B2 (ja) * | 1990-05-28 | 1995-02-01 | 三洋電機株式会社 | 高出力用混成集積回路装置 |
JP3206717B2 (ja) * | 1996-04-02 | 2001-09-10 | 富士電機株式会社 | 電力用半導体モジュール |
JPH10242385A (ja) * | 1997-02-27 | 1998-09-11 | Yamaha Motor Co Ltd | 電力用混合集積回路装置 |
JP3547333B2 (ja) * | 1999-02-22 | 2004-07-28 | 株式会社日立産機システム | 電力変換装置 |
JP2000323878A (ja) * | 1999-05-12 | 2000-11-24 | Matsushita Electric Ind Co Ltd | 電子機器の冷却構造 |
JP2004063604A (ja) * | 2002-07-26 | 2004-02-26 | Hitachi Home & Life Solutions Inc | パワーモジュール及びこのパワーモジュールを用いた冷蔵庫 |
US7218517B2 (en) * | 2004-12-07 | 2007-05-15 | International Business Machines Corporation | Cooling apparatus for vertically stacked printed circuit boards |
-
2007
- 2007-10-31 JP JP2007284348A patent/JP5319908B2/ja active Active
-
2008
- 2008-09-26 CN CN200810211468.XA patent/CN101419965B/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10026665B2 (en) | 2015-09-15 | 2018-07-17 | Fuji Electric Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN101419965B (zh) | 2012-04-25 |
CN101419965A (zh) | 2009-04-29 |
JP2009111288A (ja) | 2009-05-21 |
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