JP5005534B2 - ダイと、ボールグリッドアレイパッケージを覆うように積層された反転ランドグリッドアレイパッケージとを含む半導体マルチパッケージモジュール - Google Patents
ダイと、ボールグリッドアレイパッケージを覆うように積層された反転ランドグリッドアレイパッケージとを含む半導体マルチパッケージモジュール Download PDFInfo
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Description
本出願は、ここに参照することにより本書に含まれる、「ダイと、ボールグリッドアレイパッケージを覆うように積層された反転ランドグリッドアレイパッケージとを含む半導体マルチパッケージモジュール」と題された、2004年7月13日に出願された、米国仮出願No.60/587,428の利益を主張する、「ダイと、ボールグリッドアレイパッケージを覆うように積層された反転ランドグリッドアレイパッケージとを含む半導体マルチパッケージモジュール」と題された、2004年12月23日に出願された米国特許出願No.11/022,375の利益を主張する。
Claims (8)
- 半導体パッケージであって、
第一パッケージ回路基板上に搭載された第一ダイを備え、該第一ダイの活性表面が前記第一パッケージ回路基板とは反対側を向いており、前記第一ダイが前記第一パッケージ回路基板の導電線へワイヤボンドにより電気的に相互接続され、前記第一ダイの前記活性表面がスペーサ接着領域と第二ダイ接着領域とを含み、前記半導体パッケージはさらに、
前記第一ダイの前記活性表面の前記第二ダイ接着領域上に搭載される第二ダイを備え、前記第二ダイ接着領域が前記スペーサ接着領域の外側にあり、前記半導体パッケージはさらに、
前記スペーサ接着領域上に搭載されたスペーサと、
前記スペーサ上に搭載され、前記第二ダイの少なくとも一部の上に覆いかぶさるように張り出した第二パッケージとを備える、半導体パッケージ。 - 前記第二ダイは、前記第一パッケージ回路基板上の導電線へワイヤボンドにより電気的に相互接続されることを特徴とする請求項1に記載の半導体パッケージ。
- 前記第二ダイは、前記第一ダイ上のパッドに直接、ワイヤボンドにより電気的に相互接続されることを特徴とする請求項1または2に記載の半導体パッケージ。
- 前記第二パッケージは反転されたランドグリッドアレイであり、ランドグリッドアレイパッケージは、前記第二パッケージの上側表面上のワイヤボンド位置と前記第一パッケージ回路基板の上側表面のワイヤボンド位置との間のワイヤボンドにより前記第一パッケージへ電気的に相互接続されることを特徴とする請求項1乃至3の何れかに記載の半導体パッケージ。
- 前記スペーサ接着領域が第一ダイの端付近に配置されることを特徴とする請求項1乃至4の何れかに記載の半導体パッケージ。
- 前記第二ダイ接着領域は、前記第一ダイの活性側の中心から離れて配置されることを特徴とする請求項1乃至4の何れかに記載の半導体パッケージ。
- 前記第二ダイ接着領域は、前記第一ダイの活性側の端付近に配置されることを特徴とする請求項1乃至4の何れかに記載の半導体パッケージ。
- 前記第二ダイ接着領域は、前記第一ダイの活性側の隅付近に配置されることを特徴とする請求項1乃至4の何れかに記載の半導体パッケージ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58742804P | 2004-07-13 | 2004-07-13 | |
US60/587,428 | 2004-07-13 | ||
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PCT/US2005/024538 WO2006017224A2 (en) | 2004-07-13 | 2005-07-11 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
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TWI380431B (en) | 2012-12-21 |
KR100996318B1 (ko) | 2010-11-23 |
US20070278658A1 (en) | 2007-12-06 |
KR20070031376A (ko) | 2007-03-19 |
WO2006017224A3 (en) | 2006-08-10 |
TW200625597A (en) | 2006-07-16 |
US7829382B2 (en) | 2010-11-09 |
US7692279B2 (en) | 2010-04-06 |
US20100136744A1 (en) | 2010-06-03 |
WO2006017224A2 (en) | 2006-02-16 |
US20060012018A1 (en) | 2006-01-19 |
JP2008507134A (ja) | 2008-03-06 |
US7253511B2 (en) | 2007-08-07 |
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