JP4973747B2 - 搬送車システム - Google Patents

搬送車システム Download PDF

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Publication number
JP4973747B2
JP4973747B2 JP2010038082A JP2010038082A JP4973747B2 JP 4973747 B2 JP4973747 B2 JP 4973747B2 JP 2010038082 A JP2010038082 A JP 2010038082A JP 2010038082 A JP2010038082 A JP 2010038082A JP 4973747 B2 JP4973747 B2 JP 4973747B2
Authority
JP
Japan
Prior art keywords
loop
transport vehicle
loops
vehicle system
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010038082A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011173673A (ja
Inventor
正富 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muratec Automation Co Ltd
Original Assignee
Muratec Automation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muratec Automation Co Ltd filed Critical Muratec Automation Co Ltd
Priority to JP2010038082A priority Critical patent/JP4973747B2/ja
Priority to CN201010547578.0A priority patent/CN102161417B/zh
Priority to KR1020100112589A priority patent/KR101414530B1/ko
Priority to TW100102077A priority patent/TWI466809B/zh
Publication of JP2011173673A publication Critical patent/JP2011173673A/ja
Application granted granted Critical
Publication of JP4973747B2 publication Critical patent/JP4973747B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G35/00Mechanical conveyors not otherwise provided for
    • B65G35/06Mechanical conveyors not otherwise provided for comprising a load-carrier moving along a path, e.g. a closed path, and adapted to be engaged by any one of a series of traction elements spaced along the path
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010038082A 2010-02-24 2010-02-24 搬送車システム Expired - Fee Related JP4973747B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010038082A JP4973747B2 (ja) 2010-02-24 2010-02-24 搬送車システム
CN201010547578.0A CN102161417B (zh) 2010-02-24 2010-11-12 输送车***
KR1020100112589A KR101414530B1 (ko) 2010-02-24 2010-11-12 반송차 시스템
TW100102077A TWI466809B (zh) 2010-02-24 2011-01-20 Transport system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010038082A JP4973747B2 (ja) 2010-02-24 2010-02-24 搬送車システム

Publications (2)

Publication Number Publication Date
JP2011173673A JP2011173673A (ja) 2011-09-08
JP4973747B2 true JP4973747B2 (ja) 2012-07-11

Family

ID=44462933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010038082A Expired - Fee Related JP4973747B2 (ja) 2010-02-24 2010-02-24 搬送車システム

Country Status (4)

Country Link
JP (1) JP4973747B2 (zh)
KR (1) KR101414530B1 (zh)
CN (1) CN102161417B (zh)
TW (1) TWI466809B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5648865B2 (ja) * 2012-06-18 2015-01-07 株式会社ダイフク 天井搬送車及び物品搬送設備
EP2786948B1 (de) * 2013-04-04 2017-03-15 Knapp AG Lagersystem mit einem durch magnetisch angetriebene Shuttles ausgebildeten Transportsystem
AT516404B1 (de) * 2015-03-04 2016-05-15 Knapp Ag Regallager mit einem Kreisverkehr auf einer geschlossenen Führungsbahn
US11458847B2 (en) * 2017-01-27 2022-10-04 Murata Machinery, Ltd. Article transferring device
JP6965646B2 (ja) * 2017-09-06 2021-11-10 株式会社ダイフク 搬送車、及び、搬送設備
JP6874698B2 (ja) * 2018-01-10 2021-05-19 株式会社ダイフク 物品収納設備
JP6644819B2 (ja) * 2018-02-09 2020-02-12 本田技研工業株式会社 搬送作業設備
CN111383966A (zh) * 2019-05-30 2020-07-07 乐清市芮易经济信息咨询有限公司 一种半导体片清洗设备
CN111736540B (zh) * 2020-03-20 2021-10-15 北京京东乾石科技有限公司 货物分拣控制方法、装置、电子设备及存储介质

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1159829A (ja) 1997-08-08 1999-03-02 Mitsubishi Electric Corp 半導体ウェハカセット搬送装置、半導体ウェハカセット搬送装置で用いられるストッカ、ならびに半導体ウェハカセット搬送装置で用いられるストッカ入庫作業制御方法、ストッカ出庫作業制御方法、自動搬送車制御方法、およびストッカ在庫照合方法
CN1224237A (zh) * 1998-01-23 1999-07-28 日本电气株式会社 工件传送方法及***
JP2000355403A (ja) * 1999-06-17 2000-12-26 Murata Mach Ltd 搬送システム
TWI256372B (en) 2001-12-27 2006-06-11 Tokyo Electron Ltd Carrier system of polishing processing body and conveying method of polishing processing body
JP3991852B2 (ja) * 2002-12-09 2007-10-17 村田機械株式会社 天井搬送車システム
US6990721B2 (en) * 2003-03-21 2006-01-31 Brooks Automation, Inc. Growth model automated material handling system
JP2006290491A (ja) * 2005-04-07 2006-10-26 Murata Mach Ltd 搬送車システム
JP2007191235A (ja) * 2006-01-17 2007-08-02 Murata Mach Ltd 天井走行車システム
JP4389225B2 (ja) * 2006-01-30 2009-12-24 村田機械株式会社 搬送システム
JP5266683B2 (ja) * 2007-08-03 2013-08-21 村田機械株式会社 搬送システム、及び該搬送システムにおける教示方法
JP2009076578A (ja) * 2007-09-19 2009-04-09 Nikon Corp 物体処理システム、物体処理方法、露光装置、露光方法、塗布現像装置、塗布現像方法及びデバイス製造方法
CN101234677B (zh) * 2008-02-19 2010-07-28 姜广峻 货物分拣分装设备及其方法

Also Published As

Publication number Publication date
JP2011173673A (ja) 2011-09-08
KR101414530B1 (ko) 2014-07-03
TWI466809B (zh) 2015-01-01
TW201139252A (en) 2011-11-16
CN102161417A (zh) 2011-08-24
KR20110097599A (ko) 2011-08-31
CN102161417B (zh) 2015-04-01

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