JP4858657B1 - 基板検査装置、及び基板検査方法 - Google Patents

基板検査装置、及び基板検査方法 Download PDF

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Publication number
JP4858657B1
JP4858657B1 JP2011175979A JP2011175979A JP4858657B1 JP 4858657 B1 JP4858657 B1 JP 4858657B1 JP 2011175979 A JP2011175979 A JP 2011175979A JP 2011175979 A JP2011175979 A JP 2011175979A JP 4858657 B1 JP4858657 B1 JP 4858657B1
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substrate
support
contact
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base
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Japanese (ja)
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JP2013040780A (ja
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幸則 川本
真彰 岡田
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Fujifilm Business Innovation Corp
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Fuji Xerox Co Ltd
Fujifilm Business Innovation Corp
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Priority to CN201210028752.XA priority patent/CN102928685B/zh
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  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
JP2011175979A 2011-08-11 2011-08-11 基板検査装置、及び基板検査方法 Expired - Fee Related JP4858657B1 (ja)

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Application Number Priority Date Filing Date Title
JP2011175979A JP4858657B1 (ja) 2011-08-11 2011-08-11 基板検査装置、及び基板検査方法
CN201210028752.XA CN102928685B (zh) 2011-08-11 2012-02-09 基板检查装置及基板检查方法

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JP2011175979A JP4858657B1 (ja) 2011-08-11 2011-08-11 基板検査装置、及び基板検査方法

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JP4858657B1 true JP4858657B1 (ja) 2012-01-18
JP2013040780A JP2013040780A (ja) 2013-02-28

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JP (1) JP4858657B1 (zh)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5482958B1 (ja) * 2013-11-25 2014-05-07 富士ゼロックス株式会社 検査装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103698630B (zh) * 2013-12-12 2016-04-06 合肥京东方光电科技有限公司 一种电学阵列检测设备
JP6365231B2 (ja) * 2014-10-23 2018-08-01 富士ゼロックス株式会社 検査装置、検査方法
KR101656047B1 (ko) * 2016-03-23 2016-09-09 주식회사 나노시스 기판 검사용 지그
WO2017195300A1 (ja) * 2016-05-11 2017-11-16 Ｗｉｔ株式会社 多機能型基板検査装置および多機能型基板検査方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302377A (ja) * 1987-06-02 1988-12-09 Tokyo Electron Ltd 回路基板検査装置
JPH09138257A (ja) * 1995-11-14 1997-05-27 Nec Corp プリント基板の検査装置および方法
JPH1026656A (ja) * 1996-07-10 1998-01-27 Nippon Columbia Co Ltd 基板の検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
JP5034382B2 (ja) * 2006-09-01 2012-09-26 株式会社島津製作所 Ｔｆｔアレイの検査方法及びｔｆｔアレイ検査装置
TW200821247A (en) * 2006-09-22 2008-05-16 Olympus Corp Substrate inspecting apparatus
JP2008300456A (ja) * 2007-05-29 2008-12-11 Saki Corp:Kk 被検査体の検査システム
JP2010122202A (ja) * 2008-10-23 2010-06-03 Nidec-Read Corp 基板検査治具及びそれを備える基板検査装置
JP2011086880A (ja) * 2009-10-19 2011-04-28 Advantest Corp 電子部品実装装置および電子部品の実装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302377A (ja) * 1987-06-02 1988-12-09 Tokyo Electron Ltd 回路基板検査装置
JPH09138257A (ja) * 1995-11-14 1997-05-27 Nec Corp プリント基板の検査装置および方法
JPH1026656A (ja) * 1996-07-10 1998-01-27 Nippon Columbia Co Ltd 基板の検査装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5482958B1 (ja) * 2013-11-25 2014-05-07 富士ゼロックス株式会社 検査装置
CN104656005A (zh) * 2013-11-25 2015-05-27 富士施乐株式会社 检查设备
CN104656005B (zh) * 2013-11-25 2018-01-23 富士施乐株式会社 检查设备

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CN102928685B (zh) 2017-06-23
CN102928685A (zh) 2013-02-13
JP2013040780A (ja) 2013-02-28

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