JP4694436B2 - 搬送ロボット - Google Patents
搬送ロボット Download PDFInfo
- Publication number
- JP4694436B2 JP4694436B2 JP2006206179A JP2006206179A JP4694436B2 JP 4694436 B2 JP4694436 B2 JP 4694436B2 JP 2006206179 A JP2006206179 A JP 2006206179A JP 2006206179 A JP2006206179 A JP 2006206179A JP 4694436 B2 JP4694436 B2 JP 4694436B2
- Authority
- JP
- Japan
- Prior art keywords
- drive
- moving member
- moving
- drive source
- drive mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000007246 mechanism Effects 0.000 claims description 125
- 230000005540 biological transmission Effects 0.000 claims description 22
- 238000004891 communication Methods 0.000 claims description 5
- 230000002452 interceptive effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000003028 elevating effect Effects 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 208000035126 Facies Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011553 magnetic fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/104—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/04—Arms extensible rotatable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
B1 直線移動機構
GL 移動行程
M3 モータ(第1駆動源)
M4 モータ(第2駆動源)
Os 旋回軸
W ワーク
1 ガイド部材
17 モータハウジング(ハウジング)
18 管体(連通路)
2A 第1移動部材
2B 第2移動部材
21a,21b ハンド
24a,24b 連結部材
3A 第1駆動機構
3B 第2駆動機構
3Aa,3Bb 区間(往復動区間)
31b 駆動プーリ
200 固定ベース
Claims (5)
- ガイド部材と、このガイド部材上に設定された水平直線状の移動行程に沿って移動可能な移動部材と、駆動源と、この駆動源によって回転駆動される伝動軸、この伝動軸に取り付けられた駆動プーリ、およびこの駆動プーリに掛け回されて上記移動行程の平行線に沿う所定の往復動区間を往復動する出力ベルト、を含んで構成された駆動機構と、を備えた直線移動機構が固定ベースに対し、上記移動行程上における鉛直状の旋回軸を中心として旋回しうるように支持されているとともに、上記移動部材には、板状ワークを載置しうるハンドが設けられている搬送ロボットであって、
上記移動部材は、連結部材によって上記駆動機構の上記出力ベルトに連結されており、
上記駆動源および上記駆動機構は、上記ガイド部材に支持されており、
上記駆動源は、上記伝動軸の中間部がシール機構を介してハウジングに対して回転可能に支持されることにより、上記ハウジング内に気密された状態で上記ガイド部材に支持されており、かつ、
上記ハウジングには、上記気密状態を維持したまま上記固定ベースと連通する連通路が連結されていることを特徴とする、搬送ロボット。 - 上記駆動源は、上記移動部材に近接して配置されている、請求項1に記載の搬送ロボット。
- 上記駆動機構は、上記出力ベルトに張力を付与するテンショナーを含んでいる、請求項1または2に記載の搬送ロボット。
- 上記移動部材は、上記移動行程に沿って相互に干渉することなく移動可能に上記ガイド部材に支持された第1移動部材および第2移動部材を含んでいるとともに、
上記駆動機構は、上記第1移動部材および上記第2移動部材をそれぞれ駆動するように上記ガイド部材に設けられた第1駆動機構および第2駆動機構を含んでおり、
上記駆動源としては、上記第1駆動機構および上記第2移動機構にそれぞれ駆動力を付与するための第1駆動源および第2駆動源を備えている、請求項1ないし3のいずれかに記載の搬送ロボット。 - 上記第1駆動源および上記第2駆動源は、上記移動行程に沿う方向に離間して配置されている、請求項4に記載の搬送ロボット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006206179A JP4694436B2 (ja) | 2006-07-28 | 2006-07-28 | 搬送ロボット |
TW096123747A TWI433764B (zh) | 2006-07-28 | 2007-06-29 | A linear moving mechanism and a handling robot using the mechanism |
US11/879,613 US7850414B2 (en) | 2006-07-28 | 2007-07-18 | Linear transfer mechanism and transfer robot using the same |
KR1020070074462A KR101438150B1 (ko) | 2006-07-28 | 2007-07-25 | 반송 로봇 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006206179A JP4694436B2 (ja) | 2006-07-28 | 2006-07-28 | 搬送ロボット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008030151A JP2008030151A (ja) | 2008-02-14 |
JP2008030151A5 JP2008030151A5 (ja) | 2009-07-16 |
JP4694436B2 true JP4694436B2 (ja) | 2011-06-08 |
Family
ID=38985033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006206179A Active JP4694436B2 (ja) | 2006-07-28 | 2006-07-28 | 搬送ロボット |
Country Status (4)
Country | Link |
---|---|
US (1) | US7850414B2 (ja) |
JP (1) | JP4694436B2 (ja) |
KR (1) | KR101438150B1 (ja) |
TW (1) | TWI433764B (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8336419B2 (en) * | 2004-04-08 | 2012-12-25 | Fabworx Solutions, Inc. | Hub assembly for robotic arm having pin spacers |
US8322963B2 (en) * | 2008-04-18 | 2012-12-04 | Applied Materials, Inc. | End effector for a cluster tool |
KR100987362B1 (ko) * | 2008-09-02 | 2010-10-13 | 주식회사 티이에스 | 반송챔버 내에서 사용하기에 적합한 기판반송장치 |
KR101023050B1 (ko) * | 2008-10-30 | 2011-03-24 | 주식회사 티이에스 | 진공환경의 반송챔버 내에서 대형기판을 반송시키는데 적합한 기판반송장치 |
JP5139253B2 (ja) * | 2008-12-18 | 2013-02-06 | 東京エレクトロン株式会社 | 真空処理装置及び真空搬送装置 |
JP5419581B2 (ja) | 2009-07-31 | 2014-02-19 | 東京エレクトロン株式会社 | 搬送機構の組み立て方法および搬送室 |
US9691650B2 (en) * | 2009-09-29 | 2017-06-27 | Applied Materials, Inc. | Substrate transfer robot with chamber and substrate monitoring capability |
USRE44567E1 (en) * | 2009-11-17 | 2013-11-05 | Ulvac, Inc. | Vacuum transfer robot |
USRE43781E1 (en) * | 2009-11-17 | 2012-11-06 | Ulvac, Inc. | Vacuum transfer robot |
USD639323S1 (en) * | 2010-05-06 | 2011-06-07 | Ulvac, Inc. | Vacuum transfer robot |
USD625748S1 (en) * | 2010-05-06 | 2010-10-19 | Ulvac, Inc. | Vacuum transfer robot |
KR101022057B1 (ko) | 2010-09-28 | 2011-03-16 | 주식회사 티이에스 | 반송챔버 내에서 사용하기에 적합한 기판반송장치 |
KR101338858B1 (ko) * | 2011-01-31 | 2013-12-16 | 주식회사 나온테크 | 개별적으로 구동되는 핸드를 갖는 기판 이송 장치 및 그 제어 방법 |
KR101338857B1 (ko) * | 2011-01-31 | 2013-12-16 | 주식회사 나온테크 | 4개의 기판 지지부 갖는 기판 이송 장치 |
TW201240897A (en) * | 2011-04-06 | 2012-10-16 | Hon Hai Prec Ind Co Ltd | Transmission mechanism and surface mount equipment using the same |
CN102740607A (zh) * | 2011-04-06 | 2012-10-17 | 鸿富锦精密工业(深圳)有限公司 | 传输机构及具有该传输机构的贴片设备 |
KR101310293B1 (ko) * | 2011-08-03 | 2013-09-23 | (주)동부로봇 | 다단 슬라이드형 기판이송장치 |
EP2771243B1 (en) | 2011-10-24 | 2016-07-13 | Remedi Technology Holdings, LLC | Packaging system for pharmaceutical dispenser and associated method |
KR101308988B1 (ko) * | 2012-07-24 | 2013-10-02 | 주식회사 서진엔지니어링 | 반송 로봇 |
CN108214631B (zh) * | 2012-12-11 | 2020-05-19 | 上海德仁橡塑机械有限公司 | 一种成型机及其操作方法 |
TWI556908B (zh) * | 2012-12-11 | 2016-11-11 | 鴻海精密工業股份有限公司 | 物料中轉裝置 |
US10221478B2 (en) * | 2013-04-30 | 2019-03-05 | Tokyo Electron Limited | Film formation device |
JP6190692B2 (ja) * | 2013-10-22 | 2017-08-30 | 日本電産サンキョー株式会社 | 産業用ロボット |
JP6276090B2 (ja) * | 2014-03-31 | 2018-02-07 | 株式会社ダイヘン | 搬送装置、搬送システム |
KR101483082B1 (ko) * | 2014-04-02 | 2015-01-19 | 주식회사 로보스타 | 8 로봇암을 구비한 반송 로봇 |
US10470841B2 (en) | 2017-03-28 | 2019-11-12 | Steris Inc. | Robot-based rack processing system |
JP6869137B2 (ja) * | 2017-07-28 | 2021-05-12 | 日本電産サンキョー株式会社 | 産業用ロボット |
JP6869136B2 (ja) * | 2017-07-28 | 2021-05-12 | 日本電産サンキョー株式会社 | 産業用ロボット |
JP6902422B2 (ja) * | 2017-07-28 | 2021-07-14 | 日本電産サンキョー株式会社 | 産業用ロボット |
CN112060127A (zh) * | 2020-09-15 | 2020-12-11 | 安庆帆盛机电科技有限公司 | 一种具有自行走功能的多自由度机器人 |
JP7496772B2 (ja) * | 2020-12-28 | 2024-06-07 | ニデックインスツルメンツ株式会社 | 産業用ロボット |
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JPH02126648A (ja) * | 1988-11-07 | 1990-05-15 | Tokyo Electron Ltd | 処理装置 |
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JPH06246658A (ja) * | 1993-02-19 | 1994-09-06 | Tokyo Electron Ltd | 基板搬送装置 |
JPH0742800A (ja) * | 1993-08-03 | 1995-02-10 | Matsushita Electric Ind Co Ltd | ダブルハンドリング装置 |
JPH08293534A (ja) * | 1995-04-20 | 1996-11-05 | Tokyo Electron Ltd | 被処理体の搬送装置 |
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-
2006
- 2006-07-28 JP JP2006206179A patent/JP4694436B2/ja active Active
-
2007
- 2007-06-29 TW TW096123747A patent/TWI433764B/zh active
- 2007-07-18 US US11/879,613 patent/US7850414B2/en active Active
- 2007-07-25 KR KR1020070074462A patent/KR101438150B1/ko active IP Right Grant
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JPH02126648A (ja) * | 1988-11-07 | 1990-05-15 | Tokyo Electron Ltd | 処理装置 |
JPH04101919A (ja) * | 1990-08-21 | 1992-04-03 | Shin Meiwa Ind Co Ltd | ピッチ可変装置 |
JPH0463643U (ja) * | 1990-10-12 | 1992-05-29 | ||
JPH06246658A (ja) * | 1993-02-19 | 1994-09-06 | Tokyo Electron Ltd | 基板搬送装置 |
JPH0742800A (ja) * | 1993-08-03 | 1995-02-10 | Matsushita Electric Ind Co Ltd | ダブルハンドリング装置 |
JPH08293534A (ja) * | 1995-04-20 | 1996-11-05 | Tokyo Electron Ltd | 被処理体の搬送装置 |
JPH10335427A (ja) * | 1997-06-05 | 1998-12-18 | Kokusai Electric Co Ltd | ウェーハ移載機 |
JP2003203963A (ja) * | 2002-01-08 | 2003-07-18 | Tokyo Electron Ltd | 搬送機構、処理システム及び搬送方法 |
Also Published As
Publication number | Publication date |
---|---|
US7850414B2 (en) | 2010-12-14 |
TW200823025A (en) | 2008-06-01 |
JP2008030151A (ja) | 2008-02-14 |
TWI433764B (zh) | 2014-04-11 |
KR20080011073A (ko) | 2008-01-31 |
US20080023293A1 (en) | 2008-01-31 |
KR101438150B1 (ko) | 2014-09-05 |
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