JP4299760B2 - 半導体装置のテスト方法 - Google Patents
半導体装置のテスト方法 Download PDFInfo
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- JP4299760B2 JP4299760B2 JP2004306357A JP2004306357A JP4299760B2 JP 4299760 B2 JP4299760 B2 JP 4299760B2 JP 2004306357 A JP2004306357 A JP 2004306357A JP 2004306357 A JP2004306357 A JP 2004306357A JP 4299760 B2 JP4299760 B2 JP 4299760B2
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- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Tests Of Electronic Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
前記半導体装置の通常動作時には、前記スイッチ手段をオフさせて前記信号線と前記スタブ配線との間を非導通とし、前記半導体装置のテスト時には、前記スイッチ手段をオンさせて前記信号線と前記スタブ配線との間を導通として前記テストを行うことを特徴とする。
前記半導体装置の通常動作時には、前記セレクタにより前記N本の信号線と前記スタブ配線との間を非導通とし、前記半導体装置のテスト時には、前記セレクタにより前記N本の信号線のいずれか1本と前記スタブ配線との間を導通として前記テストを行うことを特徴とする。
2 下層チップ
3 スイッチトランジスタ
4 ボンディングワイヤ
5 パッド
6 信号線
7、17 プリント基板
8,18,28,38,48,58 テスト用スタブ配線
9 半田ボール
10 メイン信号配線
11 テスト用パッド
12 メイン信号パッド
13 テスト用信号ピン
14、15 半導体装置
16 他の信号線
20 セレクタ
21 外部スイッチトランジスタ
22 ヒューズ
23 コネクタ
24 コネクタ挿入口
25 プローブ
26 プローブ挿入口
27 モールド
30 外部セレクタ
31 テスト用ランド
32 信号用ランド
Claims (3)
- 第1の機能を含む第1の半導体装置と、第2の機能を含む第2の半導体装置とを積層し、前記第1と第2の半導体装置の間を接続する信号線と、外部端子に接続されるスタブ配線と、前記信号線と前記スタブ配線との間を導通または非道通とするスイッチ手段とを備えた半導体装置のテスト方法であって、
前記半導体装置の通常動作時には、前記スイッチ手段をオフさせて前記信号線と前記スタブ配線との間を非導通とし、前記半導体装置のテスト時には、前記スイッチ手段をオンさせて前記信号線と前記スタブ配線との間を導通として前記テストを行うことを特徴とする半導体装置のテスト方法。 - 第1の機能を含む第1の半導体装置と、第2の機能を含む第2の半導体装置とを積層し、前記第1と第2の半導体装置の間を接続するN本の信号線と、外部端子に接続されるスタブ配線と、前記N本の信号線と前記スタブ配線との間を導通または非道通とするセレクタとを備えた半導体装置のテスト方法であって、
前記半導体装置の通常動作時には、前記セレクタにより前記N本の信号線と前記スタブ配線との間を非導通とし、前記半導体装置のテスト時には、前記セレクタにより前記N本の信号線のいずれか1本と前記スタブ配線との間を導通として前記テストを行うことを特徴とする半導体装置のテスト方法。 - 前記第1の半導体装置のテスト時におけるテスト出力信号の外部への出力、及び前記第2の半導体装置のテスト時におけるテスト入力信号の外部よりの入力が、1つの前記外部端子を介して行われることを特徴とする請求項1または請求項2記載の半導体装置のテスト方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004306357A JP4299760B2 (ja) | 2004-10-21 | 2004-10-21 | 半導体装置のテスト方法 |
US11/254,703 US7466158B2 (en) | 2004-10-21 | 2005-10-21 | Multilayer semiconductor device |
US12/264,301 US7880491B2 (en) | 2004-10-21 | 2008-11-04 | Multilayer semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004306357A JP4299760B2 (ja) | 2004-10-21 | 2004-10-21 | 半導体装置のテスト方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008014543A Division JP5638738B2 (ja) | 2008-01-25 | 2008-01-25 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2006120812A JP2006120812A (ja) | 2006-05-11 |
JP4299760B2 true JP4299760B2 (ja) | 2009-07-22 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004306357A Expired - Fee Related JP4299760B2 (ja) | 2004-10-21 | 2004-10-21 | 半導体装置のテスト方法 |
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Country | Link |
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US (2) | US7466158B2 (ja) |
JP (1) | JP4299760B2 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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US7679195B2 (en) * | 2006-06-20 | 2010-03-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | PAD structure and method of testing |
US7649745B2 (en) * | 2006-11-08 | 2010-01-19 | Intel Corporation | Circuit board including stubless signal paths and method of making same |
JP2008263150A (ja) * | 2007-04-16 | 2008-10-30 | Matsushita Electric Ind Co Ltd | 半導体装置および検査方法 |
JP5149554B2 (ja) * | 2007-07-17 | 2013-02-20 | 株式会社日立製作所 | 半導体装置 |
KR101321947B1 (ko) | 2007-09-20 | 2013-11-04 | 삼성전자주식회사 | 정전기 방전 보호회로를 구비하는 반도체 장치 및 이장치의 테스트 방법 |
JP2009139273A (ja) | 2007-12-07 | 2009-06-25 | Elpida Memory Inc | 積層型半導体装置および導通テスト方法 |
JP2009156689A (ja) * | 2007-12-26 | 2009-07-16 | Fujitsu Microelectronics Ltd | 半導体集積回路 |
US8242589B2 (en) * | 2009-02-27 | 2012-08-14 | Hitachi, Ltd. | Semiconductor device |
KR101143398B1 (ko) * | 2009-07-30 | 2012-05-22 | 에스케이하이닉스 주식회사 | 반도체 집적회로 |
KR20110133945A (ko) * | 2010-06-08 | 2011-12-14 | 삼성전자주식회사 | 스택 패키지 및 그의 제조 방법 |
JP2012114241A (ja) * | 2010-11-25 | 2012-06-14 | Renesas Electronics Corp | 半導体チップおよび半導体装置 |
KR101913839B1 (ko) | 2012-04-10 | 2018-12-31 | 삼성디스플레이 주식회사 | 표시 장치 및 그것의 테스트 방법 |
TWM461699U (zh) * | 2013-02-06 | 2013-09-11 | Jim Technology Co Ltd | 含氧感知器之訊號修訂裝置 |
JP6254807B2 (ja) * | 2013-09-27 | 2017-12-27 | ローム株式会社 | 半導体装置および電子機器 |
CN106796251A (zh) * | 2014-08-11 | 2017-05-31 | 株式会社村田制作所 | 探针卡以及该探针卡所具备的层叠布线基板 |
US10838003B2 (en) * | 2016-05-24 | 2020-11-17 | Duke University | Multi-layer integrated circuits having isolation cells for layer testing and related methods |
US10338133B2 (en) * | 2016-05-24 | 2019-07-02 | Duke University | Multi-layer integrated circuits having isolation cells for layer testing and related methods |
JP6798252B2 (ja) * | 2016-10-31 | 2020-12-09 | 住友電気工業株式会社 | 高周波装置 |
CN110998847B (zh) * | 2019-05-13 | 2022-07-08 | 京东方科技集团股份有限公司 | 阵列基板、显示设备和制造阵列基板的方法 |
CN114078566A (zh) * | 2020-08-14 | 2022-02-22 | 长鑫存储技术有限公司 | 测试治具 |
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JP2002217367A (ja) | 2001-01-15 | 2002-08-02 | Mitsubishi Electric Corp | 半導体チップ、半導体装置および半導体装置の製造方法 |
WO2002082540A1 (fr) | 2001-03-30 | 2002-10-17 | Fujitsu Limited | Dispositif a semi-conducteurs, son procede de fabrication et substrat semi-conducteur connexe |
DE10259221B4 (de) * | 2002-12-17 | 2007-01-25 | Infineon Technologies Ag | Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben |
US6861288B2 (en) * | 2003-01-23 | 2005-03-01 | St Assembly Test Services, Ltd. | Stacked semiconductor packages and method for the fabrication thereof |
KR100575882B1 (ko) * | 2003-11-26 | 2006-05-03 | 주식회사 하이닉스반도체 | 번인 테스트용 내부 전압 발생 장치 |
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US7880491B2 (en) | 2011-02-01 |
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US7466158B2 (en) | 2008-12-16 |
US20060087021A1 (en) | 2006-04-27 |
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