JP5638738B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5638738B2 JP5638738B2 JP2008014543A JP2008014543A JP5638738B2 JP 5638738 B2 JP5638738 B2 JP 5638738B2 JP 2008014543 A JP2008014543 A JP 2008014543A JP 2008014543 A JP2008014543 A JP 2008014543A JP 5638738 B2 JP5638738 B2 JP 5638738B2
- Authority
- JP
- Japan
- Prior art keywords
- test
- semiconductor device
- signal
- chip
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
2 下層チップ
3 スイッチトランジスタ
4 ボンディングワイヤ
5 パッド
6 信号線
7、17 プリント基板
8,18,28,38,48,58 テスト用スタブ配線
9 半田ボール
10 メイン信号配線
11 テスト用パッド
12 メイン信号パッド
13 テスト用信号ピン
14、15 半導体装置
16 他の信号線
20 セレクタ
21 外部スイッチトランジスタ
22 ヒューズ
23 コネクタ
24 コネクタ挿入口
25 プローブ
26 プローブ挿入口
27 モールド
30 外部セレクタ
31 テスト用ランド
32 信号用ランド
Claims (5)
- 第1の機能を含む第1の半導体装置と、第2の機能を含む第2の半導体装置とを積層し、前記第1と第2の半導体装置の間を接続する信号線と、通常動作時には使用しないテスト用スタブ配線を介さず前記信号線に電気的に接続するために設けられた挿入口と、を備える半導体装置であって、前記第1又は第2の半導体装置の通常動作時には、前記挿入口にコネクタを挿入せずに前記信号線と前記テスト用スタブ配線とを非接続とし、前記第1又は第2の半導体装置のテスト時には、前記挿入口にコネクタが挿入され、前記信号線と外部計測器が接続されることを特徴とする半導体装置。
- 前記第1及び第2の半導体装置は、貫通電極を有することを特徴とする請求項1に記載の半導体装置。
- 前記第1及び第2の半導体装置は、夫々半導体チップであることを特徴とする請求項1又は2に記載の半導体装置。
- 前記第1及び第2の半導体装置は、夫々パッケージされた半導体であることを特徴とする請求項1又は2に記載の半導体装置。
- 前記第1又は第2の半導体装置の少なくともいずれか一方は、複数の機能を備えたシステムオンチップであることを特徴とする請求項1又は2に記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008014543A JP5638738B2 (ja) | 2008-01-25 | 2008-01-25 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008014543A JP5638738B2 (ja) | 2008-01-25 | 2008-01-25 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004306357A Division JP4299760B2 (ja) | 2004-10-21 | 2004-10-21 | 半導体装置のテスト方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008164623A JP2008164623A (ja) | 2008-07-17 |
JP5638738B2 true JP5638738B2 (ja) | 2014-12-10 |
Family
ID=39694282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008014543A Expired - Fee Related JP5638738B2 (ja) | 2008-01-25 | 2008-01-25 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5638738B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5370389B2 (ja) | 2011-02-14 | 2013-12-18 | 株式会社村田製作所 | 高周波モジュール |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09159728A (ja) * | 1995-12-08 | 1997-06-20 | Hitachi Ltd | プリント基板の試験方法 |
JPH1117057A (ja) * | 1997-06-26 | 1999-01-22 | Nec Corp | 検査パッド付きbga型半導体装置 |
JP3247321B2 (ja) * | 1997-09-16 | 2002-01-15 | 株式会社オートネットワーク技術研究所 | 電子ユニットの検査方法 |
-
2008
- 2008-01-25 JP JP2008014543A patent/JP5638738B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008164623A (ja) | 2008-07-17 |
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