JP3978188B2 - 光素子モジュールパッケージ及びその製造方法 - Google Patents
光素子モジュールパッケージ及びその製造方法 Download PDFInfo
- Publication number
- JP3978188B2 JP3978188B2 JP2004000003A JP2004000003A JP3978188B2 JP 3978188 B2 JP3978188 B2 JP 3978188B2 JP 2004000003 A JP2004000003 A JP 2004000003A JP 2004000003 A JP2004000003 A JP 2004000003A JP 3978188 B2 JP3978188 B2 JP 3978188B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lead
- leads
- optical element
- element module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0232—Lead-frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
Description
302 リード
303 レーザダイオード
304 フォトダイオード
305 サブマウント(SiOB)
306 シーリング剤
311 ヒートシンクブロック
313 貫通孔
351 回路パターン
Claims (3)
- 光信号を放出するレーザダイオードと、前記レーザダイオードから放出された光信号をモニタリングするためのフォトダイオードとを備えるTO-CAN構造の光素子モジュールパッケージにおいて、
長孔形状の第1貫通孔及び一対の第2貫通孔を備えるステムと、
ステムの一面に設けられ、第1貫通孔に近接し、第2貫通孔の間に突設されたヒートシンクブロックと、
前記第1貫通孔を貫通して一列に配設された、1つの高周波信号リードと一対のグランドリードとからなる高周波リードと、
前記第2貫通孔を貫通してそれぞれ配設された、直流バイアスリードとフォトダイオード用リードとからなる複数のリードと、を備え、
当該光素子モジュールパッケージを回路基板に組み立てたときに、第1貫通孔に配設された高周波リードは前記回路基板の上面に電気的に結合され、第2貫通孔に配設された複数のリードは前記回路基板の下面に電気的に結合されることを特徴とする光素子モジュールパッケージ。 - 第1貫通孔と第2貫通孔との間の距離は回路基板の厚さに応じて調整される請求項1記載の光素子モジュールパッケージ。
- 第1及び第2貫通孔は、それぞれガラス材質のシーリング剤で充填されて各リードを固定する請求項1記載の光素子モジュールパッケージ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0035965A KR100526504B1 (ko) | 2003-06-04 | 2003-06-04 | 광소자 모듈 패키지 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004363550A JP2004363550A (ja) | 2004-12-24 |
JP3978188B2 true JP3978188B2 (ja) | 2007-09-19 |
Family
ID=33487877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004000003A Expired - Fee Related JP3978188B2 (ja) | 2003-06-04 | 2004-01-05 | 光素子モジュールパッケージ及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7158550B2 (ja) |
JP (1) | JP3978188B2 (ja) |
KR (1) | KR100526504B1 (ja) |
CN (1) | CN100391065C (ja) |
Families Citing this family (35)
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US7218657B2 (en) * | 2003-07-09 | 2007-05-15 | Sumitomo Electric Industries, Ltd. | Optical transmitting module having a can type package and providing a temperature sensor therein |
JP2005303242A (ja) * | 2004-03-19 | 2005-10-27 | Hitachi Cable Ltd | 冷却機能付き電気−光変換モジュール |
KR100856280B1 (ko) * | 2004-05-25 | 2008-09-03 | 삼성전기주식회사 | 반도체 레이저 다이오드 패키지 |
US7295590B2 (en) * | 2004-11-15 | 2007-11-13 | Intel Corporation | Method for measuring VCSEL reverse bias leakage in an optical module |
JP4815814B2 (ja) * | 2005-02-04 | 2011-11-16 | 三菱電機株式会社 | 光モジュール |
TWM272296U (en) * | 2005-02-18 | 2005-08-01 | Yun-Shiuan Ye | Thin-type laser module |
KR100696192B1 (ko) * | 2005-11-24 | 2007-03-20 | 한국전자통신연구원 | 광송수신 모듈용 패키지 |
JP4970924B2 (ja) * | 2006-03-28 | 2012-07-11 | 三菱電機株式会社 | 光素子用パッケージとこれを用いた光半導体装置 |
US20070228385A1 (en) * | 2006-04-03 | 2007-10-04 | General Electric Company | Edge-emitting light emitting diodes and methods of making the same |
JP2009026835A (ja) * | 2007-07-18 | 2009-02-05 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザモジュール及びこれを備えた半導体レーザモジュール装置 |
US20130163917A1 (en) * | 2011-12-23 | 2013-06-27 | Finisar Corporation | Optical subassembly with an extended rf pin |
CN103368065B (zh) * | 2012-03-29 | 2015-08-19 | 山东华光光电子有限公司 | 一种固态激光器阵列的封装结构及其封装方法 |
US9054484B2 (en) * | 2012-04-04 | 2015-06-09 | Mitsubishi Electric Corporation | Packaged optical semiconductor device |
KR20140063323A (ko) * | 2012-11-16 | 2014-05-27 | 한국전자통신연구원 | 피드 스루 |
CN104049311A (zh) * | 2013-03-11 | 2014-09-17 | 鸿富锦精密工业(深圳)有限公司 | 光通讯模组组装装置 |
US8908728B1 (en) * | 2013-07-08 | 2014-12-09 | Schott Ag | Transistor outline package |
JP6678007B2 (ja) * | 2015-11-05 | 2020-04-08 | 新光電気工業株式会社 | 光素子用パッケージ及びその製造方法と光素子装置 |
EP3410471A4 (en) * | 2016-01-27 | 2019-09-25 | KYOCERA Corporation | WIRING SUBSTRATE, SECTION FOR OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR ELEMENT |
US10295768B2 (en) * | 2016-07-08 | 2019-05-21 | Finisar Corporation | Chip on leadframe optical subassembly |
IT201700009942A1 (it) * | 2017-01-30 | 2018-07-30 | Alberici S P A | Lampada led e metodo per realizzarla |
WO2019132075A1 (ko) * | 2017-12-28 | 2019-07-04 | 주식회사 옵텔라 | 광효율이 향상된 광학모듈 |
CN108172633A (zh) * | 2018-02-22 | 2018-06-15 | 河北中瓷电子科技有限公司 | 一种半导体器件的封装结构 |
CN108390255A (zh) * | 2018-02-22 | 2018-08-10 | 青岛海信宽带多媒体技术有限公司 | 光学次模块及光模块 |
JP6806835B2 (ja) * | 2018-04-28 | 2021-01-06 | エスゼット ディージェイアイ テクノロジー カンパニー リミテッドSz Dji Technology Co.,Ltd | 半導体装置 |
JP2021027136A (ja) * | 2019-08-02 | 2021-02-22 | CIG Photonics Japan株式会社 | 光モジュール |
CN110783810B (zh) * | 2019-10-23 | 2020-08-14 | 武汉东飞凌科技有限公司 | 同轴封装型边发射激光器的封帽同轴度定位方法 |
CN112993745B (zh) * | 2019-12-13 | 2022-06-10 | 潍坊华光光电子有限公司 | 一种提升to封装气密性的管脚结构及烧结方法 |
JP7350646B2 (ja) * | 2019-12-17 | 2023-09-26 | CIG Photonics Japan株式会社 | 光モジュール |
JP7331727B2 (ja) * | 2020-02-19 | 2023-08-23 | 住友電気工業株式会社 | 光半導体デバイス |
JPWO2021166215A1 (ja) * | 2020-02-21 | 2021-08-26 | ||
US11340412B2 (en) * | 2020-02-28 | 2022-05-24 | CIG Photonics Japan Limited | Optical module |
EP3965146A1 (en) * | 2020-09-03 | 2022-03-09 | Schott Ag | Header for an electronic component |
JP7437278B2 (ja) * | 2020-09-25 | 2024-02-22 | CIG Photonics Japan株式会社 | 光モジュール |
CN112234429B (zh) * | 2020-12-10 | 2021-07-09 | 武汉乾希科技有限公司 | 多通道激光发射器和光通信器件 |
KR102566981B1 (ko) | 2022-09-20 | 2023-08-16 | (주)전원테크 | 티오-캔 타입의 분포귀환형 레이저 다이오드의 온도유지장치 |
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-
2003
- 2003-06-04 KR KR10-2003-0035965A patent/KR100526504B1/ko not_active IP Right Cessation
- 2003-10-15 US US10/685,910 patent/US7158550B2/en not_active Expired - Fee Related
- 2003-11-11 CN CNB2003101036568A patent/CN100391065C/zh not_active Expired - Fee Related
-
2004
- 2004-01-05 JP JP2004000003A patent/JP3978188B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1573387A (zh) | 2005-02-02 |
JP2004363550A (ja) | 2004-12-24 |
US7158550B2 (en) | 2007-01-02 |
CN100391065C (zh) | 2008-05-28 |
KR100526504B1 (ko) | 2005-11-08 |
KR20040105271A (ko) | 2004-12-16 |
US20040247004A1 (en) | 2004-12-09 |
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