JP3425251B2 - Apparatus and method for cutting out inner layer circuit for electronic component package - Google Patents
Apparatus and method for cutting out inner layer circuit for electronic component packageInfo
- Publication number
- JP3425251B2 JP3425251B2 JP03130195A JP3130195A JP3425251B2 JP 3425251 B2 JP3425251 B2 JP 3425251B2 JP 03130195 A JP03130195 A JP 03130195A JP 3130195 A JP3130195 A JP 3130195A JP 3425251 B2 JP3425251 B2 JP 3425251B2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- layer circuit
- cutting blade
- electronic component
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【０００１】本発明は、半導体チップ等の電子部品を収
容する電子部品パッケージ用加工装置に関し、特に電子
部品パッケージ用内層回路削り出し装置及び内層回路削
り出し方法に関する。[0001] The present invention relates to an electronic unit Shinapa Kkeji for processing apparatus for housing electronic components such as semiconductor chips, in particular electronic
Apparatus and the inner layer circuit work cut out the inner layer circuit component package
Regarding how to get out .
【０００２】[0002]
【従来の技術】通常、キャビティ部を凹形状にした多層
の電子部品用パッケージは、内層端子部、ダイパット部
など所要の個所にあらかじめ窓を明けた後、接着剤やロ
ーフロープリプレグ等を用いて積層し、その後に表層に
所要の回路を形成する製法が採られている。これに比し
て、内層削り出し製法は、一般に、プリプレグと内層、
外層を一体積層した後に、削り出しによって内層の所要
回路を露出させるので、回路間の絶縁の信頼性が高く、
また密封性に優れた特徴により耐吸湿性や耐透湿性の信
頼性が向上する。2. Description of the Related Art Usually, a multilayer package for electronic parts having a concave cavity is formed by pre-opening windows at desired places such as inner layer terminals and die pads, and then using an adhesive or a low flow prepreg. A manufacturing method is adopted in which layers are laminated and then a required circuit is formed on the surface layer. On the other hand, the inner layer shaving method is generally used for prepreg and inner layer,
After laminating the outer layer integrally, the required circuit of the inner layer is exposed by shaving, so the reliability of insulation between circuits is high,
Further, due to the excellent sealing property, the reliability of moisture absorption resistance and moisture permeability resistance is improved.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記内
層削り出し製法においては、内層銅箔の高さ方向の位置
にバラツキがあるため、露出されるべき回路のある内層
銅箔の位置を、電気的接触または非接触方法によって検
出する必要があるが、電気的接触検出方法による場合
は、潤滑部材（エアーベアリング、ベアリング等）の電
気的不良導体を回避して切削回転軸に電気を導通させる
必要があるが、高周波スピンドル等の高速回転スピンド
ルに安定通電させることは極めて難しい。ベルト掛け等
の低速回転のスピンドルでは電気的接触をとることは可
能だが回転数が低く生産性が悪い。また、電気的非接触
検出方法による場合は、その検出方法が極めて特殊であ
るので高速検出ができず、電気的接触検出方法に比して
さらに生産性が劣りコストは高くなる。また、電気的接
触または非接触方法ともに、１点を測定し、切削刃と削
り出す内層銅箔面との距離を推定して制御するので、内
層銅箔のうねり、傾き等の積層状態によって、切削過多
または切削不足の部分を生じることがある。また、内層
銅箔に相応の厚みのあるものを用いて、ある程度銅箔を
削り込むようにすれば、切削過多または切削不足を防止
することは可能だが、銅箔を厚くした場合、エッチング
ファクターを考慮すると微細な回路を形成することが難
しくなる。本発明はこのような問題点を鑑みてなされ、
切削回転軸と非接触にて電気信号を検出し、回転軸の高
速回転を可能にして生産性を向上させ、コスト低減を可
能にすることを目的としている。また、削り出す内層銅
箔面上の複数点をあらかじめ測定し、測定各点の深さ方
向の位置関係を計算して仮想面を算定して、この仮想面
に沿って切削刃を制御することにより、内層削り出し製
法における内層銅箔の高さ方向のうねりによる切削過多
および切削不足を防止することを目的としている。However, in the above-mentioned inner layer shaving method, since the position of the inner layer copper foil in the height direction varies, the position of the inner layer copper foil having the circuit to be exposed is electrically changed. It is necessary to detect by the contact or non-contact method, but when using the electric contact detection method, it is necessary to avoid the electrically defective conductor of the lubricating member (air bearing, bearing, etc.) and conduct electricity to the cutting rotary shaft. However, it is extremely difficult to stably energize a high-speed rotating spindle such as a high-frequency spindle. It is possible to make electrical contact with a low-speed rotating spindle such as a belt, but the rotation speed is low and productivity is poor. Further, in the case of the electrical non-contact detection method, since the detection method is extremely special, high speed detection cannot be performed, and the productivity is further inferior and the cost is higher than the electrical contact detection method. In addition, both the electrical contact and non-contact methods measure one point and estimate and control the distance between the cutting blade and the inner layer copper foil surface to be cut. May cause over-cutting or under-cutting. In addition, it is possible to prevent overcutting or undercutting by cutting the copper foil to a certain extent by using an inner copper foil having a suitable thickness, but if the copper foil is thick, the etching factor is increased. Considering this, it becomes difficult to form a fine circuit. The present invention has been made in view of such problems,
The purpose is to detect electrical signals without contacting the cutting rotary shaft, enable high-speed rotation of the rotary shaft, improve productivity, and reduce costs. Also, measure multiple points on the inner layer copper foil surface to be machined beforehand, calculate the positional relationship of each measurement point in the depth direction to calculate a virtual surface, and control the cutting blade along this virtual surface. Therefore, it is intended to prevent excessive cutting and insufficient cutting due to waviness in the height direction of the inner layer copper foil in the inner layer cutting method.
【０００４】[0004]
【課題を解決するための手段】上記の目的を達成するた
め、本発明は次の構成を備える。すなわち、内層と外層
を一体積層した後、高周波スピンドルを用いた削り出し
方法により内層の回路を露出させ、電子部品を収容する
キャビティ部を凹形状に形成して製造する電子部品パッ
ケージ用内層回路削り出し装置において、前記高周波ス
ピンドルに軸線方向に往復移動可能に回転軸を設けると
ともに、該回転軸の先端にザグリ加工用の切削刃を固定
し、前記切削刃が内層回路に接触した瞬間に励起される
高周波微少電流を電気信号として検出するリングセンサ
ーを、前記回転軸に非接触に設け、回転軸をＺ軸方向に
移動させた際に前記切削刃が内層回路に接触した時点の
信号が前記リングセンサーにより検知されて入力され、
前記内層回路を削り出す際に、内層回路の銅箔面上の３
点以上の複数点について、前記切削刃が内層回路に接触
した時点を前記リングセンサーにより検知して、測定各
点の深さ方向の位置関係を計算して内層回路の仮想面を
算定し、次いで、前記仮想面に沿って前記切削刃を制御
して内層回路を削り出す数値演算装置を設けたことを特
徴とする。また、前記電子部品用パッケージの内層回路
削り出し装置を使用し、内層と外層を一体積層した後、
切削刃によりザグリ加工して内層回路を露出させ、電子
部品を収容するキャビティ部を凹形状に形成して製造す
る電子部品パッケージ用内層回路削り出し方法におい
て、前記切削刃により内層回路を削り出す際に、内層回
路の銅箔面上の３点以上の複数点について、前記回転軸
をＺ軸方向に移動させた際に前記切削刃が内層回路に接
触した時点を前記リングセンサーにより検知し、数値演
算装置により測定各点の深さ方向の位置関係を計算して
内層回路の仮想面を算定し、次いで、前記仮想面に沿っ
て前記切削刃を制御して内層回路を削り出すことを特徴
とする。In order to achieve the above object, the present invention has the following constitution. That is, after the inner layer and the outer layer are integrally laminated, the circuit of the inner layer is exposed by a shaving method using a high frequency spindle, and the cavity part for housing the electronic component is formed in a concave shape to manufacture the inner layer circuit for the electronic component package. In the feeding device, a rotary shaft is provided on the high-frequency spindle so as to be capable of reciprocating in the axial direction, a cutting blade for counterboring is fixed to the tip of the rotary shaft, and the cutting blade is excited at the moment of contact with the inner layer circuit. A ring sensor that detects a high-frequency minute electric current as an electric signal is provided on the rotating shaft in a non-contact manner, and the rotating shaft is arranged in the Z-axis direction.
A signal at the time when the cutting blade contacts the inner layer circuit when moved is input by being detected by the ring sensor ,
When shaving the inner layer circuit, 3 on the copper foil surface of the inner layer circuit
For a plurality of points or more, the time when the cutting blade contacts the inner layer circuit is detected by the ring sensor, and the positional relationship in the depth direction of each measurement point is calculated to calculate the virtual surface of the inner layer circuit, and then A numerical operation device is provided which controls the cutting blade along the virtual surface to cut out the inner layer circuit. Further, after using the inner layer circuit shaving device for the electronic component package, after integrally laminating the inner layer and the outer layer,
An inner layer circuit shaving method for an electronic component package, which is produced by forming a cavity for accommodating an electronic component into a concave shape by exposing the inner layer circuit with a cutting blade to expose the inner layer circuit. The rotary shaft for a plurality of points on the copper foil surface of the inner layer circuit.
When the cutting blade comes into contact with the inner layer circuit when moving in the Z-axis direction, it is detected by the ring sensor, and the numerical calculation device calculates the positional relationship in the depth direction of each measurement point to calculate the virtual of the inner layer circuit. A surface is calculated, and then the cutting blade is controlled along the virtual surface to cut out an inner layer circuit.
【０００５】[0005]
【作用】本発明によれば、切削回転軸と非接触にて電気
信号を検出するので、潤滑部材等の電気的不良導体を考
慮する必要がなく、また、電気的導通のための接点を必
要としないので、回転軸を高速に回転させることによ
り、生産性を向上させてコストを低減することができ
る。また、複数の測定点に基づいて計算により仮想面を
算定し、この仮想面に沿って切削刃を制御することによ
り、内層削り出し製法における切削過多および切削不足
を防止して、その歩留まりを改善することが可能とな
る。According to the present invention, since an electric signal is detected in a non-contact manner with the cutting rotary shaft, it is not necessary to consider an electrically defective conductor such as a lubricating member, and a contact for electrical conduction is required. Therefore, by rotating the rotary shaft at a high speed, it is possible to improve productivity and reduce cost. In addition, by calculating a virtual surface based on multiple measurement points and controlling the cutting edge along this virtual surface, it is possible to prevent excessive cutting and insufficient cutting in the inner layer cutting manufacturing method, and improve the yield. It becomes possible to do.
【０００６】[0006]
【実施例】以下、本発明に係る実施例について添付図面
とともに説明する。図１は、本発明に好適な内層削り出
し装置の全体構成を示している。この装置は一般的に知
られているＮＣルーターマシンから構成されており、図
では本発明に関係のある主要部分の構成のみを示してい
る。図において、２０は回転軸であり、その先端にチャ
ックを介して、超硬または焼結ダイヤモンド等の切削刃
３０が固着されている。回転軸２０はその軸線方向、す
なわちＺ軸方向に往復運動されて、回転する切削刃によ
ってサグリ加工が行われる。回転軸２０の上部には、非
接触にて電気信号を検出するリングセンサー１０が設置
されている。このリングセンサー１０は高周波微少電流
を励起し、装置自体を導電体として、切削刃３０が被切
削面５０に接触した瞬間に電気信号が出力されて、数値
演算装置４０に伝播される。数値演算装置４０では、伝
播された電気信号によってプログラムコントロールし、
回転軸のＺ軸方向を制御する。なお、被切削面５０は導
電性を有している必要がある。図２は、被切削面５０の
上面方向から見た複数の測定点を示している。図では便
宜的に９点の測定点としている。測定点Ｐ１、測定点Ｐ
２および測定点Ｐ３は三角形面１３０を結ぶ。この三角
形面１３０は、各測定点の高さに対応した傾斜を有して
いる（図３）。同様にして三角形面を次々に結ぶと、被
切削面５０は８面の三角形面が連続した仮想面とするこ
とができる（図４）。この仮想面に沿って切削刃を制御
することにより、被切削面５０の実体に対して高精度の
ザグリ加工が可能である。測定点の数を多くすればその
精度をさらに向上するので望ましい。また、高精度かつ
高速の測定装置と高速の数値演算装置を用いればさらに
効果的である。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows the overall configuration of an inner layer shaving apparatus suitable for the present invention. This device is composed of a generally known NC router machine, and in the figure, only the structure of the main part relevant to the present invention is shown. In the figure, reference numeral 20 is a rotary shaft, and a cutting blade 30 of cemented carbide or sintered diamond or the like is fixed to the tip of the rotary shaft via a chuck. The rotary shaft 20 is reciprocated in the axial direction, that is, the Z-axis direction, and the rotary cutting blade performs sag processing. A ring sensor 10 that detects an electric signal in a non-contact manner is installed above the rotating shaft 20. The ring sensor 10 excites a high-frequency minute current, and an electric signal is output at the moment when the cutting blade 30 contacts the surface to be cut 50 by using the device itself as a conductor, and is transmitted to the numerical calculation device 40. In the numerical operation device 40, program control is performed by the propagated electric signal,
Controls the Z-axis direction of the rotation axis. The surface to be cut 50 needs to have conductivity. FIG. 2 shows a plurality of measurement points viewed from the top surface direction of the surface to be cut 50. In the figure, 9 measurement points are used for convenience. Measurement point P1, measurement point P
2 and the measurement point P3 connect the triangular surface 130. The triangular surface 130 has an inclination corresponding to the height of each measurement point (FIG. 3). Similarly, if the triangular surfaces are connected one after another, the cut surface 50 can be a virtual surface in which eight triangular surfaces are continuous (FIG. 4). By controlling the cutting blade along this virtual surface, it is possible to perform highly accurate counterboring on the substance of the surface to be cut 50. It is desirable to increase the number of measurement points because the accuracy is further improved. Further, it is more effective to use a highly accurate and high speed measuring device and a high speed numerical operation device.
【０００７】[0007]
【発明の効果】本発明によれば、切削回転軸と非接触に
て切削刃が内層の回路に接触した時点の電気信号を検出
するので、高周波スピンドルにおけるエアーベアリン
グ、ベアリング等の潤滑部材の電気的不良導体を考慮す
る必要がなく、また、電気的導通のための接点を必要と
しないので、通常の高速高周波スピンドルを用いて回転
軸を高速に回転させることにより、生産性を向上させて
コストを低減することができる。また、複数の測定点に
基づいて計算により仮想面を算定するので、この仮想面
は内層銅箔面の実体を高精度で表現しており、この仮想
面に沿って切削刃を制御するので、内層削り出し製法に
おける内層銅箔の高さ方向のうねりによる切削過多およ
び切削不足を防止することができる。その結果、歩留ま
りを改善し、コストを低減することができる。According to the present invention, the electric signal at the time when the cutting blade comes into contact with the inner layer circuit is detected without contacting the cutting rotary shaft, so that the air bearing in the high frequency spindle is detected.
Grayed lubricating member is not necessary to consider the electrical poor conductor of such a bearing, also, does not require a contact for electrical conduction, rotating the rotating shaft at high speed using a conventional high-speed high-frequency spindle By doing so, productivity can be improved and cost can be reduced. Also, since the virtual surface is calculated by calculation based on a plurality of measurement points, this virtual surface represents the substance of the inner layer copper foil surface with high accuracy, and the cutting blade is controlled along this virtual surface, cutting excess and cutting shortage due height direction of the undulation of the inner layer copper foil in inner layer shaving process can proof abolish Rukoto. As a result , yield can be improved and cost can be reduced.
【図１】内層削り出し装置の主要部分の構成図。FIG. 1 is a configuration diagram of a main part of an inner layer shaving device.
【図２】被切削面の複数の測定点の図。FIG. 2 is a diagram of a plurality of measurement points on a surface to be cut.
【図３】測定各点が結ぶ三角形面の図。FIG. 3 is a diagram of a triangular surface connecting measurement points.
【図４】三角形面が連続した仮想面の図。FIG. 4 is a diagram of a virtual surface in which triangular surfaces are continuous.
１０ リングセンサー ２０ 回転軸 ３０ 切削刃 ４０ 数値演算装置 ５０ 被切削面 ６０ ワーク ７０ 測定点Ｐ１ ８０ 測定点Ｐ２ ９０ 測定点Ｐ３ １００ 測定点Ｐ１の高さ １１０ 測定点Ｐ２の高さ １２０ 測定点Ｐ３の高さ １３０ 測定各点が結ぶ三角形面 10 ring sensor 20 rotation axis 30 cutting blades 40 Numerical operation device 50 Surface to be cut 60 work 70 Measurement point P1 80 measuring points P2 90 Measurement point P3 100 Height of measurement point P1 110 Height of measurement point P2 120 Height of measurement point P3 130 Triangular surface connecting measurement points
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B23C 3/00 H01L 23/12 H05K 3/00 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) B23C 3/00 H01L 23/12 H05K 3/00
Claims (2)
ピンドルを用いた削り出し方法により内層の回路を露出
させ、電子部品を収容するキャビティ部を凹形状に形成
して製造する電子部品パッケージ用内層回路削り出し装
置において、 前記高周波スピンドルに軸線方向に往復移動可能に回転
軸を設けるとともに、該回転軸の先端にザグリ加工用の
切削刃を固定し、 前記切削刃が内層回路に接触した瞬間に励起される高周
波微少電流を電気信号として検出するリングセンサー
を、前記回転軸に非接触に設け、回転軸をＺ軸方向に移動させた際に 前記切削刃が内層回
路に接触した時点の信号が前記リングセンサーにより検
知されて入力され、前記内層回路を削り出す際に、内層
回路の銅箔面上の３点以上の複数点について、前記切削
刃が内層回路に接触した時点を前記リングセンサーによ
り検知して、測定各点の深さ方向の位置関係を計算して
内層回路の仮想面を算定し、次いで、前記仮想面に沿っ
て前記切削刃を制御して内層回路を削り出す数値演算装
置を設けたことを特徴とする電子部品パッケージ用内層
回路削り出し装置。1. An electronic component package manufactured by integrally laminating an inner layer and an outer layer, exposing a circuit of the inner layer by a shaving method using a high frequency spindle, and forming a cavity portion for accommodating an electronic component into a concave shape. In the inner layer circuit shaving device, a rotary shaft is provided on the high frequency spindle so as to be capable of reciprocating in the axial direction, and a cutting blade for counterboring is fixed to the tip of the rotary shaft, and the moment the cutting blade contacts the inner layer circuit. A ring sensor that detects a high-frequency minute current excited as an electric signal is provided on the rotating shaft in a non-contact manner, and a signal when the cutting blade contacts the inner layer circuit when the rotating shaft is moved in the Z-axis direction. There are input is tested <br/> known by the ring sensor, said when cut out the inner layer circuit, the plurality of points of three or more points on the copper foil surface of the inner layer circuit, the inner said cutting blade The time when the circuit is contacted is detected by the ring sensor, the positional relationship in the depth direction of each measurement point is calculated to calculate the virtual surface of the inner layer circuit, and then the cutting blade is controlled along the virtual surface. An inner layer circuit shaving device for electronic component packages, which is provided with a numerical operation device for shaving the inner layer circuit.
内層回路削り出し装置を使用し、内層と外層を一体積層
した後、切削刃によりザグリ加工して内層回路を露出さ
せ、電子部品を収容するキャビティ部を凹形状に形成し
て製造する電子部品パッケージ用内層回路削り出し方法
において、 前記切削刃により内層回路を削り出す際に、内層回路の
銅箔面上の３点以上の複数点について、前記回転軸をＺ
軸方向に移動させた際に前記切削刃が内層回路に接触し
た時点を前記リングセンサーにより検知し、数値演算装
置により測定各点の深さ方向の位置関係を計算して内層
回路の仮想面を算定し、 次いで、前記仮想面に沿って前記切削刃を制御して内層
回路を削り出すことを特徴とする電子部品パッケージ用
内層回路削り出し方法。2. The inner layer circuit shaving device for an electronic component package according to claim 1, wherein the inner layer and the outer layer are integrally laminated, and then the inner layer circuit is exposed by performing a counterboring process with a cutting blade to accommodate the electronic component. In a method of carving out an inner layer circuit for an electronic component package, which is manufactured by forming a cavity portion having a concave shape, when carving out the inner layer circuit with the cutting blade, a plurality of points of three or more points on the copper foil surface of the inner layer circuit , The rotation axis is Z
The time when the cutting blade contacts the inner layer circuit when moved in the axial direction is detected by the ring sensor, and the virtual surface of the inner layer circuit is calculated by calculating the positional relationship in the depth direction of each measurement point by the numerical calculation device. A method of carving out an inner layer circuit for an electronic component package, which comprises calculating and then carving out an inner layer circuit by controlling the cutting blade along the virtual surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03130195A JP3425251B2 (en) | 1995-01-10 | 1995-01-10 | Apparatus and method for cutting out inner layer circuit for electronic component package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03130195A JP3425251B2 (en) | 1995-01-10 | 1995-01-10 | Apparatus and method for cutting out inner layer circuit for electronic component package |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002372462A Division JP2003179180A (en) | 2002-12-24 | 2002-12-24 | Device and method for carving inner layer circuit for electronic component package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08192309A JPH08192309A (en) | 1996-07-30 |
| JP3425251B2 true JP3425251B2 (en) | 2003-07-14 |
Family
ID=12327472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03130195A Expired - Lifetime JP3425251B2 (en) | 1995-01-10 | 1995-01-10 | Apparatus and method for cutting out inner layer circuit for electronic component package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3425251B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008229789A (en) * | 2007-03-22 | 2008-10-02 | Nec Corp | Recessed part forming method and device, and material for forming recessed part |
| JP5916486B2 (en) * | 2012-04-05 | 2016-05-11 | トーヨーエイテック株式会社 | Work position measuring method and position measuring apparatus |
-
1995
- 1995-01-10 JP JP03130195A patent/JP3425251B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08192309A (en) | 1996-07-30 |
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