JP2003115559A - Printed wiring board and manufacturing method thereof - Google Patents
Printed wiring board and manufacturing method thereofInfo
- Publication number
- JP2003115559A JP2003115559A JP2001343886A JP2001343886A JP2003115559A JP 2003115559 A JP2003115559 A JP 2003115559A JP 2001343886 A JP2001343886 A JP 2001343886A JP 2001343886 A JP2001343886 A JP 2001343886A JP 2003115559 A JP2003115559 A JP 2003115559A
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- point
- height
- end point
- layer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、内層削り出し加工によ
り内層の任意の各層間に段差形状を形成したプリント配
線基板及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board in which a step shape is formed between arbitrary layers of an inner layer by carving out the inner layer and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】キャビティ部を凹形状にした多層の電子
部品用パッケージ等のように、内層の任意の各層間に段
差形状を有するプリント配線基板は、通常、端子部等の
内層回路、ダイパット部など所要の個所にあらかじめ窓
を明けた後、接着剤やローフロープリプレグ等を用いて
積層し、その後に表層に所要の回路を形成する製法が採
られている。これに比して、内層削り出し加工方法は、
一般に、プリプレグ、内層及び外層を一体積層した後
に、内層削り出し加工によって内層の所要回路を露出さ
せるので、プリプレグの滲み出しがなく、回路間の絶縁
の信頼性が高く、また密封性に優れた特徴により耐吸湿
性や耐透湿性の信頼性が向上する。このときの内層削り
出し加工方法は、削り出す内層回路面の１点を検出して
内層回路の高さ位置を測定し、この高さを基に切削刃を
制御することによって内層の所要回路を露出させる方法
が一般的である。2. Description of the Related Art A printed wiring board having a step shape between arbitrary layers of an inner layer such as a multi-layer electronic component package having a concave cavity is usually used for an inner layer circuit such as a terminal section and a die pad section. For example, after a window is opened in a required place in advance, it is laminated with an adhesive or low-flow prepreg, and then a required circuit is formed on a surface layer. In comparison, the inner layer shaving method is
Generally, after the prepreg, the inner layer and the outer layer are integrally laminated, the inner layer is carved out to expose the required circuit in the inner layer, so that the prepreg does not seep out, the insulation between the circuits is highly reliable, and the sealing property is excellent. Depending on the characteristics, the reliability of moisture absorption resistance and moisture permeability resistance is improved. The inner layer cutting method at this time is to detect one point on the inner layer circuit surface to be cut out, measure the height position of the inner layer circuit, and control the cutting blade based on this height to determine the required inner layer circuit. The method of exposing is common.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記の
内層削り出し加工方法においては、内層回路面の高さ方
向の位置にバラツキがあるため、露出されるべき内層回
路面の位置を電気的接触または非接触方法によって検出
する必要があるが、電気的接触または非接触方法ともに
１点を測定し、切削刃と削り出す内層回路面との距離を
推定して制御するのでは、内層回路の傾き等の積層状態
によって、切削過多または切削不足の部分を生じること
がある。また、内層銅箔に相応の厚みのあるものを用い
て、ある程度銅箔を削り込むようにすれば、切削過多ま
たは切削不足を防止することは可能であるが、銅箔を厚
くした場合、エッチングファクターを考慮すると微細な
回路を形成することが難しくなる。このように、従来の
内層削り出し加工方法では、今後の市場ニーズ動向であ
る、微細回路が必要な小型電子部品用の高機能プリント
配線基板の需要を満足することができない。本発明はこ
のような問題点を鑑みてなされ、削り出す内層回路各面
の各辺の始点と終点の高さの位置をあらかじめ測定し
て、始点及び終点の高さの差の比例配分計算値によって
切削刃の高さを制御することにより、また、前期削り出
す内層回路各面の各辺の削り出し加工始点及び終点の間
の１点以上の複数点の高さ位置をあらかじめ測定して、
始点から終点に至り隣接する各点の高さの差の比例配分
計算値によって、連続して切削刃の高さを制御すること
により、内層削り出し加工方法における内層回路面の高
さ方向の傾き等に起因する切削過多及び切削不足を防止
する。その結果、内層削り出し加工の歩留まりを改善
し、内層の任意の各層間に段差形状を形成したプリント
配線基板の生産性を向上させてコストを低減することを
目的としている。However, in the above-described inner layer shaving method, since the position of the inner layer circuit surface in the height direction varies, the position of the inner layer circuit surface to be exposed may be electrically contacted or contacted. It is necessary to detect by the non-contact method, but if one point is measured by both the electrical contact method and the non-contact method and the distance between the cutting blade and the inner layer circuit surface to be cut is estimated and controlled, the inclination of the inner layer circuit, etc. Depending on the layered state of, the excessive cutting or undercutting may occur. In addition, it is possible to prevent over-cutting or under-cutting by using a copper foil with a suitable thickness for the inner layer copper and cutting the copper foil to some extent, but when thickening the copper foil, etching Considering the factor, it becomes difficult to form a fine circuit. As described above, the conventional inner layer shaving method cannot satisfy the demand for high-performance printed wiring boards for small electronic components that require fine circuits, which is a trend of market needs in the future. The present invention has been made in view of such a problem, and the position of the height of the starting point and the ending point of each side of each surface of the inner layer circuit to be cut is measured in advance, and the proportional distribution calculation value of the difference in height between the starting point and the ending point is calculated. By controlling the height of the cutting edge by, the height position of one or more points between the start point and the end point of the carving process on each side of each surface of the inner layer circuit to be carved in the previous period is measured in advance,
Inclination in the height direction of the inner layer circuit surface in the inner layer carving method by continuously controlling the height of the cutting edge by the proportional distribution calculation value of the height difference between the adjacent points from the start point to the end point Prevents excessive cutting and insufficient cutting due to factors such as As a result, it is an object to improve the yield of the inner layer shaving process, improve the productivity of the printed wiring board in which the step shape is formed between arbitrary layers of the inner layer, and reduce the cost.
【０００４】[0004]
【課題を解決するための手段】上記の目的を達成するた
め、本発明は次の構成を備える。すなわち、削り出す内
層回路各面の各辺の始点と終点の高さの位置をあらかじ
め測定し、始点及び終点の高さの差の比例配分計算値に
よって切削刃の高さを制御することを特徴とする。ま
た、前期削り出す内層回路各面の各辺の削り出し加工始
点及び終点の間の１点以上の複数点の高さ位置をあらか
じめ測定して、始点から終点に至り隣接する各点の高さ
の差の比例配分計算値によって、連続して切削刃の高さ
を制御することを特徴とする。In order to achieve the above object, the present invention has the following constitution. That is, the height position of the starting point and the end point of each side of each surface of the inner layer circuit to be cut out is measured in advance, and the height of the cutting blade is controlled by the proportional distribution calculation value of the difference in height between the starting point and the end point. And Also, the height positions of one or more points between the start point and the end point of each side of each surface of the inner layer circuit to be cut out in the previous period are measured in advance, and the height of each adjacent point from the start point to the end point is measured. It is characterized in that the height of the cutting edge is continuously controlled by the proportional distribution calculated value of the difference.
【０００５】[0005]
【作用】本発明によれば、削り出す内層回路各面の各辺
の始点と終点の高さの位置をあらかじめ測定し、始点及
び終点の高さの差の比例配分計算値によって切削刃の高
さを制御することにより、また、前期削り出す内層回路
各面の各辺の削り出し加工始点及び終点の間の１点以上
の複数点の高さ位置をあらかじめ測定して、始点から終
点に至り隣接する各点の高さの差の比例配分計算値によ
って、連続して切削刃の高さを制御することにより、内
層回路削り出し加工方法における内層回路面の高さ方向
の傾き等に起因する切削過多及び切削不足を防止する。
その結果、内層削り出し加工の歩留まりを改善し、内層
の任意の各層間に段差形状を形成したプリント配線基板
の生産性を向上させてコストを低減することができる。According to the present invention, the positions of the heights of the starting point and the end point of each side of each surface of the inner layer circuit to be cut out are measured in advance, and the height of the cutting edge is calculated by the proportional distribution calculation value of the difference between the heights of the starting point and the end point. By controlling the height, the height position of one or more points between the start point and the end point of the shaving process on each side of each surface of the inner layer circuit to be cut in the previous period is measured in advance, and the height from the start point to the end point is reached. By controlling the height of the cutting edge continuously by the proportional distribution calculation value of the height difference between adjacent points, it is caused by the inclination in the height direction of the inner layer circuit surface in the inner layer circuit shaving method. Prevents overcutting and undercutting.
As a result, it is possible to improve the yield of the inner layer shaving process, improve the productivity of the printed wiring board in which a step shape is formed between arbitrary layers of the inner layer, and reduce the cost.
【０００６】[0006]
【実施例】以下、本発明に係る実施例について添付図面
とともに説明する。尚、図は状態を示す主要な一部分で
ある。また、図では内層回路を明記しているが、実際に
は内層削り出し加工前は、内層回路は見えない状態であ
る。図１は、削り出す内層回路面１０の上面方向から見
た図である。始点２０と終点３０は削り出し加工の始点
と終点であり、測定点であることを意味する。始点２０
と終点３０の距離は、プリント配線基板に収容する電子
部品の寸法に依存するが、２〜４０ｍｍ程度である。こ
のとき、削り出す内層回路が微細かつ短くて測定点を設
けることが困難な場合には、該内層回路の前記始点２０
及び前記終点３０の直近に各々の測定点を設ければよ
い。Embodiments of the present invention will be described below with reference to the accompanying drawings. The figure is a main part showing the state. Further, although the inner layer circuit is clearly shown in the figure, the inner layer circuit is actually invisible before the inner layer shaving process. FIG. 1 is a view seen from the upper surface direction of the inner layer circuit surface 10 to be cut out. The start point 20 and the end point 30 are the start point and the end point of the carving process, which means that they are measurement points. Starting point 20
The distance between the end point 30 and the end point 30 depends on the size of the electronic component housed in the printed wiring board, but is about 2 to 40 mm. At this time, when the inner layer circuit to be cut out is minute and short and it is difficult to provide a measurement point, the starting point 20 of the inner layer circuit is cut.
Also, each measurement point may be provided in the immediate vicinity of the end point 30.
【０００７】図２は、本発明に係る比例配分計算の説明
図である。前記始点２０と前記終点３０及び加工基準平
面４０を仮想線で結線した状態を断面方向から示してい
る。前記始点２０と前記終点３０の高さの差は、検出し
た結果０〜２０μｍである。前記始点２０と終点３０の
高さの差は、前記加工基準面４０に投影された前記始点
２０と前記終点３０の距離で比例配分して計算すること
ができる。切削刃５０が加工面の前記始点２０から前記
終点３０まて移動して加工するときに、該切削刃５０の
移動に伴って前記比例配分した計算値によって、前記切
削刃５０の高さ制御して内層削り出し加工を行うことが
できる。前記切削刃５０の高さ方向の制御は０．１μｍ
単位で行うことができる。FIG. 2 is an explanatory diagram of the proportional distribution calculation according to the present invention. The state in which the starting point 20, the ending point 30, and the processing reference plane 40 are connected by an imaginary line is shown from the cross-sectional direction. The difference in height between the start point 20 and the end point 30 is 0 to 20 μm as a result of detection. The height difference between the start point 20 and the end point 30 can be calculated by proportionally distributing the distance between the start point 20 and the end point 30 projected on the processing reference plane 40. When the cutting blade 50 moves from the start point 20 to the end point 30 of the processing surface for processing, the height of the cutting blade 50 is controlled by the proportionally calculated value according to the movement of the cutting blade 50. The inner layer can be carved out. The control of the cutting blade 50 in the height direction is 0.1 μm
It can be done in units.
【０００８】図３は、前記始点２０と前記終点３０の間
に、測定点である中点２５を設けた状態を示している。
前記始点２０と前記中点２５及び前記終点３０の高さを
検出して、前記始点２０と前記中点２５の高さの差を、
前記加工基準面４０に投影される前記始点２０と前記中
点２５の距離で比例配分計算する。また、前記中点２５
と前記終点３０の高さの差を、前記加工基準面４０に投
影される前記中点２５と前記終点３０の距離で比例配分
する。前記切削刃５０が加工面の前記始点２０から前記
中点２５まて移動して加工するときの高さは、前記始点
２０と前記中点２５の高さの差の比例配分計算値によっ
て制御し、また前記中点２５から前記終点３０まて移動
して加工するときの高さは、前記中点２５と前記終点３
０の高さの差の比例配分計算値によって制御して内層削
り出し加工を行う。このとき、内層回路面の測定点Ａ乃
至測定点Ｄは下方に位置するダイ領域１６０を削り出し
加工するときに切削削除されるので、測定点Ａ乃至測定
点Ｄが電子部品用パッケージの機能に影響することはな
い。前記中点２５を設けることは、加工距離が長い場
合、あるいは内層回路面の傾き等の積層状態が悪い場合
に有効である。また、中点のみではなく、加工面の始点
から終点の間に６〜１６点等の複数の測定点を設けて各
々の高さを検出し、隣接する各測定点の高さの差の比例
配分計算値によって制御すれば、さらに内層削り出し加
工の精度を向上することも可能である。FIG. 3 shows a state in which a midpoint 25 as a measuring point is provided between the starting point 20 and the ending point 30.
The heights of the start point 20, the midpoint 25, and the end point 30 are detected, and the difference in height between the start point 20 and the midpoint 25 is calculated as
Proportional distribution is calculated by the distance between the starting point 20 and the midpoint 25 projected on the processing reference plane 40. Also, the midpoint 25
And the height difference between the end point 30 and the height difference between the midpoint 25 and the end point 30 projected on the processing reference plane 40 are proportionally distributed. The height when the cutting blade 50 moves from the starting point 20 of the processing surface to the midpoint 25 for processing is controlled by a proportional distribution calculation value of the difference in height between the starting point 20 and the midpoint 25. The height when moving from the midpoint 25 to the end point 30 for machining is the midpoint 25 and the end point 3
The inner layer shaving is performed by controlling the proportional distribution calculated value of the height difference of 0. At this time, since the measurement points A to D on the inner layer circuit surface are cut and removed when the die region 160 located below is cut and machined, the measurement points A to D have the function of the electronic component package. It has no effect. Providing the middle point 25 is effective when the processing distance is long or when the laminated state such as the inclination of the inner layer circuit surface is bad. Moreover, not only the midpoint but also multiple measurement points such as 6 to 16 points are provided between the start point and the end point of the machined surface to detect the height of each, and the proportional difference in height between adjacent measurement points. It is possible to further improve the precision of the inner layer shaving by controlling the distribution calculation value.
【０００９】図４は、一般的な電子部品用パッケージで
ある加工対象の内層回路が矩形形状の４辺方向に有する
ものに本発明を適用した例を示す図である。まず、測定
点Ａ乃至測定点Ｄの４点の高さを検出する。前記測定点
Ａを始点とし前記測定点Ｂを終点とする加工面を削り出
し加工する場合は、前記測定点Ａと前記測定点Ｂの高さ
の差を比例配分計算し、その計算値によって切削刃の高
さを制御して削り出し加工する。同様にして、前記測定
点Ｂを始点とし測定点Ｃを終点とする加工面、前記測定
点Ｃを始点とし測定点Ｄを終点とする加工面及び前記測
定点Ｄを始点とし前記測定点Ａを終点とする加工面の順
に、各々の加工面について、各々の始点と終点の高さの
差を比例配分計算し、各々の計算値によって、各々の加
工面を加工するときの切削刃の高さを制御して削り出し
加工を行う。このとき、図３に示したように、各々の始
点と終点の間に中点を設ける方法、あるいは、各々の始
点と終点の間に複数の測定点を設ける方法を適用するこ
とも可能であり、この場合はより高精度の削り出し加工
を可能にするので有効である。FIG. 4 is a diagram showing an example in which the present invention is applied to an inner layer circuit to be processed, which is a general electronic component package, having four sides in a rectangular shape. First, the heights of four measurement points A to D are detected. When machining a machined surface having the measurement point A as the start point and the measurement point B as the end point, the difference in height between the measurement point A and the measurement point B is proportionally calculated, and cutting is performed according to the calculated value. Controls the height of the blade to cut out. Similarly, a machined surface having the measurement point B as the starting point and the measurement point C as the end point, a machining surface having the measurement point C as the starting point and the measurement point D as the end point, and the measurement point A as the starting point and the measurement point A as the starting point. The difference in height between the start point and the end point is proportionally calculated for each machined surface in the order of the machined surface as the end point, and the height of the cutting edge when machining each machined surface is calculated according to each calculated value. Is controlled to perform shaving. At this time, as shown in FIG. 3, it is also possible to apply a method of providing a middle point between each start point and an end point, or a method of providing a plurality of measurement points between each start point and an end point. In this case, it is effective because it enables more accurate carving.
【００１０】図５は、図４に示した一般的な電子部品用
パッケージの他の例であり、層が異なる内層回路を削り
出して多段構造を形成した例を示す図である。この場合
は、各層の内層回路に対して前記図４に示す方法により
切削刃の高さを制御して削り出し加工を行うことができ
る。すなわち、まず、図５（ａ）に素召すように、上方
に位置する内層回路面の測定点Ａ乃至測定点Ｄの４点の
高さを検出する。前記測定点Ａを始点とし前記測定点Ｂ
を終点とする加工面を削り出し加工する場合は、前記測
定点Ａと前記測定点Ｂの高さの差を比例配分計算し、そ
の計算値によって切削刃の高さを制御して削り出し加工
する。同様にして、前記測定点Ｂを始点とし測定点Ｃを
終点とする加工面、前記測定点Ｃを始点とし測定点Ｄを
終点とする加工面及び前記測定点Ｄを始点とし前記測定
点Ａを終点とする加工面の順に、各々の測定点の高さの
差を比例配分計算し、その計算値によって切削刃の高さ
を制御して削り出し加工を行う。次に、図５（ｂ）に示
すように、下方に位置する内層回路面の測定点Ａ１乃至
測定点Ｄ１の４点の高さを検出する。前記測定点Ａ１を
始点とし前記測定点Ｂ１を終点とする加工面を削り出し
加工する場合は、前記測定点Ａ１と前記測定点Ｂ１の高
さの差を比例配分計算し、その計算値によって切削刃の
高さを制御して削り出し加工する。同様にして前記測定
点Ｂ１を始点とし測定点Ｃ１を終点とする加工面、前記
測定点Ｃ１を始点とし測定点Ｄ１を終点とする加工面及
び前記測定点Ｄ１を始点とし前記測定点Ａ１を終点とす
る加工面の順に、各々の測定点の高さの差を比例配分計
算し、その計算値によって切削刃の高さを制御して削り
出し加工を行う。このとき、上方に位置する内層回路面
の測定点Ａ乃至測定点Ｄは、下方に位置する内層回路面
を削り出し加工するときに切削削除されるので、その痕
跡が残ることがない。図６は、最下方に位置するダイ領
域１６０を削り出し加工して、段差形状が完成した状態
を示す。このとき、下方に位置する内層回路面の測定点
Ａ１乃至測定点Ｄ１は、前期ダイ領域１６０を削り出し
加工するときに切削削除されるので、その痕跡が残るこ
とはない。したがって、測定点Ａ乃至測定点Ｄ及び測定
点Ａ１乃至測定点Ｄ１が電子部品用パッケージの機能に
影響することはない。多段構造の場合は、従来の方法で
は各段の歩留まりが累積して影響するので全体としての
歩留まりが低下して高コストとなってしまうが、本発明
により、各段の内層回路を平坦に削り出して各段の歩留
まりを改善し、生産性を向上して高品質のもとに低コス
トで多段構造を提供することができる。こうして、内層
回路面１０の高さ方向の状態に対して、高精度の内層削
り出し加工が可能となり、歩留まりを改善し、内層の任
意の各層間に段差形状を形成したプリント配線基板の生
産性を向上させてコストを低減することができる。尚、
高精度かつ高速の測定装置と高速の数値演算装置を用い
ればさらに効果的である。FIG. 5 is another example of the general electronic component package shown in FIG. 4, showing an example in which inner layer circuits having different layers are cut out to form a multistage structure. In this case, the inner layer circuit of each layer can be machined by controlling the height of the cutting blade by the method shown in FIG. That is, first, as shown in FIG. 5A, the heights of four measurement points A to D on the inner layer circuit surface located above are detected. Starting from the measurement point A, the measurement point B
When cutting out the machined surface whose end point is, the difference between the heights of the measurement point A and the measurement point B is proportionally calculated, and the height of the cutting blade is controlled by the calculated value to perform the machining operation. To do. Similarly, a machined surface having the measurement point B as the starting point and the measurement point C as the end point, a machining surface having the measurement point C as the starting point and the measurement point D as the end point, and the measurement point A as the starting point and the measurement point A as the starting point. The height difference of each measurement point is proportionally calculated in the order of the end surface to be machined, and the height of the cutting blade is controlled by the calculated value to perform the carving process. Next, as shown in FIG. 5B, the heights of four measurement points A1 to D1 on the inner layer circuit surface located below are detected. When machining a machined surface having the measurement point A1 as the start point and the measurement point B1 as the end point, the difference in height between the measurement point A1 and the measurement point B1 is proportionally calculated, and cutting is performed according to the calculated value. Controls the height of the blade to cut out. Similarly, a machining surface having the measurement point B1 as the starting point and the measurement point C1 as the end point, a machining surface having the measurement point C1 as the starting point and the measurement point D1 as the end point, and the measurement point D1 as the starting point and the measurement point A1 as the end point. The height difference of each measurement point is proportionally calculated in the order of the machining surface to be cut, and the height of the cutting blade is controlled by the calculated value to perform the carving process. At this time, the measurement points A to D on the inner layer circuit surface located on the upper side are cut and removed when the inner layer circuit surface located on the lower side is carved out, so that no trace thereof remains. FIG. 6 shows a state in which the die region 160 located at the lowermost part is carved out and the step shape is completed. At this time, the measurement points A1 to D1 on the inner layer circuit surface located below are cut and removed when the die region 160 is carved out in the previous period, so that no trace thereof remains. Therefore, the measurement points A to D and the measurement points A1 to D1 do not affect the function of the electronic component package. In the case of a multi-stage structure, since the yield of each stage is accumulated and affected by the conventional method, the overall yield is lowered and the cost becomes high.However, according to the present invention, the inner layer circuit of each stage is flattened. Therefore, the yield of each stage can be improved, the productivity can be improved, and a multistage structure can be provided with high quality and low cost. Thus, the inner layer circuit surface 10 can be machined with high precision in the height direction, the yield is improved, and the productivity of the printed wiring board in which a step shape is formed between arbitrary inner layers Can be improved and the cost can be reduced. still,
It is more effective if a high-precision and high-speed measuring device and a high-speed numerical operation device are used.
【００１１】[0011]
【発明の効果】本発明によれば、削り出す内層回路面の
始点と終点の高さの位置をあらかじめ測定し、始点及び
終点の高さの差の比例配分計算値によって切削刃の高さ
を制御することにより、また、前期削り出す内層回路各
面の各辺の削り出し加工始点及び終点の間の１点以上の
複数点の高さ位置をあらかじめ測定して、始点から終点
に至り隣接する各点の高さの差の比例配分計算値によっ
て、連続して切削刃の高さを制御することにより、内層
削り出し加工方法における内層回路面の高さ方向の傾き
等に起因する切削過多及び切削不足を防止する。その結
果、内層削り出し加工の歩留まりを改善し、内層の任意
の各層間に段差形状を形成したプリント配線基板の生産
性を向上させてコストを低減することができる。According to the present invention, the positions of the heights of the starting point and the end point of the inner layer circuit surface to be machined are measured in advance, and the height of the cutting edge is determined by the proportional distribution calculation value of the difference between the heights of the starting point and the end point. By controlling, the height positions of one or more points between the start point and the end point of each side of each surface of the inner layer circuit to be cut out in the previous period are measured in advance, and the height positions are adjacent from the start point to the end point. By controlling the height of the cutting edge continuously by the proportional distribution calculation value of the height difference of each point, there is excess cutting due to the inclination in the height direction of the inner layer circuit surface in the inner layer carving method and the like. Prevent insufficient cutting. As a result, it is possible to improve the yield of the inner layer shaving process, improve the productivity of the printed wiring board in which a step shape is formed between arbitrary layers of the inner layer, and reduce the cost.
【図１】内層回路及び測定点である始点と終点を示す
図。FIG. 1 is a diagram showing an inner layer circuit and start and end points which are measurement points.
【図２】本発明に係る比例配分計算の説明図。FIG. 2 is an explanatory diagram of proportional distribution calculation according to the present invention.
【図３】中点を設けた比例配分計算の説明図。FIG. 3 is an explanatory diagram of proportional distribution calculation with a middle point.
【図４】本発明を一般的な電子部品用パッケージに適用
した例を示す図。FIG. 4 is a diagram showing an example in which the present invention is applied to a general electronic component package.
【図５】電子部品用パッケージに本発明の多段形状加工
を施す状態を示す図。FIG. 5 is a diagram showing a state in which the multistage shape processing of the present invention is applied to an electronic component package.
【図６】ダイ領域を加工して本発明の多段形状加工を完
成した状態を示す図。FIG. 6 is a diagram showing a state in which the die region is processed to complete the multi-step shape processing of the present invention.
１０ 内層回路面 ２０ 始点 ２５ 中点 ３０ 終点 ４０ 加工基準平面 ５０ 切削刃 ６０ 始点から終点に至る比例配分した高さ ７０ 始点から中点に至る比例配分した高さ ７５ 中点から終点に至る比例配分した高さ ８０ 測定点Ａ ９０ 測定点Ｂ １００ 測定点Ｃ １１０ 測定点Ｄ １２０ 測定点Ａ１ １３０ 測定点Ｂ１ １４０ 測定点Ｃ１ １５０ 測定点Ｄ１ １６０ ダイ領域 10 Inner layer circuit side 20 starting point 25 midpoint 30 end point 40 Processing reference plane 50 cutting blades 60 Height proportionally distributed from the start point to the end point 70 Height proportionally distributed from the starting point to the midpoint 75 Proportional height from the midpoint to the end point 80 Measurement point A 90 Measurement point B 100 measurement point C 110 measurement point D 120 measurement points A1 130 measurement point B1 140 measurement point C1 150 measurement points D1 160 die area
Claims (3)
間に段差形状を形成したプリント配線基板において、削
り出す内層回路各面の各辺の削り出し加工始点及び終点
の高さ位置をあらかじめ測定して、始点と終点の高さの
差の比例配分計算値によって切削刃の高さを制御する内
層削り出し平坦加工によって、内層の任意の各層間に段
差形状を形成することを特徴とするプリント配線基板。1. In a printed wiring board in which a step shape is formed between arbitrary layers of an inner layer by carving the inner layer, the height position of the carving process starting point and the end point of each side of each surface of the inner layer circuit to be carved is measured in advance. Then, the print is characterized by forming a stepped shape between any layers of the inner layer by the inner layer cut-out flattening in which the height of the cutting blade is controlled by the proportional distribution calculation value of the height difference between the start point and the end point. Wiring board.
間に段差形状を形成したプリント配線基板の製造方法に
おいて、削り出す内層回路各面の各辺の削り出し加工始
点及び終点の高さ位置をあらかじめ測定して、始点と終
点の高さの差の比例配分計算値によって切削刃の高さを
制御する内層削り出し平坦加工によって、内層の任意の
各層間に段差形状を形成することを特徴とするプリント
配線基板の製造方法。2. In a method for manufacturing a printed wiring board in which a step shape is formed between arbitrary layers of an inner layer by carving the inner layer, a height position of a carving process start point and an end point of each side of each surface of the inner layer circuit to be carved. Is measured in advance, and the step shape is formed between any layers of the inner layer by the inner layer cut-out flattening in which the height of the cutting edge is controlled by the proportional distribution calculation value of the height difference between the start point and the end point. And a method for manufacturing a printed wiring board.
し加工始点及び終点の間の１点以上の複数点の高さ位置
をあらかじめ測定して、始点から終点に至り隣接する各
点の高さの差の比例配分計算値によって、連続して切削
刃の高さを制御することを特徴とする請求項２記載のプ
リント配線基板の製造方法。3. The height positions of one or more points between the starting point and the end point of the machining on each side of each surface of the inner layer circuit to be carved in the previous period are measured in advance, and the adjacent points from the starting point to the end point are adjoined. The method for manufacturing a printed wiring board according to claim 2, wherein the height of the cutting edge is continuously controlled by a proportional distribution calculated value of the height difference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001343886A JP2003115559A (en) | 2001-10-04 | 2001-10-04 | Printed wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001343886A JP2003115559A (en) | 2001-10-04 | 2001-10-04 | Printed wiring board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003115559A true JP2003115559A (en) | 2003-04-18 |
Family
ID=19157492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001343886A Pending JP2003115559A (en) | 2001-10-04 | 2001-10-04 | Printed wiring board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003115559A (en) |
-
2001
- 2001-10-04 JP JP2001343886A patent/JP2003115559A/en active Pending
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