JP2806479B2 - Numerical control substrate processing method and apparatus - Google Patents
Numerical control substrate processing method and apparatusInfo
- Publication number
- JP2806479B2 JP2806479B2 JP13613389A JP13613389A JP2806479B2 JP 2806479 B2 JP2806479 B2 JP 2806479B2 JP 13613389 A JP13613389 A JP 13613389A JP 13613389 A JP13613389 A JP 13613389A JP 2806479 B2 JP2806479 B2 JP 2806479B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing
- thickness
- numerical control
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Numerical Control (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、基板板厚が基板面上の位置によって変化す
る基板であっても、基板面上の所望の位置で、常に基板
上面(又は下面)から一定の割合の深さで加工を行う数
値制御基板加工方法及びその装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a substrate in which the thickness of a substrate changes depending on the position on the substrate surface, and the upper surface of the substrate (or at any desired position on the substrate surface) The present invention relates to a numerical control substrate processing method and a device for processing at a constant depth from the lower surface.
基板、例えばプリント基板においては、その補強用と
して、第2図に示すように、基板21の板厚方向の中央部
にガラス繊維をクロス状に編んだガラス繊維層22を位置
させ、その両側にエポキシ層23,23を介在させ、その上
下面に銅箔層24,24を被着形成したものがある。In the case of a substrate, for example, a printed circuit board, as shown in FIG. 2, a glass fiber layer 22 in which glass fibers are woven in a cross shape is positioned at the center of the substrate 21 in the thickness direction, as shown in FIG. There is one in which epoxy layers 23, 23 are interposed and copper foil layers 24, 24 are formed on the upper and lower surfaces thereof.
そして、このような基板21に取り付けられるICチップ
によっては、その放熱のため、ICチップ取付用の座ぐり
加工後、座ぐり加工部の内周面全面に銅めっきを行って
いる。このとき、エポキシ層23よりガラス繊維層22の方
が前記めっきの乗りがよいため、ガラス繊維層22の中央
部分までの座ぐり加工(図中A部参照)の要求がある。Then, depending on the IC chip mounted on such a substrate 21, for the heat dissipation, after counterboring for mounting the IC chip, copper plating is performed on the entire inner peripheral surface of the counterbored portion. At this time, since the glass fiber layer 22 has a better ride on the plating than the epoxy layer 23, there is a demand for counterbore processing (see A in the figure) up to the center portion of the glass fiber layer 22.
従来、数値制御基板加工装置を用い、このような基板
21を、その上面から一定深さで座ぐり加工する方法は知
られている。これは、基板21上面の位置を常時検出し、
その検出値から所望の寸法だけ下がった位置まで工具
(図示せず)を下降させるものである。Conventionally, using a numerically controlled substrate processing device,
There is a known method of spot-facing 21 at a certain depth from its upper surface. This means that the position of the upper surface of the substrate 21 is always detected,
The tool (not shown) is lowered to a position lower by a desired dimension from the detected value.
しかしこのような従来方法では、次のよな問題点があ
った。すなわち前記基板21の製造において、その内層部
分(層22,23,23部分)上下面に銅箔層24,24を加熱加工
して被着形成すると、基板板厚が基板21面上の位置によ
って変化する場合がある(通常は、基板21の内方側が厚
く、周辺側が薄くなる。この場合でも、ガラス繊維層22
は板厚方向中央に位置するのが通常である)。従来方法
では、このような基板21の常に中央部に位置するガラス
繊維層22までの座ぐり加工を行う場合、基板板厚の厚い
ほうを基準にすると、基板板厚の薄いほうが中央部のガ
ラス繊維層22を越えて、その下方のエポキシ層23まで達
してしまい(図中B部参照)、加工不良となった。逆
に、基板板厚の薄いほうを基準にすると、基板板厚の厚
いほうはガラス繊維層22まで達成せず、その上方の銅箔
層24とエポキシ層23の加工のみとなり、加工不良となっ
た。However, such a conventional method has the following problems. That is, in the manufacture of the substrate 21, when the copper foil layers 24, 24 are formed on the upper and lower surfaces of the inner layer portions (layers 22, 23, 23) by heating, the thickness of the substrate depends on the position on the substrate 21 surface. (In general, the inner side of the substrate 21 is thicker and the peripheral side is thinner.
Is usually located at the center in the thickness direction). In the conventional method, when counterbore processing is performed up to the glass fiber layer 22 which is always located at the center of the substrate 21, when the substrate thickness is larger, the thinner substrate thickness is the glass at the center. The resin reached the epoxy layer 23 below the fiber layer 22 (see the portion B in the figure), resulting in processing failure. Conversely, based on the thinner board thickness, the thicker board thickness does not reach the glass fiber layer 22 but only the copper foil layer 24 and epoxy layer 23 above it, resulting in processing failure. Was.
このように上記従来技術では、基板板厚の変化に伴い
座ぐり深さを変化させる点については、配慮されておら
ず、基板21の中央層まて座ぐり加工するという場合、基
準とする板厚より厚かったり、薄かったりした加工位置
では、それぞれ座ぐり深さが浅かったり、深すぎたりす
るといった問題があった。As described above, the prior art does not consider changing the spot facing depth in accordance with a change in the board thickness. At a processing position that is thicker or thinner than the thickness, there is a problem that the spot facing depth is shallow or too deep, respectively.
本発明の目的は、基板板厚変化に影響されず、常に板
厚方向の所望部分までの加工が可能な数値制御基板加工
方法及びその装置を提供することにある。An object of the present invention is to provide a numerical control substrate processing method and apparatus capable of always processing a desired portion in the thickness direction without being affected by a change in the substrate thickness.
上記目的は、各加工位置において実際の加工の前に基
板板厚を求め、その板厚を基準として、予め設定された
所望の比率(上述例では基板上面よりガラス繊維層まで
の基板板厚に対する比率)を乗算して得た値を加工深さ
として加工(上述例では座ぐり加工)を行うことにより
達成される。The above object is to obtain the substrate thickness at each processing position before the actual processing, and to set a desired ratio (based on the substrate thickness from the upper surface of the substrate to the glass fiber layer in the above example) based on the thickness. This is achieved by performing machining (counterbore machining in the above example) with the value obtained by multiplying by the ratio) as the machining depth.
上述例において、基板21のガラス繊維層22は、板厚の
変化があっても通常、板厚方向中央に位置されることは
既に述べた通りである。本発明では、このガラス繊維層
22まで座ぐり加工する場合、各加工位置において板厚を
求め、この板厚に対するガラス繊維層22までの寸法の比
率で座ぐり深さを決定する。このため、板厚方向中央に
配置されたガラス繊維層22まで座ぐり加工を行う場合、
50%の座ぐり深さを指示すれば板厚の変化には関係な
く、板厚方向中央部のガラス繊維層までの座ぐり加工が
行え、基板板厚変化で加工不良が発生することはない。In the above-described example, as described above, the glass fiber layer 22 of the substrate 21 is usually positioned at the center in the thickness direction even if the thickness changes. In the present invention, this glass fiber layer
When counterbore processing is performed up to 22, the plate thickness is determined at each processing position, and the spot facing depth is determined by the ratio of the dimension up to the glass fiber layer 22 to the plate thickness. For this reason, when performing spot facing up to the glass fiber layer 22 arranged at the center in the thickness direction,
If a counterbore depth of 50% is indicated, the counterbore processing can be performed up to the glass fiber layer at the center in the plate thickness direction regardless of the change in the plate thickness. .
以下、図面を参照して本発明の実施例を説明する。第
1図は、本発明による数値制御基板加工方法及びその装
置の一実施例を説明するための構成図である。この第1
図においては、1はベッド、2はX,Yテーブル、3はク
ロスレールで、ベッド1、クロスレール3をベースと
し、X,Yテーブル2の前後移動(図示面に対して垂直方
向の移動)によりX軸移動を行う。Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram for explaining one embodiment of a numerical control substrate processing method and apparatus according to the present invention. This first
In the figure, 1 is a bed, 2 is an X and Y table, 3 is a cross rail, and the bed 1 and the cross rail 3 are used as a base, and the X and Y tables 2 are moved back and forth (movement in a direction perpendicular to the plane of the drawing). To move the X axis.
また4はサドル、5はZ軸モータ、6はY軸モータ、
7はスピンドル、8は工具で、スピンドル7を取り付け
たサドル4をY軸モータ6により左右移動(図中左右方
向に移動)させることによりY軸移動を行い、スピンド
ル7とサドル4をZ軸モータ5により上下移動(図中上
下方向に移動)させることにより工具8のZ軸移動を行
う。4 is a saddle, 5 is a Z-axis motor, 6 is a Y-axis motor,
Reference numeral 7 denotes a spindle, and 8 denotes a tool. The saddle 4 on which the spindle 7 is mounted is moved left and right by the Y-axis motor 6 (moves in the left-right direction in the figure), and the spindle 7 and the saddle 4 are moved by the Z-axis The tool 8 is moved up and down (moves in the vertical direction in the figure) by 5 to move the Z axis of the tool 8.
以上のようなX,Y軸移動により位置決め,切削送りを
行い、Z軸移動により座ぐり深さまでの切削送りを行
う。The positioning and cutting feed are performed by the X and Y axis movements as described above, and the cutting feed to the counterbore depth is performed by the Z axis movement.
さらに、9はZ軸方向の位置を検出する位置検出器、
10は位置検出器9の検出子の直線移動をパルス数に変換
するパルス変換器、11は数値制御装置、21は第2図と同
様の基板である。ここで数値制御装置11は、数値制御基
板加工装置の数値制御装置としての一般的な制御手段と
して機能すると共に、次の手段としても兼用される。す
なわち、前記位置検出器9により検出された前記X,Yテ
ーブル2の上面位置及びX,Yテーブル2上に載置された
基板21の上面位置から前記基板21の板厚を算出し、その
算出値に対し、予め設定された所望の比率、ここでは50
%を乗算して加工深さを求める演算手段及びこれにより
求められた加工深さに工具8を下降させる工具制御手段
をも兼用している。Further, 9 is a position detector for detecting a position in the Z-axis direction,
10 is a pulse converter for converting the linear movement of the detector of the position detector 9 into a pulse number, 11 is a numerical controller, and 21 is the same substrate as in FIG. Here, the numerical control device 11 functions as a general control means as a numerical control device of the numerical control substrate processing apparatus, and is also used as the following means. That is, the thickness of the substrate 21 is calculated from the upper surface position of the X, Y table 2 detected by the position detector 9 and the upper surface position of the substrate 21 placed on the X, Y table 2, and the calculation is performed. Value to the desired ratio that is set in advance, here 50
The calculation means for calculating the machining depth by multiplying by% and the tool control means for lowering the tool 8 to the machining depth thus obtained are also used.
すなわち本発明は、予め位置検出器9によりX,Yテー
ブル2の上面位置を測定し、その値をパルス変換器10を
通して数値制御装置11内に記憶する。続いて、基板13を
X,Yテーブル2上にセットし、加工が行われるが、各加
工位置において、位置検出器9は基板21の上面位置を測
定する。That is, in the present invention, the position of the upper surface of the X, Y table 2 is measured by the position detector 9 in advance, and the value is stored in the numerical controller 11 through the pulse converter 10. Then, the substrate 13
It is set on the X, Y table 2 and processing is performed. At each processing position, the position detector 9 measures the upper surface position of the substrate 21.
数値制御装置11は、各加工位置において、位置検出器
9で測定された基板21の上面位置データと、既に記憶さ
れているX,Yテーブル2の上面位置データ(一定値)と
により基板板厚を算出し、かつその算出値に対して予め
設定された所望の比率、ここでは50%を乗算する。さら
に数値制御装置11は、前記50%乗算値を加工深さとして
工具8をZ軸送りしつつ、X,Yテーブル2でX,Y軸送りし
て座ぐり加工するものである。At each processing position, the numerical controller 11 calculates the substrate thickness based on the upper surface position data of the substrate 21 measured by the position detector 9 and the already stored upper surface position data (constant value) of the X, Y table 2. Is calculated, and the calculated value is multiplied by a preset desired ratio, here, 50%. Further, the numerical control device 11 feeds the tool 8 in the Z-axis direction while feeding the tool 8 in the Z-axis direction with the 50% multiplied value as the processing depth, and performs the spot facing operation by feeding the X and Y axes in the X and Y table 2.
上述実施例では、本発明を座ぐり加工に適用した場合
について説明したが、盲孔穴明加工についても適用でき
ることは勿論である。In the above embodiment, the case where the present invention is applied to spot facing is described, but it is needless to say that the present invention can also be applied to blind hole drilling.
本発明によれば、基板板厚に対する所望加工層位置の
比率で加工深さ、例えば座ぐり深さが決められるので、
板厚方向中央層など、所望位置を狙って加工する場合、
板厚の変化によって加工不良が発生することを防止でき
るという効果がある。According to the present invention, the processing depth, for example, the spot facing depth is determined by the ratio of the desired processing layer position to the substrate plate thickness,
When processing at a desired position, such as the center layer in the thickness direction,
There is an effect that it is possible to prevent the occurrence of processing defects due to a change in the plate thickness.
【図面の簡単な説明】 第1図は本発明方法及び装置の一実施例を説明するため
の構成図、第2図は従来技術の問題点を説明するための
基板断面図である。 1……ベッド、2……X,Yテーブル、3……クロスレー
ル、4……サドル、5……Z軸モータ、6……Y軸モー
タ、7……スピンドル、8……工具、9……位置検出
器、10……パルス変換器、11……数値制御装置、21……
基板、22……ガラス繊維層、23……エポキシ層、24……
銅箔層。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram for explaining an embodiment of the method and apparatus of the present invention, and FIG. 2 is a cross-sectional view of a substrate for explaining problems of the prior art. 1 ... bed, 2 ... X, Y table, 3 ... cross rail, 4 ... saddle, 5 ... Z axis motor, 6 ... Y axis motor, 7 ... spindle, 8 ... tool, 9 ... ... Position detector, 10 ... Pulse converter, 11 ... Numeric control device, 21 ...
Substrate, 22 ... glass fiber layer, 23 ... epoxy layer, 24 ...
Copper foil layer.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−237838(JP,A) 特開 昭63−232484(JP,A) 特開 昭61−90851(JP,A) (58)調査した分野(Int.Cl.6,DB名) B23Q 15/00 H05K 3/00 G05B 19/403──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-237838 (JP, A) JP-A-63-232484 (JP, A) JP-A-61-90851 (JP, A) (58) Field (Int.Cl. 6 , DB name) B23Q 15/00 H05K 3/00 G05B 19/403
Claims (2)
行う数値制御基板加工方法において、前記加工装置のX,
Yテーブルの上面位置を測定すると共に、各加工位置に
ついて前記X,Yテーブル上に載置された基板の上面位置
を測定し、各加工位置について前記基板の板厚を算出
し、その算出値に対し、予め設定された所望の比率を乗
算して得た値を加工深さとして加工することを特徴とす
る数値制御基板加工方法。1. A numerically controlled substrate processing method for processing a substrate using a numerically controlled substrate processing apparatus, comprising:
Measure the upper surface position of the Y table, measure the upper surface position of the substrate placed on the X, Y table for each processing position, calculate the thickness of the substrate for each processing position, and calculate the calculated value. On the other hand, a numerical control board processing method, wherein a value obtained by multiplying a predetermined desired ratio is processed as a processing depth.
に載置された基板の上面位置を各々測定する位置検出手
段と、この位置検出手段により検出された前記各上面位
置から前記基板の板厚を算出し、その算出値に対し、予
め設定された所望の比率を乗算して加工深さを求める演
算手段と、この演算手段で求められた加工深さに工具を
下降させる工具制御手段とを具備することを特徴とする
数値制御基板加工装置。2. A position detecting means for measuring an upper surface position of an X, Y table and an upper surface position of a substrate placed on the X, Y table, respectively, and A calculating means for calculating the thickness of the substrate, multiplying the calculated value by a desired ratio set in advance to obtain a processing depth, and a tool for lowering the tool to the processing depth obtained by the calculating means A numerically controlled substrate processing apparatus, comprising: a control unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13613389A JP2806479B2 (en) | 1989-05-31 | 1989-05-31 | Numerical control substrate processing method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13613389A JP2806479B2 (en) | 1989-05-31 | 1989-05-31 | Numerical control substrate processing method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH033009A JPH033009A (en) | 1991-01-09 |
JP2806479B2 true JP2806479B2 (en) | 1998-09-30 |
Family
ID=15168080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13613389A Expired - Lifetime JP2806479B2 (en) | 1989-05-31 | 1989-05-31 | Numerical control substrate processing method and apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2806479B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0357190B1 (en) * | 1988-08-30 | 1995-04-05 | Kabushiki Kaisha TEC | Optical scanner |
JP2016122825A (en) * | 2014-02-21 | 2016-07-07 | ビアメカニクス株式会社 | Back drilling method and back drilling device |
TW201605315A (en) | 2014-02-21 | 2016-02-01 | 維亞機械股份有限公司 | Backdrilling method, and backdrilling apparatus |
-
1989
- 1989-05-31 JP JP13613389A patent/JP2806479B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH033009A (en) | 1991-01-09 |
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