JPH06112659A - Multilayer wiring board processor and processing method - Google Patents
Multilayer wiring board processor and processing methodInfo
- Publication number
- JPH06112659A JPH06112659A JP4281011A JP28101192A JPH06112659A JP H06112659 A JPH06112659 A JP H06112659A JP 4281011 A JP4281011 A JP 4281011A JP 28101192 A JP28101192 A JP 28101192A JP H06112659 A JPH06112659 A JP H06112659A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- layer
- wiring layer
- wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drilling And Boring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、多層配線基板において
放熱性能を向上させるために、パワー素子を下層の配線
層に配設させるための座ぐり加工を行うための装置及び
加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a processing method for carrying out a counter boring process for disposing a power element in a lower wiring layer in order to improve heat dissipation performance in a multilayer wiring board.
【０００２】[0002]
【従来の技術】従来、微小電流を扱う電子回路と大電流
を扱うパワー素子とを同一の金属ベ−ス上に実装したハ
イブリッド電子回路が知られている。この場合、パワー
素子は、放熱性能を向上させるために、金属ベ−スに絶
縁膜を介して配設され、パワー素子を形成しない部分に
は、電子回路の実装密度を向上させるために多層配線を
形成することが行われている。2. Description of the Related Art Conventionally, there has been known a hybrid electronic circuit in which an electronic circuit handling a small current and a power element handling a large current are mounted on the same metal base. In this case, the power element is arranged on the metal base via the insulating film in order to improve the heat dissipation performance, and the part where the power element is not formed has a multilayer wiring for improving the mounting density of the electronic circuit. Is being formed.
【０００３】金属ベ−ス上に多層配線を形成するには、
金属ベ−ス上に絶縁膜を介して厚さ１００μｍ程度の銅
箔を接着し、所定パターンにエッチングした後、そのパ
ターン形成された銅箔の上に絶縁膜を印刷形成し、その
絶縁膜の上に銅メッキにより第２の配線層を形成するこ
とが行われている。しかしこの方法では、銅箔の厚さが
厚いので、絶縁膜を印刷で形成する時に銅箔端部にボイ
ドが発生すこと、第２の配線層はメッキにより形成され
るので第２の配線層を厚くできないこと、メッキ液が絶
縁膜と第２の配線層との間に残留する等の問題がある。To form a multilayer wiring on a metal base,
A copper foil having a thickness of about 100 μm is adhered on a metal base via an insulating film, and after etching into a predetermined pattern, an insulating film is formed by printing on the patterned copper foil. A second wiring layer is formed on the surface by copper plating. However, in this method, since the thickness of the copper foil is large, voids are generated at the edges of the copper foil when the insulating film is formed by printing, and since the second wiring layer is formed by plating, the second wiring layer is formed. There is a problem that the thickness cannot be increased and the plating solution remains between the insulating film and the second wiring layer.
【０００４】一方、絶縁層の両側に銅箔が接着された配
線基板において、銅箔を所定形状にパターン形成し、ス
ルーホールを形成し、そのスルーホールを上下の配線層
が導通するようにメッキした後、この配線基板を金属ベ
−スに絶縁膜を介して接合させる方法もある。この方法
では、配線層の厚さは自由に決められ、前者の方法によ
るボイド等の問題は回避される。On the other hand, in a wiring board in which copper foil is adhered to both sides of an insulating layer, the copper foil is patterned into a predetermined shape to form a through hole, and the through hole is plated so that the upper and lower wiring layers are electrically connected. After that, there is also a method of joining this wiring board to a metal base via an insulating film. In this method, the thickness of the wiring layer can be freely determined, and the problems such as voids caused by the former method can be avoided.
【０００５】[0005]
【発明の解決しようとする課題】しかしながら、パワー
素子を金属ベ−スに最も近い配線層に配設するには、パ
ワー素子を配設する領域の配線基板を一部除去、即ち、
座ぐりして、金属ベ−スに最も近い最下配線層を露出さ
せることが必要である。However, in order to dispose the power element on the wiring layer closest to the metal base, the wiring substrate in the area where the power element is disposed is partially removed, that is,
It is necessary to spot face to expose the bottom wiring layer closest to the metal base.
【０００６】しかし、座ぐり加工をドリルで行う場合に
は、元々基板厚さが薄く多層配線基板の厚さにバラツキ
があるため、加工工具の送りを一定値に固定してしまう
と、必ずしも下層配線が完全に露出されるとは限らず、
逆に深く座ぐり過ぎて配線を破壊してしまうなどの問題
があった。このように、従来は、多層配線基板における
座ぐり加工を精度良くかつ効率良く行うことは非常に困
難であった。However, when the spot boring process is performed by a drill, since the substrate thickness is originally thin and the thickness of the multilayer wiring substrate varies, if the feed of the machining tool is fixed to a constant value, the lower layer is not always required. The wiring is not always completely exposed,
On the contrary, there was a problem that it was too deeply spotted and the wiring was destroyed. As described above, conventionally, it has been very difficult to perform counterboring in a multilayer wiring board with high precision and efficiency.
【０００７】本発明は、上記の課題を解決するために成
されたものでり、その目的は、多層配線基板において、
所定の配線層を切り込み過ぎることなく、完全に露出さ
せ得るような座ぐり加工を可能とすることである。The present invention has been made to solve the above problems, and its purpose is to provide a multilayer wiring board,
It is possible to carry out a spot facing process such that a predetermined wiring layer can be completely exposed without cutting too much.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
の発明の構成は、複数の配線層が絶縁層を介在させて多
層に形成された多層配線基板に対して、工具を送って部
分的に前記絶縁層を座ぐり、下層の所定配線層の一部を
露出させる座ぐり加工を行う加工装置において、工具と
所定配線層との間に電圧を印加する給電手段と、工具と
所定配線層との導通を検出する導通検出手段と、導通検
出手段の出力に応じて工具の送りを制御する制御手段と
を設けたことである。A structure of the invention for solving the above problems is to partially send a tool to a multilayer wiring board in which a plurality of wiring layers are formed in multiple layers with an insulating layer interposed therebetween. In a processing device for spot facing the insulating layer to expose a part of a predetermined wiring layer below, a power feeding means for applying a voltage between the tool and the predetermined wiring layer, a tool and the predetermined wiring layer. That is, there is provided a conduction detecting means for detecting conduction with and a control means for controlling the feeding of the tool according to the output of the conduction detecting means.
【０００９】又、他の発明の構成は、多層配線基板に座
ぐり加工を行う方法において、工具と所定配線層との間
に電圧を印加し、工具と所定配線層との導通を検出し、
導通の検出時に応じて、工具の送りを減速・停止・後退
させることを特徴とする。According to another aspect of the invention, in a method for spot-boring a multilayer wiring board, a voltage is applied between the tool and a predetermined wiring layer to detect conduction between the tool and the predetermined wiring layer,
The feature is that the tool feed is decelerated / stopped / retracted according to the detection of the continuity.
【００１０】[0010]
【作用】工具と露出させたい所定配線層との間に給電手
段により電圧が印加される。この状態で、工具が多層配
線基板の方向に送られ、穴開け加工が行われる。所定配
線層には電圧又は電流を検出することで工具と所定配線
層との接触を検出する導通検出手段が接続されており、
工具が所定配線層に達すると、導通検出手段により工具
と所定配線層との導通が検出される。導通検出手段から
は、工具が所定配線層に接触した時に信号が出力される
が、この信号に応じて、工具の送りが停止される。従っ
て、所定配線層を断線させることなく完全に露出させる
ことができる。尚、工具が所定配線層に接触した時によ
り所定時間遅延させて、工具の送りを停止させることに
より、所定配線層上に形成された黒化処理膜等の表面層
を適正に除去することができ、この座ぐり位置にパワー
素子等を電気伝導性良く配設することができる。Function: A voltage is applied between the tool and the predetermined wiring layer to be exposed by the power feeding means. In this state, the tool is sent in the direction of the multi-layer wiring board to carry out the drilling process. Continuity detection means for detecting contact between the tool and the predetermined wiring layer by detecting voltage or current is connected to the predetermined wiring layer,
When the tool reaches the predetermined wiring layer, the conduction detecting means detects the conduction between the tool and the predetermined wiring layer. A signal is output from the continuity detecting means when the tool comes into contact with the predetermined wiring layer, but the feeding of the tool is stopped in response to this signal. Therefore, the predetermined wiring layer can be completely exposed without breaking. It should be noted that the surface layer such as the blackening treatment film formed on the predetermined wiring layer can be properly removed by delaying the feeding of the tool for a predetermined time when the tool comes into contact with the predetermined wiring layer. It is possible to arrange the power element and the like at this counterbore position with good electrical conductivity.
【００１１】[0011]
【発明の効果】本発明は、工具と所定配線層との間に電
圧を印加し、所定配線層に表れる電圧又は電流を検出す
ることで工具と所定配線層との導通を検出する導通検出
手段を設けて、その検出手段の出力に応じて工具の送り
を停止させるようにした装置及び方法である。従って、
工具の加工停止位置を正確に把握でき、所定配線層を断
線させることなく完全に露出させることができる。According to the present invention, a conduction detecting means for detecting conduction between the tool and the predetermined wiring layer by applying a voltage between the tool and the predetermined wiring layer and detecting the voltage or the current appearing in the predetermined wiring layer. Is provided, and the feeding of the tool is stopped according to the output of the detecting means. Therefore,
The machining stop position of the tool can be accurately grasped, and the predetermined wiring layer can be completely exposed without breaking.
【００１２】[0012]
【実施例】以下、本発明を具体的な一実施例に基づいて
説明する。 （１）多層配線基板の構成 多層配線基板102 は、図１に示すように、金属ベース10
1 上に接着剤である絶縁層103 により接合されている。
その多層配線基板102 はガラスエポキシである絶縁層10
5 と、その絶縁層105 の上面及び下面に所定のパターン
に形成され、接着剤で接合された上面配線層104 と下面
配線層106 とを有している。上面配線層104 と下面配線
層106 とは所定の位置に開けられたスルーホール107 に
メッキされた銅薄膜108 により導通されている。本実施
例装置の座ぐり加工装置は、座ぐり部109 を座ぐり、パ
ワー素子を露出した下面配線層106 にハンダ接合するた
めのものである。この金属ベ−ス多層配線基板は、図２
の（１）に示される断面図の如く、すくなくとも表裏に
配線用銅箔201,202 が絶縁層203 を介して張り合わせて
あり、それを希望の配線パタ−ンにしたのちにスル−ホ
−ル204 を形成させて、スル−ホ−ル204 をメッキして
図２の（２）のような構造をしたものを図２の（３）の
ように金属ベ−ス206 上に接着剤205 を介して絶縁させ
て張り合わせたものである。なお、図２の（１）の銅箔
には、図２の（４）に示すように、絶縁層210 との接着
性を良くするために黒化処理膜212 が施されている場合
がある。EXAMPLES The present invention will be described below based on a specific example. (1) Structure of Multilayer Wiring Board As shown in FIG.
It is bonded to the upper surface by an insulating layer 103 which is an adhesive.
The multilayer wiring board 102 is an insulating layer 10 made of glass epoxy.
5, and an upper surface wiring layer 104 and a lower surface wiring layer 106 which are formed in a predetermined pattern on the upper surface and the lower surface of the insulating layer 105 and which are joined with an adhesive. The upper surface wiring layer 104 and the lower surface wiring layer 106 are electrically connected by a copper thin film 108 plated in a through hole 107 formed at a predetermined position. The counterbore processing apparatus of the apparatus of this embodiment is for boring the counterbore portion 109 and soldering the power element to the exposed lower surface wiring layer 106. This metal-based multilayer wiring board is shown in FIG.
As shown in the sectional view of (1), wiring copper foils 201 and 202 are laminated at least on the front and back sides with an insulating layer 203 interposed between them. After making it into a desired wiring pattern, a through hole 204 is attached. After being formed, a through hole 204 is plated to form a structure as shown in FIG. 2 (2), and a metal base 206 is bonded to the metal base 206 with an adhesive 205 as shown in FIG. 2 (3). It is made by insulating and pasting together. The copper foil of FIG. 2 (1) may be provided with a blackening treatment film 212 in order to improve the adhesiveness with the insulating layer 210, as shown in FIG. 2 (4). .
【００１３】（２）座ぐり加工装置の構成 上記の座ぐり加工を行う為の簡単な実施例の装置を図３
に示す。加工装置は、加工工具304 及び基板固定台301
と、工具を回転させる回転モ−タ−303 、その回転モ−
タ−を移動させる制御モ−タ−302 、工具に電圧を与え
る給電回路306、給電線307 、工具が目的の下層配線に
接触したことを検出する接触検出回路308 と所定の下層
配線に接続された検出導線309 、検出信号を受けてモ−
タ−類に制御信号を出す制御回路310 、制御信号線311,
312 とからなる。制御信号線311は制御モ−タ−302 に
つながれ、制御信号線312 は工具の回転モ−タ−303 に
つながれている。(2) Structure of Counterbore Processing Apparatus A simple embodiment apparatus for performing the above-mentioned counterbore processing is shown in FIG.
Shown in. The processing equipment is the processing tool 304 and the board fixing base 301.
And a rotary motor 303 for rotating the tool, the rotary motor
A control motor 302 for moving the motor, a power supply circuit 306 for applying a voltage to the tool, a power supply line 307, a contact detection circuit 308 for detecting that the tool contacts the target lower layer wiring, and a predetermined lower layer wiring. Detection lead 309, which receives the detection signal
Control circuit 310 for outputting a control signal to the data, control signal line 311,
It consists of 312. The control signal line 311 is connected to the control motor 302, and the control signal line 312 is connected to the tool rotation motor 303.
【００１４】図４は、図３の給電回路と接触検出回路の
具体例で、410 が給電回路,420が接触検出回路である。
給電回路410 はブラシ411 とスリップリング412 を介し
て低圧直流電源413 から、ドリル402 に電位を与えてい
る。給電の方法は誘導コイルなどの非接触式でもよい。
基板401 の露出させたい下層配線部405 からリ−ド線40
6 を引き出し、接触検出回路420 に入力する。接触検出
信号は入力抵抗423 の端子電圧であり、コンパレ−タ42
1 の反転入力端子にする。又、非反転入力端子には、分
圧された電圧が入力される。コンパレ−タ421 の出力は
信号遅延回路422 に接続してある。FIG. 4 shows a specific example of the power supply circuit and the contact detection circuit of FIG. 3, where 410 is the power supply circuit and 420 is the contact detection circuit.
The power supply circuit 410 applies a potential to the drill 402 from the low voltage DC power supply 413 via the brush 411 and the slip ring 412. The power feeding method may be a non-contact type such as an induction coil.
From the lower wiring section 405 to be exposed on the substrate 401 to the lead wire 40
Pull out 6 and input to contact detection circuit 420. The contact detection signal is the terminal voltage of the input resistor 423, and the comparator 42
Set to the inverting input terminal of 1. The divided voltage is input to the non-inverting input terminal. The output of the comparator 421 is connected to the signal delay circuit 422.
【００１５】図５は制御回路の実施例で、検出信号は入
力端子508 に接続され、この検出信号でトランジスタ50
2 が働き、リレ−503 を作動させる。リレ−の切り替え
スイッチの接点504 は制御用モ−タ−506 に、ノ−マリ
−・クロ−ズの接点505 は工具の回転モ−タ−507 に接
続されている。図６は、図４、図５の実施例の動作チャ
−ト図である。なお、加工は座ぐりだけとは限らない
為、装置の実施例はいくらでも複雑に出来るが、基本的
なシステムは上記の如くである。FIG. 5 shows an embodiment of the control circuit, in which the detection signal is connected to the input terminal 508, and the transistor 50 receives the detection signal.
2 works and activates relay 503. The contact 504 of the relay changeover switch is connected to the control motor 506, and the contact 505 of the normally close is connected to the rotary motor 507 of the tool. FIG. 6 is an operation chart of the embodiment shown in FIGS. Since the machining is not limited to the spot facing, the embodiment of the apparatus can be made as complicated as possible, but the basic system is as described above.
【００１６】（３）座ぐり加工装置の作用 図４において、対象とする被加工基板を図３の加工台30
1 に固定し、所定の位置決めをする。図５に示すメイン
スイッチ（自己保持リレ−スイッチ）509 をオンするこ
とでドリル402 が回転し下降する。ドリル402 が基板の
絶縁部403 を削って所定の下層配線405 に達して導通が
生じると（図６の（ａ））、検出導線406 に電位が発生
して、コンパレ−タ421 の出力信号が反転する（図６の
（ｂ））。その信号を受けて信号遅延回路422 は、図２
の（４）にある黒化処理膜212 を取り除いて所定の下層
配線405 を充分に露出させるために最適な時間遅れをも
つよう設定した接触検出信号426 を発生させる（図６の
（ｃ））。(3) Operation of counterbore processing device In FIG. 4, the target substrate to be processed is the processing table 30 shown in FIG.
Fix to 1 and position as desired. Turning on the main switch (self-holding relay switch) 509 shown in FIG. 5 causes the drill 402 to rotate and descend. When the drill 402 scrapes the insulating portion 403 of the substrate and reaches the predetermined lower layer wiring 405 to cause conduction ((a) in FIG. 6), an electric potential is generated in the detection lead wire 406 and the output signal of the comparator 421 is output. It is inverted ((b) of FIG. 6). The signal delay circuit 422 receives the signal and
The blackening treatment film 212 in (4) is removed to generate a contact detection signal 426 which is set to have an optimum time delay in order to sufficiently expose the predetermined lower layer wiring 405 ((c) in FIG. 6). .
【００１７】図５の制御回路501 で、信号遅延回路422
から信号をうけとるとトランジスタ502 がタ−ンオン
し、リレ−503 を作動させる（図６の（ｄ））。このリ
レ−作動により、リレ−接点505 がオフとなり、ドリル
の回転は停止する。又、リレ−接点504 が切り替わり、
モ−タ−506 が逆回転して、ドリル402 は上昇し、リミ
ッタ−スイッチ510 で停止する。In the control circuit 501 of FIG. 5, the signal delay circuit 422
When the signal is received from the transistor 502, the transistor 502 is turned on and the relay 503 is activated ((d) of FIG. 6). By this relay operation, the relay contact 505 is turned off and the rotation of the drill is stopped. Also, the relay contact 504 switches,
When the motor 506 rotates in the reverse direction, the drill 402 rises and stops at the limiter switch 510.
【００１８】（４）座ぐり加工装置の効果 本発明により、金属ベ−ス上の多層基配線板製造で今ま
では実現できなかった、座ぐりによる下層配線露出が効
率良く実現でき、ハイブリッド電子回路などにおいて、
素子の高密度化、信頼性の向上が達成できるようになっ
た。(4) Effects of Counterbore Processing Apparatus According to the present invention, it is possible to efficiently realize lower layer wiring exposure by counterboring, which has not been realized so far in the manufacture of a multilayer base wiring board on a metal base. In circuits,
It has become possible to achieve higher density and higher reliability of devices.
【図１】本発明の実施例にかかる座ぐり加工装置により
加工される金属ベース上に接合された多層配線基板の構
成を示した断面図。FIG. 1 is a cross-sectional view showing a configuration of a multilayer wiring board bonded on a metal base processed by a spot facing device according to an embodiment of the present invention.
【図２】図１に示す多層配線基板の製造過程を示す多層
配線基板の断面図。2 is a cross-sectional view of a multilayer wiring board showing a manufacturing process of the multilayer wiring board shown in FIG.
【図３】本発明の実施例にかかる座ぐり加工装置の構成
を示したブロック図。FIG. 3 is a block diagram showing a configuration of a spot facing device according to an embodiment of the present invention.
【図４】図３に示した座ぐり加工装置における給電回路
および接触検出回路を示した回路図。FIG. 4 is a circuit diagram showing a power supply circuit and a contact detection circuit in the spot facing device shown in FIG.
【図５】図３に示した座ぐり加工装置における制御回路
を示した回路図。5 is a circuit diagram showing a control circuit in the spot facing device shown in FIG.
【図６】図３に示した座ぐり加工装置の動作を示したタ
イミングチャート。6 is a timing chart showing the operation of the spot facing device shown in FIG.
101 金属ベ−ス 102 多層配線基板 103 絶縁接着層 105 ガラスエポキシ板等の絶縁層 109 座ぐり対象部 206 金属ベ−ス 211 基板配線層の銅箔 212 黒化処理膜 304 加工工具 305 被加工基板 410 給電回路 420 接触検出回路 501 制御回路 508 制御入力端子 101 Metal Base 102 Multilayer Wiring Board 103 Insulation Adhesive Layer 105 Insulation Layer such as Glass Epoxy Board 109 Counterbore Target Area 206 Metal Base 211 Copper Foil on Board Wiring Layer 212 Blackening Treatment Film 304 Processing Tool 305 Worked Board 410 Power supply circuit 420 Contact detection circuit 501 Control circuit 508 Control input terminal
Claims (2)
に形成された多層配線基板に対して、工具を送って部分
的に前記絶縁層を座ぐり、下層の所定配線層の一部を露
出させる座ぐり加工を行う加工装置において、 前記工具と前記所定配線層との間に電圧を印加する給電
手段と、 前記工具と前記所定配線層との導通を検出する導通検出
手段と、 前記導通検出手段の出力に応じて前記工具の送りを制御
する制御手段とを備えることを特徴とする多層配線基板
加工装置。1. A multi-layered wiring board, in which a plurality of wiring layers are formed in multiple layers with an insulating layer interposed, and a tool is sent to partially scoop the insulating layer to form a part of a lower predetermined wiring layer. In a machining device for performing a spot facing process to expose the, a power feeding means for applying a voltage between the tool and the predetermined wiring layer, a conduction detection means for detecting conduction between the tool and the predetermined wiring layer, A multilayer wiring board processing apparatus comprising: a control unit that controls the feed of the tool according to the output of the continuity detection unit.
に形成された多層配線基板に対して、工具を送って部分
的に前記絶縁層を座ぐり、下層の所定配線層の一部を露
出させる座ぐり加工を行う方法において、 前記工具と前記所定配線層との間に電圧を印加し、 前記工具と前記所定配線層との導通を検出し、 導通の検出時に応じて、前記工具の送りを減速・停止・
後退させることを特徴とする多層配線基板における座ぐ
り加工方法。2. A multi-layer wiring board having a plurality of wiring layers formed in multiple layers with an insulating layer interposed, and a tool is sent to partially scoop the insulating layer to form a part of a lower predetermined wiring layer. In the method of performing the counterbore processing to expose the, by applying a voltage between the tool and the predetermined wiring layer, to detect the conduction between the tool and the predetermined wiring layer, depending on the detection of conduction, the tool Slows down / stops the feed of
A counterbore processing method for a multilayer wiring board, which is characterized by retreating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28101192A JP3404771B2 (en) | 1992-09-24 | 1992-09-24 | Multilayer wiring board processing apparatus and processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28101192A JP3404771B2 (en) | 1992-09-24 | 1992-09-24 | Multilayer wiring board processing apparatus and processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06112659A true JPH06112659A (en) | 1994-04-22 |
| JP3404771B2 JP3404771B2 (en) | 2003-05-12 |
Family
ID=17633040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28101192A Expired - Fee Related JP3404771B2 (en) | 1992-09-24 | 1992-09-24 | Multilayer wiring board processing apparatus and processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3404771B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130379A (en) * | 1994-10-31 | 1996-05-21 | Nec Corp | Manufacture of multilayer wiring board |
| EP0808087A2 (en) * | 1996-05-17 | 1997-11-19 | PLURITEC ITALIA S.p.A. | Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| WO2005029928A3 (en) * | 2003-09-19 | 2005-12-29 | Viasystem Group Inc | Closed loop backdrilling system |
| CN106624012A (en) * | 2016-12-29 | 2017-05-10 | 安徽深泽电子科技有限公司 | Manufacturing method of short slotted hole on PCB (Printed Circuit Board) |
| US11690177B2 (en) | 2020-04-07 | 2023-06-27 | Nextgin Technology Bv | Methods and systems for back-drilling a multi-layer circuit board |
-
1992
- 1992-09-24 JP JP28101192A patent/JP3404771B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130379A (en) * | 1994-10-31 | 1996-05-21 | Nec Corp | Manufacture of multilayer wiring board |
| EP0808087A2 (en) * | 1996-05-17 | 1997-11-19 | PLURITEC ITALIA S.p.A. | Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| EP0808087A3 (en) * | 1996-05-17 | 1998-09-09 | PLURITEC ITALIA S.p.A. | Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| US6015249A (en) * | 1996-05-17 | 2000-01-18 | Pluritec Italia S.P.A. | Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| US6309151B1 (en) | 1996-05-17 | 2001-10-30 | Pluritec Italia | Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| WO2005029928A3 (en) * | 2003-09-19 | 2005-12-29 | Viasystem Group Inc | Closed loop backdrilling system |
| US7096555B2 (en) * | 2003-09-19 | 2006-08-29 | Viasystems Group, Inc. | Closed loop backdrilling system |
| JP2007509487A (en) * | 2003-09-19 | 2007-04-12 | ヴァイアシステムズ グループ インコーポレイテッド | Closed loop back drilling system |
| CN106624012A (en) * | 2016-12-29 | 2017-05-10 | 安徽深泽电子科技有限公司 | Manufacturing method of short slotted hole on PCB (Printed Circuit Board) |
| US11690177B2 (en) | 2020-04-07 | 2023-06-27 | Nextgin Technology Bv | Methods and systems for back-drilling a multi-layer circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3404771B2 (en) | 2003-05-12 |
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