JP2021502763A - アディティブ製造技術(amt)低プロファイル放射器 - Google Patents
アディティブ製造技術(amt)低プロファイル放射器 Download PDFInfo
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- JP2021502763A JP2021502763A JP2020525916A JP2020525916A JP2021502763A JP 2021502763 A JP2021502763 A JP 2021502763A JP 2020525916 A JP2020525916 A JP 2020525916A JP 2020525916 A JP2020525916 A JP 2020525916A JP 2021502763 A JP2021502763 A JP 2021502763A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/106—Microstrip slot antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/001—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems for modifying the directional characteristic of an aerial
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/008—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0075—Stripline fed arrays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
前記ボウタイスロットアパーチャに近接して配置された少なくとも1つのファラデー壁;を有する。
また、ミリング操作を行って、垂直送出開口部の周囲の領域で接地面40内にパッドを形成する。このミリング操作は、接合されたアセンブリの接地面側で行われる(すなわち、ミリングは、接地面導体40が配置される接合されたアセンブリと同じ側で行われる)。
Claims (11)
- アディティブ製造技術(AMT)を用いて製造されるアンテナ素子であって:
対向する第1表面及び第2表面を有する基板であり、前記第1表面に設けられたミリングされたボウタイスロットアパーチャを有する基板;及び
前記ボウタイスロットアパーチャに近接して配置された少なくとも1つのファラデー壁;
を有するアンテナ素子。 - 前記少なくとも1つのファラデー壁は、複数のファラデー壁の第1ファラデー壁及び第2ファラデー壁を含む、請求項1に記載のアンテナ素子。
- 前記複数のファラデー壁は、前記ボウタイスロットアパーチャに対して対称的に配置され、前記複数のファラデー壁のうちの第1ファラデー壁が前記ボウタイスロットアパーチャの両側に対称的に配置された第1組の同調素子を形成し、前記複数のファラデー壁のうちの第2ファラデー壁が前記ボウタイスロットアパーチャの両側に対称的に配置された第2組の同調素子を形成する、請求項2に記載のアンテナ素子。
- 請求項3に記載のアンテナ素子であって、
前記基板の前記第1表面から前記第2表面まで延びる垂直送出と、前記ミリングされたアパーチャのスロット部分を横切って配置されたフィードラインとを備える供給回路をさらに備える、アンテナ素子。 - 請求項4に記載のアンテナ素子であって、
前記供給回路は、前記第1組の同調素子と前記第2組の同調素子との間に配置される、アンテナ素子。 - アンテナアセンブリであって:
対向する第1表面及び第2表面を有する基板であり、前記第1表面に設けられたミリングされたアパーチャを有する基板;
前記ミリングされたアパーチャの両側に対称的に配置された第1組の同調素子;
前記ミリングされたアパーチャの両側に対称的に配置された第2組の同調素子;及び
前記基板の前記第1表面から前記第2表面まで延びる垂直送出と、前記ミリングされたアパーチャのスロット部分を横切って配置されたフィードラインとを備える供給回路;
を備えるアンテナアセンブリ。 - 複数のアンテナアセンブリを備えたアレイアンテナであって、各アンテナアセンブリが請求項6に記載のアンテナアセンブリを具現化したものである、アレイアンテナ。
- 4つのアンテナアセンブリを含む、請求項7に記載のアレイアンテナであって:
第1アンテナアセンブリの第1組の同調素子と第2アンテナアセンブリの第1組の同調素子とが、第3アンテナアセンブリの第2組の同調素子と第4アンテナアセンブリの第2組の同調素子とにそれぞれ近接している、アレイアンテナ。 - ボウタイスロットアンテナを製造するためのアディティブ製造方法であって:
(a)二重クラッド誘電体基板の第1表面から銅をミリングして、アパーチャを形成するステップ;
(b)前記二重クラッド誘電体基板の対向する第2表面から銅をミリングして、アパーチャのためのフィードラインを形成するステップ;
(c)前記二重クラッド誘電体基板を、第2基板の第1表面に接合するステップであり、前記第2基板の第2表面上に接地面導体が配置されており、接合されたアセンブリを形成するステップ;
(d)前記接合されたアセンブリをミリングして、前記アパーチャに近接するファラデー壁のための少なくとも1つの開口部を形成するステップ;及び
(e)前記少なくとも1つの開口部を導電性液体で充填し、ファラデー壁を形成するステップ;
を含む方法。 - 請求項9に記載の方法であって、
前記接合されたアセンブリをミリングして、垂直信号経路のための少なくとも1つの開口部を形成し、前記垂直信号経路のために前記少なくとも1つの開口部を充填するステップ;
をさらに含む方法。 - 請求項10に記載の方法であって、
前記導電性液体は、導電性インクである、方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762584264P | 2017-11-10 | 2017-11-10 | |
US201762584300P | 2017-11-10 | 2017-11-10 | |
US62/584,300 | 2017-11-10 | ||
US62/584,264 | 2017-11-10 | ||
PCT/US2018/059240 WO2019094337A1 (en) | 2017-11-10 | 2018-11-05 | Additive manufacturing technology (amt) low profile radiator |
Publications (2)
Publication Number | Publication Date |
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JP2021502763A true JP2021502763A (ja) | 2021-01-28 |
JP6976433B2 JP6976433B2 (ja) | 2021-12-08 |
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JP2020525916A Active JP6976433B2 (ja) | 2017-11-10 | 2018-11-05 | アディティブ製造技術(amt)低プロファイル放射器 |
JP2020526003A Active JP7014907B2 (ja) | 2017-11-10 | 2018-11-07 | ロープロファイルフェーズドアレイ |
JP2022007004A Active JP7365436B2 (ja) | 2017-11-10 | 2022-01-20 | ロープロファイルフェーズドアレイ |
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JP2020526003A Active JP7014907B2 (ja) | 2017-11-10 | 2018-11-07 | ロープロファイルフェーズドアレイ |
JP2022007004A Active JP7365436B2 (ja) | 2017-11-10 | 2022-01-20 | ロープロファイルフェーズドアレイ |
Country Status (7)
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US (3) | US11121474B2 (ja) |
EP (3) | EP3707777B1 (ja) |
JP (3) | JP6976433B2 (ja) |
KR (2) | KR102545915B1 (ja) |
CN (2) | CN111602299B (ja) |
SG (2) | SG11202004215XA (ja) |
WO (2) | WO2019094337A1 (ja) |
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US11145952B2 (en) * | 2019-11-14 | 2021-10-12 | Raytheon Company | Advanced communications array |
KR102305663B1 (ko) * | 2020-09-04 | 2021-09-28 | 주식회사 넥스웨이브 | 트렌치 구조를 이용한 안테나 패키지 및 이의 검사방법 |
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US11158955B2 (en) | 2021-10-26 |
WO2019094337A8 (en) | 2020-05-28 |
CN111566874B (zh) | 2023-06-27 |
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EP3707777A1 (en) | 2020-09-16 |
SG11202004211WA (en) | 2020-06-29 |
KR102545915B1 (ko) | 2023-06-22 |
EP4235951A2 (en) | 2023-08-30 |
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US20220052460A1 (en) | 2022-02-17 |
JP7014907B2 (ja) | 2022-02-01 |
JP6976433B2 (ja) | 2021-12-08 |
JP2021502768A (ja) | 2021-01-28 |
SG11202004215XA (en) | 2020-06-29 |
EP4235951A3 (en) | 2023-09-06 |
WO2019094452A1 (en) | 2019-05-16 |
KR102332713B1 (ko) | 2021-12-02 |
EP3707778A1 (en) | 2020-09-16 |
US20190148837A1 (en) | 2019-05-16 |
US20190148828A1 (en) | 2019-05-16 |
US11121474B2 (en) | 2021-09-14 |
CN111602299B (zh) | 2023-04-14 |
JP7365436B2 (ja) | 2023-10-19 |
CN111602299A (zh) | 2020-08-28 |
US12021306B2 (en) | 2024-06-25 |
CN111566874A (zh) | 2020-08-21 |
WO2019094337A1 (en) | 2019-05-16 |
EP3707777B1 (en) | 2023-05-24 |
JP2022058679A (ja) | 2022-04-12 |
KR20200079320A (ko) | 2020-07-02 |
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