JP7175317B2 - スナップ無線周波数コネクタ相互接続体 - Google Patents
スナップ無線周波数コネクタ相互接続体 Download PDFInfo
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- JP7175317B2 JP7175317B2 JP2020542982A JP2020542982A JP7175317B2 JP 7175317 B2 JP7175317 B2 JP 7175317B2 JP 2020542982 A JP2020542982 A JP 2020542982A JP 2020542982 A JP2020542982 A JP 2020542982A JP 7175317 B2 JP7175317 B2 JP 7175317B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Adornments (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Multi-Conductor Connections (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Structure Of Printed Boards (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Description
基板; 該基板上に配置された第1接地平面; 第1接点を有する信号導体であり、該第1接点が第2接点と電気的に結合するように構成されている、信号導体;及び 第2接地境界と電気的に結合するように構成されている第1接地境界であり、前記基板内で電気的に連続した導体として形成されている第1接地境界;を含む。
Claims (9)
- 第1コネクタと第2コネクタとを含む無線周波数相互接続構造であり:
前記第1コネクタが、
第1表面及び該第1表面に対向する第2表面を有する第1基板;
該第1基板内部に形成された第1信号トレース及び第1端子パッド;
前記第1基板の前記第1表面上に配置された第1接地平面;
一端において前記第1端子パッドに結合され、他端において前記第1基板の前記第2表面上に配置された第1接点を有する第1信号導体;及び
前記第1基板の前記第1表面と前記第2表面との間に配置され、前記第1基板内で電気的に連続した導体として前記第1信号導体、前記第1信号トレース及び前記第1端子パッドを包囲して形成されている第1接地境界;
を備え、
前記第2コネクタが、
第1表面及び該第1表面に対向する第2表面を有する第2基板;
該第2基板内部に形成された第2信号トレース及び第2端子パッド;
前記第2基板の前記第1表面上に配置された第2接地平面;
一端において前記第2端子パッドに結合され、他端において前記第1コネクタの前記第1接点と電気的に結合するように構成されている第2接点を有する第2信号導体;及び
前記第2基板の前記第1表面と前記第2表面との間に配置され、前記第2基板内で電気的に連続した導体として前記第2信号導体、前記第2信号トレース及び前記第2端子パッドを包囲して形成されている第2接地境界であり、前記第1接地境界と電気的に結合するように構成されている第2接地境界;
を備える、
無線周波数相互接続構造。 - 前記第1コネクタの前記第1接点及び前記第2コネクタの前記第2接点を整合させるように構成されている整合要素をさらに備える、請求項1に記載の無線周波数相互接続構造。
- 前記第1コネクタの前記第1接点と前記第2コネクタの前記第2接点との間の結合接点を固定するように構成されている結合要素をさらに備える、請求項1又は2に記載の無線周波数相互接続構造。
- 前記結合要素は磁気要素である請求項3に記載の無線周波数相互接続構造。
- 無線周波数コネクタを製造する方法であって:
第1基板上に配置された導電性材料をミリングするステップであり、端子パッドを含む信号トレースを形成する、ステップ;
前記第1基板に第2基板をボンディングするステップであり、前記第1基板と前記第2基板との間に前記信号トレース及び前記端子パッドを実質的に封入する、ステップ;
前記第2基板にドリリングするステップであり、前記端子パッドへのアクセス孔をもたらす、ステップ;
前記第1基板及び前記第2基板を通してミリングするステップであり、少なくとも部分的に前記端子パッドの周囲に位置するトレンチを形成する、ステップ;
前記アクセス孔内に導体を堆積させるステップであり、前記導体が一端において前記端子パッドに電気的に接続され他端において前記第2基板の表面上に配置される第1接点を有し、前記第1接点は他の基板の第2接点に電気的に結合するように構成されている、ステップ;及び
前記トレンチ内に導電性インクを堆積するステップであり、前記第1基板及び前記第2基板内に前記導体、前記信号トレース及び前記端子パッドを包囲する電気的に連続した導電性インクを形成する、ステップ;
を含む方法。 - 前記端子パッド上にハンダバンプを堆積するステップをさらに含む、請求項5に記載の方法。
- 前記アクセス孔において前記導体にハンダ/リフローを適用するステップをさらに含む、請求項5又は6に記載の方法。
- 前記第1基板及び前記第2基板を通してミリングするステップは、実質的に接地面を貫通することなく前記接地面へとミリングするステップを含む、請求項5乃至7のいずれか1項に記載の方法。
- 前記導体が接地面に電気的に接続されるように、前記導電性インクが、前記接地面に接触して配置される、請求項5乃至8のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862636364P | 2018-02-28 | 2018-02-28 | |
US62/636,364 | 2018-02-28 | ||
PCT/US2019/019847 WO2019168992A1 (en) | 2018-02-28 | 2019-02-27 | Snap-rf interconnections |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021513746A JP2021513746A (ja) | 2021-05-27 |
JP7175317B2 true JP7175317B2 (ja) | 2022-11-18 |
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Application Number | Title | Priority Date | Filing Date |
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JP2020542982A Active JP7175317B2 (ja) | 2018-02-28 | 2019-02-27 | スナップ無線周波数コネクタ相互接続体 |
Country Status (9)
Country | Link |
---|---|
US (2) | US10849219B2 (ja) |
EP (1) | EP3760014B1 (ja) |
JP (1) | JP7175317B2 (ja) |
KR (1) | KR102443287B1 (ja) |
AU (1) | AU2019228500B2 (ja) |
CA (1) | CA3087081A1 (ja) |
IL (2) | IL308118A (ja) |
TW (1) | TWI785211B (ja) |
WO (1) | WO2019168992A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11158920B2 (en) * | 2016-04-26 | 2021-10-26 | Ttm Technologies Inc. | High powered RF part for improved manufacturability |
CN111602299B (zh) | 2017-11-10 | 2023-04-14 | 雷神公司 | 增材制造技术(amt)薄型辐射器 |
US11289814B2 (en) | 2017-11-10 | 2022-03-29 | Raytheon Company | Spiral antenna and related fabrication techniques |
US11089687B2 (en) | 2018-02-28 | 2021-08-10 | Raytheon Company | Additive manufacturing technology (AMT) low profile signal divider |
AU2019228500B2 (en) | 2018-02-28 | 2023-07-20 | Raytheon Company | Snap-RF interconnections |
US11705390B2 (en) * | 2019-03-27 | 2023-07-18 | Intel Corporation | Variable in-plane signal to ground reference configurations |
GB2582656A (en) * | 2019-03-29 | 2020-09-30 | Sony Semiconductor Solutions Corp | Substrate integrated waveguide signal level control element and signal processing circuitry |
JP6687302B1 (ja) * | 2019-04-08 | 2020-04-22 | 三菱電機株式会社 | 高周波回路及び通信モジュール |
US11089673B2 (en) | 2019-07-19 | 2021-08-10 | Raytheon Company | Wall for isolation enhancement |
US11171101B2 (en) | 2020-03-31 | 2021-11-09 | Raytheon Company | Process for removing bond film from cavities in printed circuit boards |
WO2021230215A1 (ja) * | 2020-05-13 | 2021-11-18 | 住友電工プリントサーキット株式会社 | 高周波回路 |
US11317502B2 (en) * | 2020-05-15 | 2022-04-26 | Raytheon Company | PCB cavity mode suppression |
US20230309215A1 (en) * | 2020-09-03 | 2023-09-28 | Telefonaktiebolaget Lm Ericsson (Publ) | Printed circuit board to printed circuit board radio frequency interface |
KR20220099059A (ko) * | 2021-01-05 | 2022-07-12 | 주식회사 엘지에너지솔루션 | 연결 구조 |
US11973268B2 (en) * | 2021-05-03 | 2024-04-30 | Aptiv Technologies AG | Multi-layered air waveguide antenna with layer-to-layer connections |
CN114025465B (zh) * | 2021-09-27 | 2024-06-18 | 中国航空无线电电子研究所 | 一种带隔离结构的pcb板 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277661A (ja) | 1999-03-23 | 2000-10-06 | Nec Corp | 多層基板 |
JP2004311870A (ja) | 2003-04-10 | 2004-11-04 | Mitsubishi Electric Corp | 多層プリント配線板 |
JP2004311786A (ja) | 2003-04-08 | 2004-11-04 | Shinko Electric Ind Co Ltd | 配線基板、多層配線基板、配線基板の製造方法及び多層配線基板の製造方法 |
JP2005531155A (ja) | 2002-06-27 | 2005-10-13 | レイセオン・カンパニー | 多層ストリップライン無線周波数回路および相互接続方法 |
JP2008042028A (ja) | 2006-08-08 | 2008-02-21 | Advantest Corp | 配線基板 |
US20100206617A1 (en) | 2009-02-17 | 2010-08-19 | Lockheed Martin Corporation | Electrical isolating structure for conductors in a substrate |
JP2016072514A (ja) | 2014-09-30 | 2016-05-09 | 日本オクラロ株式会社 | 光モジュール、光送受信モジュール、プリント基板、及びフレキシブル基板 |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2938175A (en) * | 1955-01-06 | 1960-05-24 | Sanders Associates Inc | Transducer for high frequency transmission line |
JPH0812887B2 (ja) | 1985-04-13 | 1996-02-07 | 富士通株式会社 | 高速集積回路パツケ−ジ |
JPH04267586A (ja) * | 1991-02-22 | 1992-09-24 | Nec Corp | 同軸配線パターンおよびその形成方法 |
JPH04282582A (ja) * | 1991-03-09 | 1992-10-07 | Canon Inc | 電気回路部品の接続方法 |
US5677515A (en) * | 1991-10-18 | 1997-10-14 | Trw Inc. | Shielded multilayer printed wiring board, high frequency, high isolation |
JP3241139B2 (ja) | 1993-02-04 | 2001-12-25 | 三菱電機株式会社 | フィルムキャリア信号伝送線路 |
US5401912A (en) * | 1993-06-07 | 1995-03-28 | St Microwave Corp., Arizona Operations | Microwave surface mount package |
US5401175A (en) * | 1993-06-25 | 1995-03-28 | M/A-Com, Inc. | Magnetic coaxial connector |
JP4195731B2 (ja) * | 1996-07-25 | 2008-12-10 | 富士通株式会社 | 多層プリント板及びこれを利用した高周波回路装置 |
US5857858A (en) | 1996-12-23 | 1999-01-12 | General Electric Company | Demountable and repairable low pitch interconnect for stacked multichip modules |
JPH10200311A (ja) | 1997-01-14 | 1998-07-31 | Nec Corp | 裏面接地導体付きコプレーナウエーブガイド線路 |
JP3687041B2 (ja) | 1997-04-16 | 2005-08-24 | 大日本印刷株式会社 | 配線基板、配線基板の製造方法、および半導体パッケージ |
US6000120A (en) | 1998-04-16 | 1999-12-14 | Motorola, Inc. | Method of making coaxial transmission lines on a printed circuit board |
US6137453A (en) | 1998-11-19 | 2000-10-24 | Wang Electro-Opto Corporation | Broadband miniaturized slow-wave antenna |
JP3710652B2 (ja) | 1999-08-03 | 2005-10-26 | 三菱電機株式会社 | ストリップライン給電装置 |
JP3487283B2 (ja) | 2000-10-31 | 2004-01-13 | 三菱電機株式会社 | 差動ストリップ線路垂直変換器および光モジュール |
US6651322B1 (en) | 2000-12-28 | 2003-11-25 | Unisys Corporation | Method of reworking a multilayer printed circuit board assembly |
US6624787B2 (en) | 2001-10-01 | 2003-09-23 | Raytheon Company | Slot coupled, polarized, egg-crate radiator |
US6747217B1 (en) | 2001-11-20 | 2004-06-08 | Unisys Corporation | Alternative to through-hole-plating in a printed circuit board |
US20030188889A1 (en) | 2002-04-09 | 2003-10-09 | Ppc Electronic Ag | Printed circuit board and method for producing it |
JP4159378B2 (ja) | 2002-04-25 | 2008-10-01 | 三菱電機株式会社 | 高周波装置とその製造方法 |
JP4059085B2 (ja) | 2003-01-14 | 2008-03-12 | 松下電器産業株式会社 | 高周波積層部品およびその製造方法 |
DE10309075A1 (de) | 2003-03-03 | 2004-09-16 | Robert Bosch Gmbh | Planare Antennenanordnung |
US6937120B2 (en) | 2003-04-02 | 2005-08-30 | Harris Corporation | Conductor-within-a-via microwave launch |
US7315223B2 (en) * | 2004-06-30 | 2008-01-01 | Emag Technologies, Inc. | Microstrip-to-microstrip RF transition including co-planar waveguide connected by vias |
US20060044083A1 (en) | 2004-08-27 | 2006-03-02 | Maksim Kuzmenka | Circuit board and method for producing a circuit board |
JP4498258B2 (ja) | 2005-10-13 | 2010-07-07 | 富士通オプティカルコンポーネンツ株式会社 | コイルパッケージ |
US7405477B1 (en) | 2005-12-01 | 2008-07-29 | Altera Corporation | Ball grid array package-to-board interconnect co-design apparatus |
JP2007193999A (ja) | 2006-01-17 | 2007-08-02 | Sony Chemical & Information Device Corp | 伝送ケーブル |
DE102007028799A1 (de) | 2007-06-19 | 2008-12-24 | Technische Universität Ilmenau | Impedanzkontrolliertes koplanares Wellenleitersystem zur dreidimensionalen Verteilung von Signalen hoher Bandbreite |
JP5397225B2 (ja) * | 2007-10-25 | 2014-01-22 | 日本電気株式会社 | 高周波基板および、これを用いた高周波モジュール |
KR100999529B1 (ko) * | 2008-09-04 | 2010-12-08 | 삼성전기주식회사 | 마이크로 스트립 라인을 구비한 인쇄회로기판, 스트립라인을 구비한 인쇄회로기판 및 그들의 제조 방법 |
KR101119267B1 (ko) | 2010-04-13 | 2012-03-16 | 고려대학교 산학협력단 | 매칭 기판을 이용한 유전체 공진기 안테나 |
CN201845850U (zh) | 2010-09-30 | 2011-05-25 | 安徽博微长安电子有限公司 | 多路微波大功率分配合成器 |
US20130154773A1 (en) | 2011-12-15 | 2013-06-20 | Infineon Technologies Ag | Waveguide |
KR20160010469A (ko) | 2013-04-24 | 2016-01-27 | 가부시키가이샤 쇼난 고세이쥬시 세이사쿠쇼 | 신호 전송용 플랫 케이블 |
US9374910B2 (en) | 2013-12-31 | 2016-06-21 | International Business Machines Corporation | Printed circuit board copper plane repair |
US10033080B2 (en) | 2014-05-07 | 2018-07-24 | Alcatel Lucent | Electrochromic cell for radio-frequency applications |
US10086432B2 (en) | 2014-12-10 | 2018-10-02 | Washington State University | Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces |
US9893426B2 (en) | 2015-10-26 | 2018-02-13 | Verizon Patent And Licensing Inc. | PCB embedded radiator antenna with exposed tuning stub |
US10144635B2 (en) * | 2016-09-20 | 2018-12-04 | Kris Vossough | Integrated multi-sensing systems |
CN106936521B (zh) | 2017-01-12 | 2020-04-28 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 紧凑型天线馈电校准网络 |
US10505255B2 (en) | 2017-01-30 | 2019-12-10 | Infineon Technologies Ag | Radio frequency device packages and methods of formation thereof |
CN206742473U (zh) | 2017-05-31 | 2017-12-12 | 中国电子科技集团公司第十三研究所 | 抗电磁干扰的微波功率分配器 |
CN111788737B (zh) | 2017-11-10 | 2022-11-15 | 雷神公司 | 毫米波传输线架构 |
US10813210B2 (en) | 2017-11-10 | 2020-10-20 | Raytheon Company | Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion |
AU2019228500B2 (en) | 2018-02-28 | 2023-07-20 | Raytheon Company | Snap-RF interconnections |
WO2019226635A1 (en) | 2018-05-22 | 2019-11-28 | Raytheon Company | Millimeter wave phased array |
-
2019
- 2019-02-27 AU AU2019228500A patent/AU2019228500B2/en active Active
- 2019-02-27 US US16/287,240 patent/US10849219B2/en active Active
- 2019-02-27 EP EP19710905.1A patent/EP3760014B1/en active Active
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-
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- 2020-08-16 IL IL276728A patent/IL276728A/en unknown
- 2020-11-06 US US17/091,585 patent/US11375609B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277661A (ja) | 1999-03-23 | 2000-10-06 | Nec Corp | 多層基板 |
JP2005531155A (ja) | 2002-06-27 | 2005-10-13 | レイセオン・カンパニー | 多層ストリップライン無線周波数回路および相互接続方法 |
JP2004311786A (ja) | 2003-04-08 | 2004-11-04 | Shinko Electric Ind Co Ltd | 配線基板、多層配線基板、配線基板の製造方法及び多層配線基板の製造方法 |
JP2004311870A (ja) | 2003-04-10 | 2004-11-04 | Mitsubishi Electric Corp | 多層プリント配線板 |
JP2008042028A (ja) | 2006-08-08 | 2008-02-21 | Advantest Corp | 配線基板 |
US20100206617A1 (en) | 2009-02-17 | 2010-08-19 | Lockheed Martin Corporation | Electrical isolating structure for conductors in a substrate |
JP2016072514A (ja) | 2014-09-30 | 2016-05-09 | 日本オクラロ株式会社 | 光モジュール、光送受信モジュール、プリント基板、及びフレキシブル基板 |
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IL276728A (en) | 2020-09-30 |
TW201944649A (zh) | 2019-11-16 |
EP3760014A1 (en) | 2021-01-06 |
US20190269007A1 (en) | 2019-08-29 |
KR20200094196A (ko) | 2020-08-06 |
KR102443287B1 (ko) | 2022-09-19 |
JP2021513746A (ja) | 2021-05-27 |
CA3087081A1 (en) | 2019-09-06 |
EP3760014B1 (en) | 2022-09-28 |
US20210059043A1 (en) | 2021-02-25 |
TWI785211B (zh) | 2022-12-01 |
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AU2019228500A1 (en) | 2020-07-09 |
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