JP2017090067A - 検査用配線基板 - Google Patents
検査用配線基板 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 claims abstract description 41
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 239000003990 capacitor Substances 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims description 100
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- 238000012360 testing method Methods 0.000 claims description 53
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- 238000000034 method Methods 0.000 description 21
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- 239000010949 copper Substances 0.000 description 7
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
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- 229910052709 silver Inorganic materials 0.000 description 4
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- 229910052710 silicon Inorganic materials 0.000 description 3
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
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- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 229910052718 tin Inorganic materials 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
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- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
【解決手段】この検査用配線基板21は、セラミック多層基板31の主面上に、オーガニック配線構造部41を設けてなる。オーガニック配線構造部41を構成する複数の内層導体層51は、第1プレーン層P11〜P13と第2プレーン層P2とを含む。第1プレーン層P11〜P13は、同一層内にて複数エリアに分割される。第2プレーン層P2は、層内での面積が第1プレーン層P11〜P13よりも大きい。一部のコンデンサ接続用の接続パッド61及び複数の検査パッド群64毎の一部の検査パッド62が、最外層の第1プレーン層P11を介して電気的に接続される。
【選択図】図4
Description
(2)また、セラミック多層基板31をベースとしてその上にオーガニック配線構造部41を設けた構造であることから、オーガニック多層配線基板のみからなる従来のものとは異なり、基板全体として耐熱性や剛性が向上する。よって、シリコンとの熱膨張係数差が小さくなり、熱ストレスをかけた条件下での電気検査の際でも、検査パッド62上のプローブ67が半導体素子側の接続端子から位置ずれしにくくなる。従って、このような条件下での一括検査を確実に行うことができる。さらに、剛性の向上によって一括検査の際でも基板が撓みにくくなり、試験対象となる半導体素子の位置の如何を問わず、検査パッド62上のプローブ67を確実に半導体素子側の接続端子に接触させることができる。よって、この場合も同様に、一括検査を確実に行うことができる。しかも、上記従来技術の検査用配線基板に比べて、検査対象となる半導体素子の数を増やすことが可能となる。
(2)上記手段1において、前記第1プレーン層よりも外層側に少なくとも1層の前記第2プレーン層が配置されていること。
(3)上記手段1において、前記第1プレーン層は、低電圧電源電流用のパワープレーン層と、中電圧電源電流用のパワープレーン層と、高電圧電源電流用のパワープレーン層とを含むこと。
(4)上記(3)において、前記低電圧電源電流用のパワープレーン層は、2層以上存在すること。
(5)上記手段1において、前記樹脂絶縁層は樹脂フィルムを用いて形成されたものであること。
(6)上記手段1において、前記樹脂絶縁層の形成に用いられる樹脂フィルムは厚さが20μm〜40μmであること。
(7)上記手段1において、前記樹脂絶縁層の形成に用いられる樹脂フィルムはポリイミドフィルムであり、前記内層導体層は銅箔に由来する銅層であること。
(8)上記手段1において、前記接続パッドは前記検査パッドよりも面積が大きく、前記検査パッド上にはプローブが立設可能であること。
(9)上記手段1において、前記検査パッドは基板中央部に配置され、前記接続パッド群は基板外周部に配置されていること。
(10)上記手段1において、前記オーガニック配線構造部内のビアピッチは、前記セラミック多層基板内のビアピッチよりも小さいこと。
31…セラミック多層基板
32…主面
33…セラミック層
34…導体層
41…オーガニック配線構造部
42…表面
61…接続パッド
62…検査パッド
64…検査パッド群
43,44,45,46,47,48,49…樹脂絶縁層
51…内層導体層
P11…最外層の第1プレーン層としての最外層のパワー用のプレーン層
P12,P13…第1プレーン層としてのパワー用のプレーン層
P2…第2プレーン層としてのグランド用のプレーン層
Claims (4)
- 複数のセラミック層と複数の導体層とが交互に積層されてなるセラミック多層基板の主面上にオーガニック配線構造部が設けられ、前記オーガニック配線構造部の表面上に、コンデンサ接続用の複数の接続パッド及び複数の検査パッドからなる半導体素子検査用の複数の検査パッド群がそれぞれ形成され、複数の半導体素子の一括検査に使用可能な配線基板であって、
前記オーガニック配線構造部は、複数の樹脂絶縁層と複数の内層導体層とが交互に積層されてなるとともに、最表層が前記樹脂絶縁層により構成され、
前記複数の内層導体層には、同一層内にて複数エリアに分割された状態で配置された第1プレーン層と、前記第1プレーン層とは異なる層に配置されかつ当該層内での面積が前記第1プレーン層よりも大きい第2プレーン層とが含まれ、
少なくとも一部の前記接続パッド及び前記複数の検査パッド群毎の少なくとも一部の前記検査パッドが、複数層ある前記第1プレーン層のうち最外層の第1プレーン層を介して電気的に接続されている
ことを特徴とする検査用配線基板。 - 前記第1プレーン層はパワー用のプレーン層であり、前記第2プレーン層はグランド用のプレーン層であることを特徴とする請求項1に記載の検査用配線基板。
- 前記最外層の第1プレーン層は、複数層ある前記パワー用のプレーン層のうち最も低電圧の電源電流が流されるものであることを特徴とする請求項1または2に記載の検査用配線基板。
- 前記接続パッド及び前記複数の検査パッド群毎の前記検査パッドは、前記最外層の第1プレーン層のうち互いに異なるエリアの部分を介して、電気的に接続されていることを特徴とする請求項1乃至3のいずれか1項に記載の検査用配線基板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015216205A JP6691762B2 (ja) | 2015-11-03 | 2015-11-03 | 検査用配線基板 |
KR1020160138550A KR101926922B1 (ko) | 2015-11-03 | 2016-10-24 | 검사용 배선기판 |
EP16195614.9A EP3165932B1 (en) | 2015-11-03 | 2016-10-25 | Wiring board for device testing |
TW105134917A TWI639835B (zh) | 2015-11-03 | 2016-10-28 | 檢查用配線基板 |
US15/340,279 US9903887B2 (en) | 2015-11-03 | 2016-11-01 | Wiring board for device testing |
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JP2015216205A JP6691762B2 (ja) | 2015-11-03 | 2015-11-03 | 検査用配線基板 |
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JP2017090067A true JP2017090067A (ja) | 2017-05-25 |
JP6691762B2 JP6691762B2 (ja) | 2020-05-13 |
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US (1) | US9903887B2 (ja) |
EP (1) | EP3165932B1 (ja) |
JP (1) | JP6691762B2 (ja) |
KR (1) | KR101926922B1 (ja) |
TW (1) | TWI639835B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019012758A (ja) * | 2017-06-29 | 2019-01-24 | 京セラ株式会社 | 回路基板およびプローブカード |
JP2019016741A (ja) * | 2017-07-10 | 2019-01-31 | 株式会社村田製作所 | 配線基板、プローブカード、及び、配線基板の製造方法 |
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EP3165932B1 (en) | 2019-09-25 |
US9903887B2 (en) | 2018-02-27 |
TW201723493A (zh) | 2017-07-01 |
EP3165932A1 (en) | 2017-05-10 |
JP6691762B2 (ja) | 2020-05-13 |
US20170122981A1 (en) | 2017-05-04 |
KR20170052471A (ko) | 2017-05-12 |
KR101926922B1 (ko) | 2018-12-07 |
TWI639835B (zh) | 2018-11-01 |
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