JP2016092138A - 電子部品の実装構造 - Google Patents
電子部品の実装構造 Download PDFInfo
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- JP2016092138A JP2016092138A JP2014223380A JP2014223380A JP2016092138A JP 2016092138 A JP2016092138 A JP 2016092138A JP 2014223380 A JP2014223380 A JP 2014223380A JP 2014223380 A JP2014223380 A JP 2014223380A JP 2016092138 A JP2016092138 A JP 2016092138A
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- electronic component
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- heat dissipation
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 50
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 4
- 239000011800 void material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】電子部品パッケージ1の端子2を、電子基板3のランド4に重ねてリフロー方式でハンダ接合すると共に、上記電子部品パッケージ1の底面に設けられたチップ放熱用部材5を上記電子基板3の放熱金属パターン6に重ねてリフロー方式でハンダ接合する電子部品の実装構造に関する。
上記チップ放熱用部材5は、上記電子部品パッケージ1を構成するパッケージ用樹脂によって四方を囲まれる大きさに形成される。
上記放熱金属パターン6は、少なくともその一部が上記電子部品パッケージ1よりも大きくなるように、放熱金属パターン6と連続して電子部品パッケージ1からハミ出すように延びて余剰のハンダ21を電子部品パッケージ1の外部へ導くパターン延長部22を一体に有する。
【選択図】図1
Description
即ち、例えば、チップ放熱用部材5と放熱金属パターン6とを接合するハンダの量が多過ぎる場合に、電子部品パッケージ1からハミ出した余剰のハンダが、電子部品パッケージ1の側辺部からランダムに飛び出してハンダボール13などとなり、端子2やランド4などと接触してショートを引き起こすおそれがある。
電子部品パッケージの側辺部から突設された端子を、電子基板上に設けられたランドに重ねてリフロー方式でハンダ接合すると共に、前記電子部品パッケージの底面に設けられたチップ放熱用部材を前記電子基板上に設けられた放熱金属パターンに重ねてリフロー方式でハンダ接合する電子部品の実装構造において、
前記チップ放熱用部材は、前記電子部品パッケージを構成するパッケージ用樹脂によって四方を囲まれる大きさに形成されると共に、
前記放熱金属パターンは、少なくともその一部が前記電子部品パッケージよりも大きくなるように、放熱金属パターンと連続して電子部品パッケージからハミ出すように延びて余剰のハンダを電子部品パッケージの外部へ導くパターン延長部を一体に有することを特徴としている。
図1〜図4は、この実施の形態を説明するためのものである。
そして、上記放熱金属パターン6は、少なくともその一部が上記電子部品パッケージ1よりも大きくなるように、放熱金属パターン6と連続して電子部品パッケージ1からハミ出すように延びて余剰のハンダ21を電子部品パッケージ1の外部へ導くパターン延長部22を一体に有するものとする。
または、図2に示すように、上記パターン延長部22は、上記電子部品パッケージ1の上記端子2を設けた側辺部1a〜1d間の角部31a〜31dの位置に設けられるようにする。
1a〜1d 側辺部
2 端子
3 電子基板
4 ランド
5 チップ放熱用部材
6 放熱金属パターン
21 余剰のハンダ
22 パターン延長部
31a〜31d 角部
41 スリット部
Claims (3)
- 電子部品パッケージの側辺部から突設された端子を、電子基板上に設けられたランドに重ねてリフロー方式でハンダ接合すると共に、前記電子部品パッケージの底面に設けられたチップ放熱用部材を前記電子基板上に設けられた放熱金属パターンに重ねてリフロー方式でハンダ接合する電子部品の実装構造において、
前記チップ放熱用部材は、前記電子部品パッケージを構成するパッケージ用樹脂によって四方を囲まれる大きさに形成されると共に、
前記放熱金属パターンは、少なくともその一部が前記電子部品パッケージよりも大きくなるように、放熱金属パターンと連続して電子部品パッケージからハミ出すように延びて余剰のハンダを電子部品パッケージの外部へ導くパターン延長部を一体に有することを特徴とする電子部品の実装構造。 - 請求項1に記載の電子部品の実装構造であって、
前記パターン延長部は、前記電子部品パッケージの前記端子を設けた側辺部とは異なる別の側辺部または角部の位置に設けられたことを特徴とする電子部品の実装構造。 - 請求項1または請求項2に記載の電子部品の実装構造であって、
前記放熱金属パターンおよびパターン延長部に空隙部抑制用のスリット部を設けたことを特徴とする電子部品の実装構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014223380A JP6352149B2 (ja) | 2014-10-31 | 2014-10-31 | 電子部品の実装構造 |
CN201580054489.3A CN108029199B (zh) | 2014-10-31 | 2015-09-04 | 电子部件的贴装结构 |
US15/518,942 US10224261B2 (en) | 2014-10-31 | 2015-09-04 | Electronic component mounting structure |
PCT/JP2015/075194 WO2016067748A1 (ja) | 2014-10-31 | 2015-09-04 | 電子部品の実装構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014223380A JP6352149B2 (ja) | 2014-10-31 | 2014-10-31 | 電子部品の実装構造 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016092138A true JP2016092138A (ja) | 2016-05-23 |
JP2016092138A5 JP2016092138A5 (ja) | 2017-11-24 |
JP6352149B2 JP6352149B2 (ja) | 2018-07-04 |
Family
ID=55857094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014223380A Active JP6352149B2 (ja) | 2014-10-31 | 2014-10-31 | 電子部品の実装構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10224261B2 (ja) |
JP (1) | JP6352149B2 (ja) |
CN (1) | CN108029199B (ja) |
WO (1) | WO2016067748A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018006654A (ja) * | 2016-07-06 | 2018-01-11 | 株式会社デンソー | 電子装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110856338B (zh) * | 2019-10-22 | 2021-03-23 | Tcl华星光电技术有限公司 | 电路板组件及电子设备 |
WO2023070580A1 (zh) * | 2021-10-29 | 2023-05-04 | 京东方科技集团股份有限公司 | 印刷电路板、其维修方法及显示装置 |
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2014
- 2014-10-31 JP JP2014223380A patent/JP6352149B2/ja active Active
-
2015
- 2015-09-04 US US15/518,942 patent/US10224261B2/en active Active
- 2015-09-04 CN CN201580054489.3A patent/CN108029199B/zh active Active
- 2015-09-04 WO PCT/JP2015/075194 patent/WO2016067748A1/ja active Application Filing
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JPH044779U (ja) * | 1990-04-26 | 1992-01-16 | ||
JPH06252285A (ja) * | 1993-02-24 | 1994-09-09 | Fuji Xerox Co Ltd | 回路基板 |
JP3009176U (ja) * | 1994-09-19 | 1995-03-28 | 船井電機株式会社 | プリント回路基板 |
JPH09275247A (ja) * | 1996-04-05 | 1997-10-21 | Denki Kagaku Kogyo Kk | 回路基板及びその製造方法 |
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JP2009105212A (ja) * | 2007-10-23 | 2009-05-14 | Toshiba Corp | プリント配線板および電子機器 |
JP2014075573A (ja) * | 2012-09-14 | 2014-04-24 | Canon Inc | 配線基板およびそれを用いた電子機器 |
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JP2018006654A (ja) * | 2016-07-06 | 2018-01-11 | 株式会社デンソー | 電子装置 |
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WO2016067748A1 (ja) | 2016-05-06 |
CN108029199A (zh) | 2018-05-11 |
US20170243801A1 (en) | 2017-08-24 |
CN108029199B (zh) | 2020-02-21 |
JP6352149B2 (ja) | 2018-07-04 |
US10224261B2 (en) | 2019-03-05 |
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