JP2014204034A - 封止シート貼付け方法および封止シート貼付け装置 - Google Patents

封止シート貼付け方法および封止シート貼付け装置 Download PDF

Info

Publication number: JP2014204034A
Authority: JP; Japan
Prior art keywords: sealing sheet; semiconductor substrate; sticking; sealing; jig
Prior art date: 2013-04-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2013080602A

Other languages

English (en)

Japanese (ja)

Inventor

橋本　淳

Atsushi Hashimoto

淳橋本

伸一郎森

Shinichiro Mori

伸一郎森

山本　雅之

Masayuki Yamamoto

雅之山本

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nitto Seiki Co Ltd

Nitto Denko Corp

Original Assignee

Nitto Seiki Co Ltd

Nitto Denko Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-04-08

Filing date

2013-04-08

Publication date

2014-10-27

2013-04-08 Application filed by Nitto Seiki Co Ltd, Nitto Denko Corp filed Critical Nitto Seiki Co Ltd

2013-04-08 Priority to JP2013080602A priority Critical patent/JP2014204034A/ja

2014-03-17 Priority to SG11201508197UA priority patent/SG11201508197UA/en

2014-03-17 Priority to KR1020157031060A priority patent/KR20150143539A/ko

2014-03-17 Priority to PCT/JP2014/057176 priority patent/WO2014167948A1/ja

2014-03-17 Priority to CN201480019211.8A priority patent/CN105074891A/zh

2014-04-07 Priority to TW103112648A priority patent/TW201501215A/zh

2014-10-27 Publication of JP2014204034A publication Critical patent/JP2014204034A/ja

Status Pending legal-status Critical Current

Links

238000007789 sealing Methods 0.000 title claims abstract description 230
238000000034 method Methods 0.000 title claims abstract description 39
239000000853 adhesive Substances 0.000 title abstract description 10
230000001070 adhesive effect Effects 0.000 title abstract description 10
239000004065 semiconductor Substances 0.000 claims abstract description 160
239000000758 substrate Substances 0.000 claims abstract description 126
230000006837 decompression Effects 0.000 claims abstract description 17
230000007246 mechanism Effects 0.000 claims description 19
230000008569 process Effects 0.000 claims description 17
238000009826 distribution Methods 0.000 claims description 11
239000011342 resin composition Substances 0.000 claims description 9
238000003825 pressing Methods 0.000 claims description 8
238000004026 adhesive bonding Methods 0.000 claims description 2
239000004615 ingredient Substances 0.000 claims description 2
239000010410 layer Substances 0.000 description 32
230000007723 transport mechanism Effects 0.000 description 10
229920005989 resin Polymers 0.000 description 9
239000011347 resin Substances 0.000 description 9
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
229920001187 thermosetting polymer Polymers 0.000 description 6
239000003566 sealing material Substances 0.000 description 4
230000037303 wrinkles Effects 0.000 description 4
230000008602 contraction Effects 0.000 description 3
238000012545 processing Methods 0.000 description 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
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239000002223 garnet Substances 0.000 description 2
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230000032258 transport Effects 0.000 description 2
239000004641 Diallyl-phthalate Substances 0.000 description 1
YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
239000004640 Melamine resin Substances 0.000 description 1
229920000877 Melamine resin Polymers 0.000 description 1
239000004698 Polyethylene Substances 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
229910052581 Si3N4 Inorganic materials 0.000 description 1
229920001807 Urea-formaldehyde Polymers 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000012141 concentrate Substances 0.000 description 1
238000001816 cooling Methods 0.000 description 1
PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
230000007547 defect Effects 0.000 description 1
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230000003028 elevating effect Effects 0.000 description 1
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229910052731 fluorine Inorganic materials 0.000 description 1
239000011737 fluorine Substances 0.000 description 1
239000011888 foil Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
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229910052751 metal Inorganic materials 0.000 description 1
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229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
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229920001296 polysiloxane Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
229920002050 silicone resin Polymers 0.000 description 1
238000004088 simulation Methods 0.000 description 1
239000002356 single layer Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
239000000454 talc Substances 0.000 description 1
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229920002803 thermoplastic polyurethane Polymers 0.000 description 1
238000012546 transfer Methods 0.000 description 1
229920006337 unsaturated polyester resin Polymers 0.000 description 1
239000011800 void material Substances 0.000 description 1
229910052727 yttrium Inorganic materials 0.000 description 1
VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

JP2013080602A 2013-04-08 2013-04-08 封止シート貼付け方法および封止シート貼付け装置 Pending JP2014204034A (ja)

Priority Applications (6)

Application Number	Priority Date	Filing Date	Title
JP2013080602A JP2014204034A (ja)	2013-04-08	2013-04-08	封止シート貼付け方法および封止シート貼付け装置
SG11201508197UA SG11201508197UA (en)	2013-04-08	2014-03-17	Sealing sheet joining method and apparatus for joining sealing sheet
KR1020157031060A KR20150143539A (ko)	2013-04-08	2014-03-17	밀봉 시트 부착 방법 및 밀봉 시트 부착 장치
PCT/JP2014/057176 WO2014167948A1 (ja)	2013-04-08	2014-03-17	封止シート貼付け方法および封止シート貼付け装置
CN201480019211.8A CN105074891A (zh)	2013-04-08	2014-03-17	密封片材粘贴方法和密封片材粘贴装置
TW103112648A TW201501215A (zh)	2013-04-08	2014-04-07	密封片貼附方法及密封片貼附裝置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2013080602A JP2014204034A (ja)	2013-04-08	2013-04-08	封止シート貼付け方法および封止シート貼付け装置

Publications (1)

Publication Number	Publication Date
JP2014204034A true JP2014204034A (ja)	2014-10-27

Family

ID=51689362

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2013080602A Pending JP2014204034A (ja)	2013-04-08	2013-04-08	封止シート貼付け方法および封止シート貼付け装置

Country Status (6)

Country	Link
JP (1)	JP2014204034A (zh)
KR (1)	KR20150143539A (zh)
CN (1)	CN105074891A (zh)
SG (1)	SG11201508197UA (zh)
TW (1)	TW201501215A (zh)
WO (1)	WO2014167948A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7108516B2 (ja) *	2018-10-25	2022-07-28	リンテック株式会社	シート貼付方法
CN114695913A (zh) *	2020-12-30	2022-07-01	上海德迩新能源技术有限公司	密封圈组件、密封圈的装配方法以及治具
CN113380861B (zh) *	2021-05-24	2023-04-18	云谷（固安）科技有限公司	显示面板及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH05291319A (ja)	1992-04-07	1993-11-05	Toshiba Corp	樹脂封止型半導体装置
JP4004755B2 (ja) *	2001-07-17	2007-11-07	シャープ株式会社	半導体パッケージの製造方法および半導体パッケージ
JP4718734B2 (ja) *	2001-09-12	2011-07-06	日機装株式会社	回路素子の実装方法
JP5203593B2 (ja) *	2006-11-02	2013-06-05	リンテック株式会社	貼付用シート
JP5324399B2 (ja) *	2009-11-10	2013-10-23	リンテック株式会社	シート貼付装置及び貼付方法
JP5334135B2 (ja) *	2010-08-20	2013-11-06	ニチゴー・モートン株式会社	積層装置

2013
- 2013-04-08 JP JP2013080602A patent/JP2014204034A/ja active Pending
2014
- 2014-03-17 WO PCT/JP2014/057176 patent/WO2014167948A1/ja active Application Filing
- 2014-03-17 CN CN201480019211.8A patent/CN105074891A/zh active Pending
- 2014-03-17 SG SG11201508197UA patent/SG11201508197UA/en unknown
- 2014-03-17 KR KR1020157031060A patent/KR20150143539A/ko not_active Application Discontinuation
- 2014-04-07 TW TW103112648A patent/TW201501215A/zh unknown

Also Published As

Publication number	Publication date
CN105074891A (zh)	2015-11-18
KR20150143539A (ko)	2015-12-23
WO2014167948A1 (ja)	2014-10-16
SG11201508197UA (en)	2015-11-27
TW201501215A (zh)	2015-01-01

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