Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=51689362

Family Applications (1)

Country Status (6)

Families Citing this family (3)

Family Cites Families (6)

• 2013
  • 2013-04-08 JP JP2013080602A patent/JP2014204034A/ja active Pending
• 2014
  • 2014-03-17 WO PCT/JP2014/057176 patent/WO2014167948A1/ja active Application Filing
  • 2014-03-17 CN CN201480019211.8A patent/CN105074891A/zh active Pending
  • 2014-03-17 SG SG11201508197UA patent/SG11201508197UA/en unknown
  • 2014-03-17 KR KR1020157031060A patent/KR20150143539A/ko not_active Application Discontinuation
  • 2014-04-07 TW TW103112648A patent/TW201501215A/zh unknown

Also Published As

Similar Documents